Abstract: Methods for improving wafer bonding performance are disclosed herein. In some embodiments, a method for bonding a pair of semiconductor substrates is disclosed. The method includes: processing at least one of the pair of semiconductor substrates, and bonding the pair of semiconductor substrates together. Each of the pair of semiconductor substrates is processed by: performing at least one chemical vapor deposition (CVD), and performing at least one chemical mechanical polishing (CMP). One of the at least one CVD is performed after all CMP performed before bonding.

Abstract: An optical image capturing system includes, along the optical axis in order from an object side to an image side, a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens. At least one lens among the first to the sixth lenses has positive refractive force. The seventh lens has negative refractive force. The lenses in the optical image capturing system which have refractive power include the first to the seventh lenses. The optical image capturing system can increase aperture value and improve the imaging quality for use in compact cameras.

Abstract: An uninterruptible power/CATV signal coupler includes a base, a cover, and a bridge connection device. The base forms an accommodation chamber. A cover is detachably connected to the base, and includes a circuit board and two sleeves. The sleeves are connected to one surface of the circuit board. The bridge connection device is contained inside the accommodation chamber and includes a first housing, a second housing, two conductive terminals inserted into the two sleeves respectively, two press elements pressed by the circuit board, a bridge connection element disposed between the first housing and the second housing, and two seesaw elements contact with the bridge connection element. The two seesaw elements are pivotally connected to the second housing. When the bridge connection element are elastically pressed by the press elements respectively, the bridge connection element is disconnected from the conductive terminals and contacts the base.

Abstract: An uninterruptible power/CATV signal coupler includes a base, a cover, and a bridge connection device. The base forms an accommodation chamber. A cover is detachably connected to the base, and includes a circuit board and two sleeves. The sleeves are connected to one surface of the circuit board. The bridge connection device is contained inside the accommodation chamber and includes a first housing, a second housing, two conductive terminals inserted into the two sleeves respectively, two press elements pressed by the circuit board, a bridge connection element disposed between the first housing and the second housing, and two seesaw elements contact with the bridge connection element. The two seesaw elements are pivotally connected to the second housing. When the bridge connection element are elastically pressed by the press elements respectively, the bridge connection element is disconnected from the conductive terminals and contacts the base.