Patents by Inventor Chien-Hsun Pan
Chien-Hsun Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128232Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.Type: ApplicationFiled: December 28, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung-Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan
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Publication number: 20230332322Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.Type: ApplicationFiled: June 23, 2023Publication date: October 19, 2023Inventors: Zong-Kun LIN, Hsuan-Chih CHU, Chien-Hsun PAN, Yen-Yu CHEN, Yi-Ming DAI
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Patent number: 11732379Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.Type: GrantFiled: June 15, 2020Date of Patent: August 22, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Zong-Kun Lin, Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Yi-Ming Dai
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Patent number: 11396695Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.Type: GrantFiled: November 23, 2020Date of Patent: July 26, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Chun-Chih Lin
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Publication number: 20210388524Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.Type: ApplicationFiled: June 15, 2020Publication date: December 16, 2021Inventors: Zong-Kun LIN, Hsuan-Chih CHU, Chien-Hsun PAN, Yen-Yu CHEN, Yi-Ming DAI
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Publication number: 20210071295Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.Type: ApplicationFiled: November 23, 2020Publication date: March 11, 2021Inventors: Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Chun-Chih Lin
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Patent number: 10844477Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.Type: GrantFiled: November 8, 2017Date of Patent: November 24, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Chun-Chih Lin
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Patent number: 10345254Abstract: Detection methods for an electroplating process are provided. A detection method includes immersing a substrate into an electrolyte solution to perform an electroplating process. The electrolyte solution includes an additive agent. The detection method also includes immersing a detection device into the electrolyte solution. The detection method further includes applying a first alternating current (AC) voltage or direct current (DC) voltage to the detection device to detect the concentration of the additive agent. In addition, the detection method includes applying a combination of a second AC voltage and a second DC voltage to the detection device to inspect the electrolyte solution. An impurity is detected in the electrolyte solution. The detection method also includes replacing the electrolyte solution containing the impurity with another electrolyte solution.Type: GrantFiled: August 29, 2017Date of Patent: July 9, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yung-Chang Huang, Jui-Mu Cho, Chien-Hsun Pan, Chun-Chih Lin
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Publication number: 20190136369Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.Type: ApplicationFiled: November 8, 2017Publication date: May 9, 2019Inventors: Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Chun-Chih Lin
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Publication number: 20180372665Abstract: Detection methods for an electroplating process are provided. A detection method includes immersing a substrate into an electrolyte solution to perform an electroplating process. The electrolyte solution includes an additive agent. The detection method also includes immersing a detection device into the electrolyte solution. The detection method further includes applying a first alternating current (AC) or direct current (DC) to the detection device to detect the concentration of the additive agent. In addition, the detection method includes applying a combination of a second AC and a second DC to the detection device to inspect the electrolyte solution. An impurity is detected in the electrolyte solution. The detection method also includes replacing the electrolyte solution containing the impurity with another electrolyte solution.Type: ApplicationFiled: August 29, 2017Publication date: December 27, 2018Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yung-Chang HUANG, Jui-Mu CHO, Chien-Hsun PAN, Chun-Chih LIN
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Publication number: 20080076241Abstract: A method for reducing stress between a conductive layer and a mask layer is provided. The method for reducing stress comprises a step of performing a plasma treatment with a nitrogen-containing gas to modify a surface of the conductive layer prior to the formation of the mask layer upon the surface. The method is useful for the manufacture of a gate, and the method for manufacturing the gate comprises the steps of providing a substrate; and sequentially depositing an oxide layer, a conductive layer, and a mask layer on the substrate to form a gate stack structure. The conductive layer is subjected to a surface plasma treatment with a nitrogen-containing gas prior to depositing the mask layer to modify its surface.Type: ApplicationFiled: December 19, 2006Publication date: March 27, 2008Applicant: Promos Technologies Inc.Inventors: Tsung-Hsun Yang, Hsiao-Che Wu, Feng-Chun Chen, Chien-Hsun Pan