Abstract: A chip deviation correction method for maskless exposure machines includes the steps of calculating the bonding positions of chips on a substrate to define the coordinates of the chips on the substrate, creating a separating boundary among the chips according to the coordinates of the chips on the substrate to form plural of bonding areas for accommodating the chips, calculating a lead wire of the chips in the bonding area and a compensating wire which spans across the separating boundary between each lead wire and the lead wire of the corresponding adjacent chip according to the calculated lead wire; and forming a digital exposed layer according to each of the lead wires and each of the compensating wires.

Abstract: A die shift correction method for use by a maskless exposure machine is applied to a die bonded to a substrate. The substrate has plural contact holes. The die has plural contact points each intended to be subjected to a light exposure in order to form a conductive contact portion connected to the corresponding contact hole. The correction method includes: obtaining the state information of the die by a first pre-scanning means, wherein the state information includes shape and location information; comparing the state information of the die against a reference state, and calculating compensation values with which to correct the reference state and thereby bring the reference state into conformity to the state information of the die; and calculating a compensation section for the light exposure according to the compensation values in order for each conductive contact portion to have an exposure pattern formed at the corresponding contact hole.

Abstract: A die shift correction method for use by a maskless exposure machine is applied to a die bonded to a substrate. The substrate has plural contact holes. The die has plural contact points each intended to be subjected to a light exposure in order to form a conductive contact portion connected to the corresponding contact hole. The correction method includes: obtaining the state information of the die by a first pre-scanning means, wherein the state information includes shape and location information; comparing the state information of the die against a reference state, and calculating compensation values with which to correct the reference state and thereby bring the reference state into conformity to the state information of the die; and calculating a compensation section for the light exposure according to the compensation values in order for each conductive contact portion to have an exposure pattern formed at the corresponding contact hole.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.

Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.

Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.

Abstract: An entertainment system including one or more display devices. Each display device may have a media player to play the content of a disc or media inserted in the media player. Each display device may also have a storage unit to store the media content. The media content can be shared between different display devices. The connection between display devices can be either by plurality of cables or by a wireless network. Each display device receives its power from a power filter. The power filter is connected to a power source.

Abstract: An entertainment system including one or more display devices. Each display device may have a media player to play the content of a disc or media inserted in the media player. Each display device may also have a storage unit to store the media content. The media content can be shared between different display devices. The connection between display devices can be either by plurality of cables or by a wireless network. Each display device receives its power from a power filter. The power filter is connected to a power source.

Abstract: A fastening apparatus, applicable for adjusting a fastening state of a first object and a second object by a first magnetic component, includes a first fastening component, an elastic component, a second fastening component and a second magnetic component. The first fastening component is disposed on the first object. The elastic component includes a first end disposed on the second object and a second end connected to the second fastening component. The second magnetic component is disposed on the second fastening component. The first magnetic component attracts the second magnetic component to move the second fastening component between a first position and a second position. When the second fastening component is at the first position, the first object is affixed to the second object. When the second fastening component is at the second position, the first object is separated from the second object.

Abstract: An electronic apparatus includes a casing, a cap, and an access module. An accommodation space of the casing is used for accommodating a data storage apparatus, and the access module is disposed inside the accommodation space. The casing is formed with an opening at a position corresponding to an access unit, so that an external card is inserted in or pulled out through the opening. A terminal of the access module is pivoted on the casing. The cap is used for covering and thus sealing the accommodation space, so that the access module is arranged between the data storage apparatus and the cap. Thereby, the space is saved, and the access module and the data storage apparatus can be detached or assembled conveniently.

Abstract: An electronic device including a casing, a cover, a latching member, and a limiting member is provided. The casing has a space and a stopping portion on an inner wall of the casing and in the pace. The cover is detachably assembled to the casing for covering the space. The latching member on the inner wall of the casing and in the space has a body moving relative to the casing between a first position and a second position and a limiting portion with a limiting route. The stopping portion is in a moving path of the latching member. The limiting member is assembled to the casing and interferes with the limiting portion. When the limiting member interferes with the limiting portion, the body is limited at the first position and a third position between the first position and the second position relative to the casing.

Abstract: Provided is an electronic device, comprising: a casing, comprising an accommodation space that a battery is detachably assembled therein. The battery comprises a hook extending towards the casing, a first and a second urging surfaces that a step connected there between; and a latching module, disposed in the casing and moving back and forth between a first and a second positions. When the latching module moves from the first position towards the second position, the hook, the first urging surface, the step, and the second urging surface are sequentially located in a moving path of a urging portion of the latching module. When the latching module is located at the first position, the urging portion is buckled to the hook. When the latching module is located at the second position, the urging portion is limited by the step and rests on the second urging surface.

Abstract: An electronic device includes a casing having an accommodation space, a battery detachably assembled in the accommodation space, and a latching module. The battery has a hook extending towards the casing, a first urging surface, a second urging surface, and a step connected between the first and the second urging surfaces. The latching module disposed in the casing moves back and forth between a first position and a second position. The latching module includes a main body and an urging portion extending from the main body towards the battery. The first urging surface, the step, and the second urging surface are sequentially located in a moving path of the urging portion. When the latching module is located at the first position or the second position, the urging portion is buckled to the hook or limited by the step and rests on the second urging surface.

Abstract: An electronic apparatus includes a casing, a cap, and an access module. An accommodation space of the casing is used for accommodating a data storage apparatus, and the access module is disposed inside the accommodation space. The casing is formed with an opening at a position corresponding to an access unit, so that an external card is inserted in or pulled out through the opening. A terminal of the access module is pivoted on the casing. The cap is used for covering and thus sealing the accommodation space, so that the access module is arranged between the data storage apparatus and the cap. Thereby, the space is saved, and the access module and the data storage apparatus can be detached or assembled conveniently.

Abstract: An electronic device including a casing, a cover, a latching member, and a limiting member is provided. The casing has a space and a stopping portion on an inner wall of the casing and in the pace. The cover is detachably assembled to the casing for covering the space. The latching member on the inner wall of the casing and in the space has a body moving relative to the casing between a first position and a second position and a limiting portion with a limiting route. The stopping portion is in a moving path of the latching member. The limiting member is assembled to the casing and interferes with the limiting portion. When the limiting member interferes with the limiting portion, the body is limited at the first position and a third position between the first position and the second position relative to the casing.