Patents by Inventor Chien-Huei Chen

Chien-Huei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190318471
    Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.
    Type: Application
    Filed: August 29, 2018
    Publication date: October 17, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Huei Chen, Pei-Chao Su, Xiaomeng Chen, Chan-Ming Chang, Shih-Yung Chen, Hung-Yi Chung, Kuang-Shing Chen, Li-Jou Lee, Yung-Cheng Lin, Wei-Chen Wu, Shih-Chang Wang, Chien-An Lin
  • Publication number: 20190259432
    Abstract: A memory macro includes a first memory cell array, first tracking circuit, first pre-charge circuit coupled to a first end of the first tracking bit line and a second pre-charge circuit coupled to a second end of the first tracking bit line. The first tracking circuit includes a first set of memory cells configured as a first set of loading cells responsive to a first set of control signals, a second set of memory cells configured as a first set of pull-down cells responsive to a second set of control signals, and a first tracking bit line. The first set of pull-down cells and first set of loading cells are configured to track a memory cell of the first memory cell array. The first and second pre-charge circuit are configured to charge the first tracking bit line to a voltage level responsive to a third set of control signals.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Inventors: Chien-Kuo SU, Cheng Hung LEE, Chiting CHENG, Hung-Jen LIAO, Jonathan Tsung-Yung CHANG, Yen-Huei CHEN, Pankaj AGGARWAL, Jhon Jhy LIAW
  • Patent number: 10319421
    Abstract: A memory macro includes a first set of memory cells, a second set of memory cells and a set of conductive lines. The first set of memory cells is arranged in columns and rows. Each memory cell of the first set of memory cells includes a voltage supply node configured to receive a first voltage of a first supply voltage or a second voltage of a second supply voltage. The second set of memory cells includes a set of retention circuits configured to supply the second voltage of the second supply voltage to the first set of memory cells during a sleep operational mode. The set of conductive lines is coupled to the set of retention circuits and the voltage supply node of each memory cell of the first set of memory cells.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: June 11, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Kuo Su, Cheng Hung Lee, Chiting Cheng, Hung-Jen Liao, Jonathan Tsung-Yung Chang, Yen-Huei Chen, Pankaj Aggarwal, Jhon Jhy Liaw
  • Publication number: 20190155164
    Abstract: A defect inspection method and a defect inspection system are provided. In the method, a plurality of candidate defect images are retrieved from inspection images obtained by at least one optical inspection tool performing hot scans on at least one wafer and a plurality of attributes are extracted from the inspection images. A random forest classifier including a plurality of decision trees for classifying the candidate defect images is created, wherein the decision trees are built with different subset of the attributes and the candidate defect images. A plurality of candidate defect images are retrieved from the optical inspection tool in runtime and applied to the decision trees, and classified into nuisance images and real defect images according to votes of the decision trees in which the nuisance images are filtered out. The real defect images with the votes over a confidence value are sampled for microscopic review.
    Type: Application
    Filed: March 29, 2018
    Publication date: May 23, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Huei Chen, Hung-Yi Chung, Chao-Ting Hong, Cheng-Kuang Lee, Xiaomeng Chen, Teng-Cheng Hsu
  • Publication number: 20190130551
    Abstract: A defect detecting method, a defect detecting system, and a non-transitory computer-readable medium are provided. The defect detecting method includes applying a rank filter to multiple scan images of consecutive dies of a reference wafer scanned by a wafer inspection tool to obtain multiple reference die images; collecting multiple target die images of a target die of a target wafer scanned by the wafer inspection tool; comparing the target die images with the reference die images to detect multiple defects according to differences of pixel values of corresponding pixels in the target die images and the reference die images; and excluding multiple common defects from the detected defects to detect at least one mask defect printed on the target wafer, where the common defects are obtained by the wafer inspection tool performing a wafer inspection on the target wafer.
    Type: Application
    Filed: January 30, 2018
    Publication date: May 2, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Chien-Huei Chen
  • Patent number: 9483819
    Abstract: One embodiment relates to a method of inspecting an array of cells on a substrate. A reference image is generated using a cell image that was previously determined to be defect free. A reference contour image which includes contours of the reference image is also generated. The reference contour image is used to detect defects in the array of cells on the substrate. Another embodiment relates to a system for detecting defects in an array on a substrate. Other embodiments, aspects and features are also disclosed.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: November 1, 2016
    Assignee: KLA-Tencor Corporation
    Inventors: Chien-Huei Chen, Ajay Gupta, Thanh Huy Ha, Jianwei Wang, Hedong Yang, Christopher Michael Maher, Michael J. Van Riet
  • Publication number: 20140212024
    Abstract: One embodiment relates to a method of inspecting an array of cells on a substrate. A reference image is generated using a cell image that was previously determined to be defect free. A reference contour image which includes contours of the reference image is also generated. The reference contour image is used to detect defects in the array of cells on the substrate. Another embodiment relates to a system for detecting defects in an array on a substrate. Other embodiments, aspects and features are also disclosed.
    Type: Application
    Filed: October 24, 2013
    Publication date: July 31, 2014
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Chien-Huei CHEN, Ajay GUPTA, Thanh Huy HA, Jianwei WANG, Hedong YANG, Christopher Michael MAHER, Michael J. VAN RIET
  • Patent number: 8669523
    Abstract: One embodiment relates to a method of inspecting a site location on a target substrate. Contours are obtained, the contours having been generated from a reference image using a design clip. A target image of the site location is acquired. The contours are aligned to the target image, and contrast values are computed for pixels on the contours. A threshold is applied to the contrast values to determine contour-based defect blobs. Another embodiment relates to a method of generating contours for use in inspecting a site location for defects. Other embodiments, aspects and features are also disclosed.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: March 11, 2014
    Assignee: KLA-Tencor Corporation
    Inventors: Chien-Huei Chen, Peter White, Michael J. Van Riet, Sankar Venkataraman, Hai Jiang, Hedong Yang, Ajay Gupta
  • Patent number: 8502146
    Abstract: One embodiment relates to a method of classifying a defect on a substrate surface. The method includes scanning a primary electron beam over a target region of the substrate surface causing secondary electrons to be emitted therefrom, wherein the target region includes the defect. The secondary electrons are detected from the target region using a plurality of at least two off-axis sensors so as to generate a plurality of image frames of the target region, each image frame of the target region including data from a different off-axis sensor. The plurality of image data frames are processed to generate a surface height map of the target region, and surface height attributes are determined for the defect. The surface height attributes for the defect are input into a defect classifier. Other embodiments, aspects and features are also disclosed.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: August 6, 2013
    Assignee: KLA-Tencor Corporation
    Inventors: Chien-Huei Chen, Hedong Yang, Cho H. Teh
  • Publication number: 20130082174
    Abstract: One embodiment relates to a method of classifying a defect on a substrate surface. The method includes scanning a primary electron beam over a target region of the substrate surface causing secondary electrons to be emitted therefrom, wherein the target region includes the defect. The secondary electrons are detected from the target region using a plurality of at least two off-axis sensors so as to generate a plurality of image frames of the target region, each image frame of the target region including data from a different off-axis sensor. The plurality of image data frames are processed to generate a surface height map of the target region, and surface height attributes are determined for the defect. The surface height attributes for the defect are input into a defect classifier. Other embodiments, aspects and features are also disclosed.
    Type: Application
    Filed: October 3, 2011
    Publication date: April 4, 2013
    Inventors: Chien-Huei CHEN, Hedong YANG, Cho H. TEH
  • Publication number: 20120298862
    Abstract: One embodiment relates to a method of inspecting a site location on a target substrate. Contours are obtained, the contours having been generated from a reference image using a design clip. A target image of the site location is acquired. The contours are aligned to the target image, and contrast values are computed for pixels on the contours. A threshold is applied to the contrast values to determine contour-based defect blobs. Another embodiment relates to a method of generating contours for use in inspecting a site location for defects. Other embodiments, aspects and features are also disclosed.
    Type: Application
    Filed: March 2, 2012
    Publication date: November 29, 2012
    Inventors: Chien-Huei CHEN, Peter WHITE, Michael J. VAN RIET, Sankar VENKATARAMAN, Hai JIANG, Hedong YANG, Ajay GUPTA
  • Publication number: 20120223227
    Abstract: One embodiment relates to a method of real-time three-dimensional electron beam imaging of a substrate surface. A primary electron beam is scanned over the substrate surface causing electrons to be emitted therefrom. The emitted electrons are simultaneously detection using a plurality of at least two off-axis sensors so as to generate a plurality of image data frames, each image data frame being due to electrons emitted from the substrate surface at a different view angle. The plurality of image data frames are automatically processed to generate a three-dimensional representation of the substrate surface. Multiple views of the three-dimensional representation are then displayed. Other embodiments, aspects and features are also disclosed.
    Type: Application
    Filed: March 4, 2011
    Publication date: September 6, 2012
    Inventors: Chien-Huei CHEN, Paul D. MacDONALD, Rajasekhar KUPPA, Takuji TADA, Gordon ABBOTT, Cho TEH, Hedong YANG, Stephen LANG, Mark A. NEIL, Zain SAIDIN
  • Patent number: 7570797
    Abstract: Methods and systems for generating an inspection process for an inspection system are provided. One computer implemented method includes generating inspection data for a selected defect on a specimen at different values of one or more image acquisition parameters of the inspection system. The method also includes determining which of the different values produces the best inspection data for the selected defect. In addition, the method includes selecting the different values determined to produce the best inspection data as values of the one or more image acquisition parameters to be used for the inspection process.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: August 4, 2009
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: David Wang, Patrick Huet, Tong Huang, Martin Plihal, Adam Chien-Huei Chen, Mike Van Riet, Stewart Hill
  • Patent number: 7440607
    Abstract: A method of detecting anomalies in a test image. Test features of pixels within the test image are selected, and reference features of pixels within at least one reference image are also selected. A signal distribution of test features and reference features in a multi-dimensional feature space is created, and stored. Those test features of the test image that do not satisfy a set of criteria for normalcy are selected as candidate points. Those candidate points that are statistical outliers are identified as anomalies. Positions of the anomalies are located using the stored signal distribution within which the defects have been identified as a lookup table.
    Type: Grant
    Filed: November 3, 2004
    Date of Patent: October 21, 2008
    Assignee: KLA-Tencor Corporation
    Inventors: Jason Z. Lin, Hong Chen, Evgeni Shifrin, Ashok V. Kulkarni, Santosh K. Bhattacharyya, Wei Zhao, Chien-Huei Chen
  • Patent number: 6985220
    Abstract: A method of tuning an inspection system. An inspection piece is sensed and analyzed to identify anomalies. Level information is analyzed with an initial set of thresholds, and an initial portion of the anomalies are flagging as defects. The inspection system parameters are changed, and the level information is analyzed with a modified set of thresholds. The anomalies are flagged as defects based on the immediately preceding analysis of the level information. The steps of changing the thresholds and reflagging the defects are repeated as desired, and the modified set of thresholds are stored for use in an inspection system recipe.
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: January 10, 2006
    Assignee: KLA-Tencor Technologies Corporation
    Inventors: Chien-Huei Chen, Vivek Bhagat, Qiang Song, James A. Quigley, Ashok V. Kulkarni