Abstract: The present disclosure provides a cover film, including a conductive adhesive layer, an electromagnetic shielding layer formed on the conductive adhesive layer, and an insulating layer formed on the electromagnetic shielding layer. The electromagnetic shielding layer has a thickness of from 0.01 to 25 micrometers, such that the cover film can shield electromagnetic interference through the thinner interposed electromagnetic shielding layer.

Abstract: A backlight module including an LGP, an optical film, a first light source is provided. The LGP has a bottom surface, a light emitting surface, a first light incident surface, and microstructures. Each microstructure is recessed into or protrudes out of the bottom surface and includes at least two structural units. A section line of each structural unit on a first reference plane is a curve, and the curve has a peak point. A distance between two peak points of two adjacent structural units along a first direction is greater than 0 and smaller than a half of a total width of the two structural units along the first direction. Each microstructure has a symmetric plane perpendicular to the light emitting surface and the first light incident surface. The optical film is located on the light emitting surface. The first light source is located beside the first light incident surface.

Abstract: A backlight module includes a light guide plate having a bottom surface, a light emitting surface, a first light incident surface, and microstructures. Each microstructure recesses into or protrudes from the bottom surface and has a first and a second surfaces. The first and the second surfaces of at least one of the microstructures are located on two sides of a first reference plane parallel to the first light incident surface. A section-line of each first surface on a second reference plane perpendicular to the first light incident surface and perpendicular to the light emitting surface is a straight line. A first angle between each first surface and a third reference plane parallel to the light emitting surface in the light guide plate is between 0 degrees and 20 degrees, and a thickness of each microstructure is between 0 micrometers and 20 micrometers.

Abstract: A method of making a combination of a flexible printed circuit board (FPCB) and a rigid printed circuit board (RPCB), comprising steps of providing a RPCB; providing a FPCB having a panel and a hole formed through the FPCB; forming a solder layer located at the hole and between the RPCB and the FPCB; heating through the hole to melt the solder layer; and removing the heat source to solidify the solder layer to obtain a combination of the FPCB and the RPCB. Based on the steps above, there is no need to use any additional connection piece and fixture of the same and the manufacture cost is lowered. In addition, as a result that the solder layer is very thin, the combination made by the method accommodates less space and has extensive applicability.

Abstract: A planar light source including an LGP and first and second light sources are provided. The LGP has a first surface and a second surface opposite to each other and a first groove and a second groove. The first groove and the second groove are respectively located on the first surface and the second surface, and are respectively located at two sides of a center line of the LGP, where the center line equally divides the first surface and the second surface. The first groove has a first side surface and a first light incident surface, and the second groove has a second side surface and a second light incident surface, where the light sources are disposed in the grooves. The light sources are suitable for respectively providing a light beam entering the LGP through the corresponding light incident surface.

Abstract: The present invention provides a cover film for a printed circuit board. The cover film includes an adhesive layer; a core layer made of a polymer; and a composite material layer formed on the core layer, comprising epoxy resin, a black material selected from the group consisting of a black pigment, carbon powder, nano carbon tube and a combination thereof, and an additive selected from the group consisting of titanium dioxide, boron nitride, barium sulfate and a combination thereof, wherein the core layer is disposed between the adhesive layer and the composite material layer, and the adhesive layer and the composite material layer have the same thickness or have a thickness difference being no more than 15 micro meters. The cover film of the preset invention is capable of shielding circuit patterns and has great folding endurance, and is thus applicable to flexible printed circuit boards.

Abstract: An automatic page-turning scan device for automatically turning and scanning pages of a book includes an automatic page-turning device and a scan module. The automatic page-turning device includes a base, a book support, a page-pressing module, a pick-up and page-turning module, and a system controller connected with the book support, the page-pressing module and the pick-up and page-turning module. The book support slidably mounted to the base includes two supporting panels for supporting the book. The page-pressing module is mounted to the supporting panel includes a driving module, and a pressing plate driven by the driving module. The pick-up and page-turning module mounted to the base includes a pick-up holder, a pick-up arm and a path guiding mechanism. The scan module is mounted to the automatic page-turning device, and the system controller controls the scan module to scan the pages of the book.

Abstract: An automatic page-turning scan device for automatically turning and scanning pages of a book includes an automatic page-turning device and a scan module. The automatic page-turning device includes a base, a book support, a page-pressing module, a pick-up and page-turning module, and a system controller connected with the book support, the page-pressing module and the pick-up and page-turning module. The book support slidably mounted to the base includes two supporting panels for supporting the book. The page-pressing module is mounted to the supporting panel includes a driving module, and a pressing plate driven by the driving module. The pick-up and page-turning module mounted to the base includes a pick-up holder, a pick-up arm and a path guiding mechanism. The scan module is mounted to the automatic page-turning device, and the system controller controls the scan module to scan the pages of the book.

Abstract: A double-sided copper foil substrate, which comprises: a polymer layer; a first copper foil; an adhesive layer formed on the polymer layer such that the polymer layer is sandwiched between the adhesive layer and the first copper layer; and a second copper foil causing the adhesive layer to be sandwiched between the second copper foil and the polymer layer, wherein the polymer layer and the adhesive layer have a total thickness of from 12 to 25 ?m. The present invention further provides a flexible printed circuit board structure utilizing the composite double-sided copper foil substrate of the present invention, wherein the second double-sided copper foil substrate has a trench for exposing a portion of the adhesive layer. The double-sided copper foil substrate of the present invention are lower in rebound and satisfying the demand for the greater number of bending and sliding cycles under a lower R angle, and particularly is suitable for thin and flexible electronic products.

Abstract: A thin metal substrate having high thermal conductivity includes a copper foil layer, an insulating polymer layer and a thermal conductive adhesive layer. The thermal conductive adhesive layer has a resin and a thermal conductive powder dispersed in the resin. The insulating polymer layer is disposed between the copper foil layer and the thermal conductive adhesive layer. Since the thermal conductive adhesive layer has the thermal conductive powder and the insulating polymer layer has insulating and anti-breakdown abilities, the substrate has a reduced thickness, high heat dissipating efficiency and improved insulating performance.

Abstract: A double-sided copper foil substrate, which comprises: a polymer layer; a first copper foil; an adhesive layer formed on the polymer layer such that the polymer layer is sandwiched between the adhesive layer and the first copper layer; and a second copper foil causing the adhesive layer to be sandwiched between the second copper foil and the polymer layer, wherein the polymer layer and the adhesive layer have a total thickness of from 12 to 25 ?m. The present invention further provides a flexible printed circuit board structure utilizing the composite double-sided copper foil substrate of the present invention, wherein the second double-sided copper foil substrate has a trench for exposing a portion of the adhesive layer. The double-sided copper foil substrate of the present invention are lower in rebound and satisfying the demand for the greater number of bending and sliding cycles under a lower R angle, and particularly is suitable for thin and flexible electronic products.

Abstract: The present invention provides a cover film for a printed circuit board. The cover film includes an adhesive layer; a core layer made of a polymer; and a composite material layer formed on the core layer, comprising epoxy resin, a black material selected from the group consisting of a black pigment, carbon powder, nano carbon tube and a combination thereof, and an additive selected from the group consisting of titanium dioxide, boron nitride, barium sulfate and a combination thereof, wherein the core layer is disposed between the adhesive layer and the composite material layer, and the adhesive layer and the composite material layer have the same thickness or have a thickness difference being no more than 15 micro meters. The cover film of the preset invention is capable of shielding circuit patterns and has great folding endurance, and is thus applicable to flexible printed circuit boards.

Abstract: The present invention provides a cover layer for a printed circuit board. The cover layer includes a first polymer layer, a second polymer layer and a light-reflecting layer disposed between the first and second polymer layers and having a thickness being 0.5 to 10 micro meters. Due to the light-reflecting layer, the cover layer of the present invention has high reflection rate and great flexibility suitable for a flexible printed circuit board.