Abstract: T cell immune responses are enhanced by presentation of antigen to CD8+ T cells using a chimeric nucleic acid immunogen or vaccine that links DNA encoding an antigen with DNA encoding a polypeptide that targets or translocates the antigenic polypeptide to which it is fused (immunogenicity-potentiating polypeptides or “IPP”). By inhibiting apoptosis in the vicinity of a T cell responses to such a nucleic acid immunogen, even more potent immune responses are attained. The present strategy prolongs the survival of DNA-transduced cells, including dendritic cells (DCs), thereby enhancing the priming of antigen-specific T cells and increase potency.

Abstract: A full-color scanning-type LED display is provided, including a scanning LED module, a projection screen and a structure frame. The scanning LED module further includes a red LED row having a plurality of red LEDs, a green LED row having a plurality of green LEDs, a blue LED row having a plurality of blue LEDs, a driver for driving the red, green, and blue LED rows, a plurality of metal conductive lines for connecting these elements of the scanning LED module, and a micro lens structure for focusing and projecting the light emitted from the red, green and blue LED rows. The driver further includes a driving IC and a serving motor. The projection screen is placed at an appropriate distance from scanning LED module, and both are engaged at the fixed distance by the structure frame.

Abstract: The present invention discloses a structure of light-emitting diode (LED) array module, comprising a substrate, a carrier substrate, a chip, a driving circuit chip, and a plurality of metal lines. The carrier substrate is on top of the substrate, and the top surface of the carrier substrate is divided into a first area and a second area. The chip is attached to the first area of the carrier substrate, and further comprising a light-emitting component array and a pad array. The driving circuit chip is attached to the second area of the carrier substrate, and further comprising a pad array and a pad. The metal lines are for electrically connecting the substrate to the driving circuit chip, and the chip to the driving circuit chip, respectively. The present invention can reduce the manufacturing cost, and improve the yield rate.