Abstract: A radar system includes an ultrasonic radar unit and a warning device. The ultrasonic radar unit is configured to be detachably mounted on a vehicle, and is configured to output a pairing signal when a pairing function is activated and output a warning signal upon detecting an object that is within a range. The warning device is configured to be electrically connected to the ultrasonic radar unit and to be mounted inside the vehicle. The warning device is configured to wirelessly communicate with the ultrasonic radar unit to receive the warning signal and the pairing signal; when receiving the pairing signal, couple the ultrasonic radar unit to one of a plurality of warning areas that is on the warning device according to the pairing signal; control one of the warning areas that is coupled to the ultrasonic radar unit to output a visual warning upon receiving the warning signal.

Abstract: An antenna module includes two antenna units, two isolation members, and a grounding member. Each antenna unit consists of two feeding ends, two first radiators, and two second radiators. The isolating members are disposed between the first and second portions of each antenna unit. The grounding member is disposed beside the two antenna units and the two isolation members. A first slot is formed among each first radiator, the second radiator, and the grounding member. The two second radiators are connected to the third radiator. A third slot is formed between the second radiator and the second portion. The two antenna units are symmetric to the fourth slot in a mirrored manner, and the two first portions have widths gradually changing along an extending direction of the fourth position.

Abstract: A dual-code lock core is provided, including a first unlocking component, a code wheel, and a second unlocking component. When the code wheel rotates to a first unlocking position, the first unlocking component may move to unlock the dual-code lock core; and when the code wheel rotates to a second unlocking position, the second unlocking component may move to unlock the dual-code lock core.

Abstract: The invention discloses an etching solution and a manufacturing method of a display panel. The method includes following steps: providing a first substrate; forming a conductive layer stack including a first sub-layer, a second sub-layer and a third sub-layer, each of the first sub-layer and the second sub-layer includes a transparent conductive material including indium-containing oxide, the third sub-layer is disposed between the first sub-layer and the second sub-layer, and the third sub-layer includes silver or silver alloy; performing an etching process, an etching solution is used to etch the first sub-layer, the second sub-layer and the third sub-layer to form a first patterned sub-layer, a second patterned sub-layer and a third patterned sub-layer, and the etching solution includes 1 to 2.6 wt % of nitric acid, 35 to 45 wt % of acetic acid, 35 to 45 wt % of phosphoric acid and a remaining amount of water.

Abstract: A security lock has a fixing element and at least one hook. The fixing element is mounted in a security slot of an electronic device. The hook is capable of moving axially with respect to the fixing element, and the hook moves radially outward along a guiding structure of the fixing element to engage with the security slot, the fixing element stays static, i.e., without moving and rotating as the hook is moving. Therefore, the security lock won't press the security slot, and further prevents damage to the security slot caused by frequently or constantly loaded with the security lock. Furthermore, without moving and rotating in a mounting process of the security lock, the fixing element holds the hook to steadily engage with the security slot, and thus an overall anti-pulling and anti-pushing performances are enhanced.

Abstract: A heat dissipation substrate includes heat dissipation blocks, an insulation filling structure, a first insulating layer, and a first circuit layer. Each heat dissipation block includes a first surface and a second surface opposite to the first surface. The insulation filling structure is disposed between the heat dissipation blocks to laterally connect the heat dissipation blocks. A first insulating surface of the insulation filling structure is substantially coplanar with the first surface of the heat dissipation block. A second insulating surface of the insulation filling structure is substantially coplanar with the second surface of the heat dissipation block. The first insulating layer is disposed on the first surface. The first circuit layer is disposed on the first insulating layer and penetrates the first insulating layer to be connected with the heat dissipation blocks. A thickness of the heat dissipation blocks is greater than a thickness of the first circuit layer.

Abstract: A method and an apparatus related to network analysis are provided. A work topology is mapping into an abstract topology according to a workload's network behavior. The network behavior is defined by a connection of the workload via one or more ingress ports and/or one or more egress target ports. The work topology records one or more ingress ports or one or more egress target ports supported by the workload. The abstract topology records a dynamic relationship of the currently operating ingress port or egress target port of the workload and a corresponding anomaly rule. The dynamic relationship is compared with the anomaly rule to determine that an abnormal situation occurs on the workload. The abnormal situation is related to a violation of the workload model which comprises static role, dynamic relationship, and the anomaly rule. The dynamic relationship is an associated behavior between the workload and another workload via the ingress ports and/or the egress target ports of the workload.

Abstract: A dual-code-variable lock core is provided, including a first code component, a code wheel arranged outside the first code component, and a second code component arranged at one side of the code wheel. When the code wheel rotates to a first unlocking position, the first code component may move to perform a code change on the dual-code-variable lock core; and when the code wheel rotates to a second unlocking position, the second code component may move to perform the code change on the dual-code-variable lock core.

Abstract: A dual-code lock core is provided, including a first unlocking component, a code wheel, and a second unlocking component. When the code wheel rotates to a first unlocking position, the first unlocking component may move to unlock the dual-code lock core; and when the code wheel rotates to a second unlocking position, the second unlocking component may move to unlock the dual-code lock core.

Abstract: A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.

Abstract: A heat dissipation substrate includes an insulating layer, a metal heat dissipation block, and a patterned structure layer. The insulating layer has a first surface, a second surface and at least one through hole. The metal heat dissipation block passes through the insulating layer from the second surface of the insulating layer and has an upper surface, a lower surface, and a contact surface. There is a first vertical height between the contact surface and the lower surface. The patterned structure layer includes a patterned circuit layer and at least one conductive structure layer. The patterned circuit layer is disposed on the first surface of the insulating layer, and the conductive structure layer is connected to the patterned circuit layer and extends to cover an inner wall of the through hole. The patterned circuit layer has a top surface, the conductive structure layer has a bottom surface.

Abstract: A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.

Abstract: The present invention provides a semiconductor structure and a method of fabricating the same. The method includes: providing a chip having conductive pads, forming a metal layer on the conductive pads, forming a passivation layer on a portion of the metal layer, and forming conductive pillars on the metal layer. Since the metal layer is protected by the passivation layer, the undercut problem is solved, the supporting strength of the conductive pillars is increased, and the product reliability is improved.

Abstract: The lock box includes a box, a cap, and a cable. The box includes a box opening, a lock hole, and a lock body. The cap includes a cap fixing part, a cap socket, and a restricting device. The cap fixing part is able to extend into the lock hole and be locked by the lock body when the cap covers the box opening. The restricting device has a lifting lever. One end of the cable has a cable fixing part. The cable fixing part can be inserted into the cap socket with its movement being restricted by the restricting device. A user can apply a force on the lifting lever to release the restriction on the movement of the cable fixing part by the restricting device when the cap doesn't cover the box opening.

Abstract: A locking device for a notebook computer contains: a fixer and a rotatable connection rod. The fixer includes a bottom extension configured to support a bottom of the notebook computer, and the fixer includes a lock body configured to abut against a rear end of the notebook computer. The lock body has at least one orifice configured to connect with a cable lock, and the lock body has a first receiving aperture and a second receiving aperture. The rotatable connection rod includes a rod body rotatably arranged above a keyboard of the notebook computer, a first coupling post and a second coupling post which are rotatably connected with two ends of the rod body respectively. The first coupling post is inserted into the first receiving aperture of a first side of the lock body, and the second coupling post is inserted into a second side of the lock body.

Abstract: A heat dissipation substrate includes an insulating layer, a metal heat dissipation block, and a patterned structure layer. The insulating layer has a first surface, a second surface and at least one through hole. The metal heat dissipation block passes through the insulating layer from the second surface of the insulating layer and has an upper surface, a lower surface, and a contact surface. There is a first vertical height between the contact surface and the lower surface. The patterned structure layer includes a patterned circuit layer and at least one conductive structure layer. The patterned circuit layer is disposed on the first surface of the insulating layer, and the conductive structure layer is connected to the patterned circuit layer and extends to cover an inner wall of the through hole. The patterned circuit layer has a top surface, the conductive structure layer has a bottom surface.

Abstract: A locking device for a notebook computer contains: a fixer and a rotatable connection rod. The fixer includes a bottom extension configured to support a bottom of the notebook computer, and the fixer includes a lock body configured to abut against a rear end of the notebook computer. The lock body has at least one orifice configured to connect with a cable lock, and the lock body has a first receiving aperture and a second receiving aperture. The rotatable connection rod includes a rod body rotatably arranged above a keyboard of the notebook computer, a first coupling post and a second coupling post which are rotatably connected with two ends of the rod body respectively. The first coupling post is inserted into the first receiving aperture of a first side of the lock body, and the second coupling post is inserted into a second side of the lock body.