Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: A method of building a characteristic model includes: acquiring raw electrical data from a measurement system outside one or more processing units; acquiring operational state-related data from an information collector inside the one or more processing units; performing a data annealing process on the raw electrical data and the operational state-related data to obtain and purified electrical data and purified operational state-related data; and performing a machine learning (ML)-based process to build the characteristic model based on the purified electrical data and the purified operational state-related data.

Abstract: A sprayer, comprising: a container, configured to contain liquid; a passage, comprising a first opening, a second opening, a resonator and a mesh, when the liquid is passed through the resonator, the liquid is emitted as a gas; a first optical sensor, configured to sense first optical data of at least portion of the mesh or at least portion of a surface of the container; and a processing circuit, configured to compute a foaming level of the mesh or of the surface according to the first optical data, and configured to determine whether the resonator should be turned off or not according to the foaming level. In another aspect, the processing circuit estimates a liquid level of the liquid but does not correspondingly turn off the resonator. By this way, the resonator may be turned on or turned off more properly and the liquid level may be more precisely estimated.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A packaging substrate assembly for fabricating a packaged module can include a packaging substrate having a surface, and an array of conductive pads implemented on the surface. The assembly can further include a conductive post formed over each conductive pad, with the conductive post including a first portion having a lateral dimension formed over the conductive pad and a second portion having a lateral dimension formed over the first portion. In some embodiments, the lateral dimension of the first portion is less than the lateral dimension of the second portion. In some embodiments, a dielectric layer can be implemented over the surface to cover the conductive pads and surround the first portion of each conductive post.

Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.

Abstract: A method for detecting a particular syndrome based on hemodynamic analysis that includes steps of: obtaining a piece of hemodynamic data representing a hemodynamic waveform; performing moving average (MA) filtering on the hemodynamic waveform to obtain a filtered waveform; determining troughs in order to determine waveform segments of the filtered waveform; determining smoothness of the waveform segments; and determining a relation between the hemodynamic waveform and a particular syndrome based on the smoothness of the waveform segments, and generating a detection result.

Abstract: A method for detecting a particular syndrome based on hemodynamic analysis that includes steps of: obtaining a piece of hemodynamic data representing a hemodynamic waveform; performing moving average (MA) filtering on the hemodynamic waveform to obtain a filtered waveform; determining troughs in order to determine waveform segments of the filtered waveform; determining systolic peaks for determining first and second portions of the waveform segments; determining smoothness of the second portions; and determining a relation between the hemodynamic waveform and a particular syndrome based on the smoothness of the second portions, and generating a detection result.

Abstract: A method for detecting a location of a segment of a feeding tube is provided. The feeding tube has a proximal end, a hollow tube body and a distal end, and is placed inside the body of a patient. An audio collecting component is placed on a predetermined part of the patient. The method includes steps of pumping air into the proximal end of the feeding tube, collecting sound to obtain audio data by the audio collecting component, performing audio analysis on the audio data, and determining whether a segment of the hollow tube body is at a part inside the body of the patient that corresponds with the location of the audio collecting component based on result of the audio analysis.

Abstract: A plant potting includes a base, a magnet mounted in the base and connected to an electric cord, a damper mounted on the magnet, a vibration absorber mounted in the base and located above the damper, a vibrator protruding outwardly from the base and connected to the vibration absorber, a vibration receiver having a lower end connected to the vibrator, a pin holder mounted on an upper end of the vibration receiver, and a plant mounted on the pin holder. Thus, the stems, the flowers and the leaves of the plant function as a medium to transmit the sound wave from the sound so as to output a sound wave in a different sound transmitting way, thereby enhancing the sounding effect of the sound.

Abstract: A plant potting includes a base, a magnet mounted in the base and connected to an electric cord, a damper mounted on the magnet, a vibration absorber mounted in the base and located above the damper, a vibrator protruding outwardly from the base and connected to the vibration absorber, a vibration receiver having a lower end connected to the vibrator, a pin holder mounted on an upper end of the vibration receiver, and a plant mounted on the pin holder. Thus, the stems, the flowers and the leaves of the plant function as a medium to transmit the sound wave from the sound so as to output a sound wave in a different sound transmitting way, thereby enhancing the sounding effect of the sound.

Abstract: The present invention provides an LED device with a flip chip structure. The LED device comprises an insulating substrate, an LED flip chip, a molding compound, a first conductive element, and a second conductive element. The LED flip chip is electrically connected to the connection pads on the insulating substrate via the two conductive elements. The P-type and N-type electrodes are connected to the P-type and N-type electrodes layers, respectively. The invention need not require a conventional wire bonding process. It not only increases the yield rate of the product but also makes the product more compact.

Abstract: A slot antenna includes a substrate with a metal ground plate on one side thereof and a plurality of rectangular slots are etched in an inner periphery of the ground plate. An opening is defined in one side of the ground plate and a metal feedline is located on the substrate and located close to the opening. The feedline includes a plurality of sub-sections extending within the slot and at least two matching stubs are formed on the feedline and a sub-ground plate is connected to the ground plate and located in the slot. A plurality of metal floating stubs are attached to the rear side of the substrate. When viewing from the front side of the substrate, the floating stubs are connected across the ground plate and at least one of the matching stubs. The antenna is miniaturized and includes dual-frequency operation.

Abstract: A slot antenna includes a substrate with a metal ground plate on one side thereof and a plurality of rectangular slots are etched in an inner periphery of the ground plate. An opening is defined in one side of the ground plate and a metal feedline is located on the substrate and located close to the opening. The feedline includes a plurality of sub-sections extending within the slot and at least two matching stubs are formed on the feedline and a sub-ground plate is connected to the ground plate and located in the slot. A plurality of metal floating stubs are attached to the rear side of the substrate. When viewing from the front side of the substrate, the floating stubs are connected across the ground plate and at least one of the matching stubs. The antenna is miniaturized and includes dual-frequency operation.

Abstract: A microstrip meandering-line antenna for a wireless communications system includes a substrate, a meandering-line conductor, and a feeding wire. The substrate, which is made of a dielectric material or a magnetic material, has a first surface. The meandering-line conductor is attached to the first surface in a reciprocating bent manner for receiving radio signals, and the meandering-line conductor has a mid-point connection between two ends of the meandering-line conductor. The feeding wire is electrically connected to the mid-point of the meandering-line conductor for transmitting a received radio signal to the wireless communications system.

Abstract: A microstrip meandering-line antenna for a wireless communications system includes a substrate, a meandering-line conductor, and a feeding wire. The substrate, which is made of a dielectric material or a magnetic material, has a first surface. The meandering-line conductor is attached to the first surface in a reciprocating bent manner for receiving radio signals, and the meandering-line conductor has a mid-point connection between two ends of the meandering-line conductor. The feeding wire is electrically connected to the mid-point of the meandering-line conductor for transmitting a received radio signal to the wireless communications system.