Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A semiconductor structure includes a substrate with a first surface and a second surface opposite to the first surface, a first and a second shallow trench isolations disposed in the substrate and on the second surface, a deep trench isolation structure in the substrate and coupled to the first shallow trench isolation, a first dielectric layer disposed on the first surface and coupled to the deep trench isolation structure, a second dielectric layer disposed over the first dielectric layer and coupled to the deep trench isolation structure, a third dielectric layer comprising a horizontal portion disposed over the second dielectric layer and a vertical portion coupled to the horizontal portion, and a through substrate via structure penetrating the substrate from the first surface to the second surface and penetrating the second shallow trench isolation.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: A multidirectional optical positioning method and a device thereof, and more particularly a signal transmission and positioning method applied to visible light communication and a device thereof. The device includes a transparent board having multiple different light conversion layers on the surface. The light conversion layers are arranged in one single axial direction. A light emitting unit is used to project an incident light onto an incident side of the transparent board. After the incident light passes through the light conversion layers, the incident light is converted into multiple radiating lights with different physical effects, which are emitted from an emission side of the transparent board. A sensor is disposed on the emission side of the transparent board to receive the radiating lights, whereby the position of the sensor can be found according to different extents of the physical effects of the different radiating lights.

Abstract: A light-emitting module has better white light color rendering index to provide white rendering effect in accordance with the requirements of various application sites. The light-emitting module includes a (circuit) substrate board and at least one ultraviolet ray emitter and at least one blue light emitter disposed on the substrate board. The light wavelength of the ultraviolet ray emitter ranges from 380 nm to 420 nm. The light wavelength of the blue light emitter ranges from 440 nm to 470 nm. A wavelength conversion layer is laid on the substrate board. The wavelength conversion layer includes a first wavelength conversion material and a second wavelength conversion material for receiving and converting the light emitted from the ultraviolet ray emitter into visible light and the light emitted from the blue light emitter into white light. After the lights are mixed, a white general output optical spectrum is achieved.

Abstract: An LED light core structure, which has better mechanical strength and good heat dissipation effect and is able to 360-degree project light. The LED light core structure includes a metal-made substrate having at least two faces. The substrate is formed with multiple openings communicating the two faces. At least one lug is connected with an edge of each opening. The lug is bent from one of the faces and extends outward from one of the faces. An LED is disposed on the lug, whereby the light of the LED is projected to one of the faces and the other opposite face through the opening. The substrate is unlikely to crack so that the ratio of good products is increased. The substrate can provide excellent heat dissipation effect for the LED. Due to the openings, the LED light core can project light to both sides of the substrate.

Abstract: A light-emitting module has better white light color rendering index to provide white rendering effect in accordance with the requirements of various application sites. The light-emitting module includes a (circuit) substrate board and at least one ultraviolet ray emitter and at least one blue light emitter disposed on the substrate board. The light wavelength of the ultraviolet ray emitter ranges from 380 nm to 420 nm. The light wavelength of the blue light emitter ranges from 440 nm to 470 nm. A wavelength conversion layer is laid on the substrate board. The wavelength conversion layer includes a first wavelength conversion material and a second wavelength conversion material for receiving and converting the light emitted from the ultraviolet ray emitter into visible light and the light emitted from the blue light emitter into white light. After the lights are mixed, a white general output optical spectrum is achieved.

Abstract: A multidirectional optical positioning method and a device thereof, and more particularly a signal transmission and positioning method applied to visible light communication and a device thereof. The device includes a transparent board having multiple different light conversion layers on the surface. The light conversion layers are arranged in one single axial direction. A light emitting unit is used to project an incident light onto an incident side of the transparent board. After the incident light passes through the light conversion layers, the incident light is converted into multiple radiating lights with different physical effects, which are emitted from an emission side of the transparent board. A sensor is disposed on the emission side of the transparent board to receive the radiating lights, whereby the position of the sensor can be found according to different extents of the physical effects of the different radiating lights.

Abstract: A knockdown optical component structure is disclosed. According to the light source wattage, size or area, an operator can change the optical lens assembling mode and optical emission effect to modify the light source illumination or arrangement form. The knockdown optical component structure includes a light guide substrate body and at least one light guide body assembled therewith. A connection section is disposed on a circumferential section of the light guide substrate body. A predetermined section of the light guide body is formed with a perforation (or a depression). An assembling section is formed on the perforation or the depression. The connection section is rotatably connected with the assembling section, whereby the light guide substrate body is detachably received in the perforation or the depression of the light guide body to form an optical component assembly.

Abstract: A dimmable light-emitted diode (LED) packaging structure is described. The dimmable LED packaging structure employs a plurality of first fluorescent layers respectively positioned on some of a plurality of first types of LED chips to solve the problems of color temperature and light mixing uniformity. Further, a second fluorescent layer overlays the first fluorescent layers and a potion of the first types of LED chips to simplify the manufacturing step of dimmable LED packaging structure.

Abstract: A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor.

Abstract: A method for manufacturing a light emitting diode (LED) assembly comprises the steps of: covering a light-reflection layer onto a substrate layer, covering a light-emitting layer onto the light-reflection layer, and forming a P type electrode and an N type electrode extended from the light-emitting layer, perforating through the light-reflection layer, and exposed from the substrate layer to form an LED chip structure; packaging the LED chip structure with a light-transmissible packaging material and keeping the P type electrode and the N type electrode exposed from the light-transmissible packaging material to form a molded LED chip cell; and electrically connecting the P type electrode and the N type electrode of the molded LED chip cell to a circuit board, so as to manufacture the LED assembly.

Abstract: A LED lamp with 360-degree illumination includes a base, a first substrate, a stepped structure, a plurality of LEDs, and a cover. The first substrate is fixed on the base. The stepped structure is mounted on the first substrate. The stepped structure has a first annular frame connected to the first substrate, a second substrate connected to the first annular frame, and a second annular frame connected to the second substrate. The peripheral length of the second annular frame is smaller than that of the first annular frame. The plurality of LEDs is fixed to the first substrate and the second substrate and surrounds the first annular frame and the second annular frame respectively. With this arrangement, the LEDs can be arranged in a multi-storey stepped structure to generate an effect of 360-degree illumination. Also, the illumination range of the lamp can be increased.

Abstract: A method for manufacturing a light emitting diode (LED) assembly comprises the steps of: covering a light-reflection layer onto a substrate layer, covering a light-emitting layer onto the light-reflection layer, and forming a P type electrode and an N type electrode extended from the light-emitting layer, perforating through the light-reflection layer, and exposed from the substrate layer to form an LED chip structure; packaging the LED chip structure with a light-transmissible packaging material and keeping the P type electrode and the N type electrode exposed from the light-transmissible packaging material to form a molded LED chip cell; and electrically connecting the P type electrode and the N type electrode of the molded LED chip cell to a circuit board, so as to manufacture the LED assembly.

Abstract: A LED lamp with 360-degree illumination includes a base, a first substrate, a stepped structure, a plurality of LEDs, and a cover. The first substrate is fixed on the base. The stepped structure is mounted on the first substrate. The stepped structure has a first annular frame connected to the first substrate, a second substrate connected to the first annular frame, and a second annular frame connected to the second substrate. The peripheral length of the second annular frame is smaller than that of the first annular frame. The plurality of LEDs is fixed to the first substrate and the second substrate and surrounds the first annular frame and the second annular frame respectively. With this arrangement, the LEDs can be arranged in a multi-storey stepped structure to generate an effect of 360-degree illumination. Also, the illumination range of the lamp can be increased.

Abstract: A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor.

Abstract: A nail-driving device has a housing, a trigger unit, a safety unit, a connecting unit and a magazine. The safety unit has first and second safety members in the housing. The connecting unit is connected pivotally to the second safety member, and has a retaining portion disposed movably between the first and second safety members. The magazine has a pusher for pushing nails therein. When the retaining portion is in a retaining position, a force is applicable to the first safety member to move the second safety member to pivot a trigger arm for a nail-driving operation when the trigger unit is actuated. When the nails thereof are exhausted, the pusher moves to a retention releasing position to pivot the connecting unit and remove the retaining portion from the retaining position to allow for relative movement of the first and second safety members to prevent the nail-driving operation.