Patents by Inventor Chien-Kai Hung

Chien-Kai Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROBE CARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20240118316
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Applicant: MPI Corporation
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Probe card and manufacturing method thereof
    Patent number: 11874313
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: January 16, 2024
    Assignee: MPI CORPORATION
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • PROBE CARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20220170961
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
    Type: Application
    Filed: November 3, 2021
    Publication date: June 2, 2022
    Applicant: MPI Corporation
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Amplifier array circuits and flash analog to digital converters
    Patent number: 7554477
    Abstract: An amplifier array circuit is provided. An amplifier array includes a main amplifier array comprising a plurality of first amplifiers and a plurality of reference voltages, wherein the first amplifier is coupled to an input signal and the reference voltage corresponding to the first amplifier. A first reversed reference voltage amplifier array is located on one side of the main amplifier array and has a plurality of second amplifiers coupled to the input signal and the reference voltages, respectively. A second reversed reference voltage amplifier array is located on the other side of the main amplifier array and has a plurality of third amplifiers coupled to the input signal and the reference voltages respectively. The averaging network is coupled to a first output terminal and a second output terminal of the first, second and third amplifiers.
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: June 30, 2009
    Assignee: National Taiwan University
    Inventors: Chien-Kai Hung, Hsin-Shu Chen
  • Amplifier array circuits and flash analog to digital converters
    Publication number: 20080266162
    Abstract: An amplifier array circuit is provided. An amplifier array includes a main amplifier array comprising a plurality of first amplifiers and a plurality of reference voltages, wherein the first amplifier is coupled to an input signal and the reference voltage corresponding to the first amplifier. A first reversed reference voltage amplifier array is located on one side of the main amplifier array and has a plurality of second amplifiers coupled to the input signal and the reference voltages, respectively. A second reversed reference voltage amplifier array is located on the other side of the main amplifier array and has a plurality of third amplifiers coupled to the input signal and the reference voltages respectively. The averaging network is coupled to a first output terminal and a second output terminal of the first, second and third amplifiers.
    Type: Application
    Filed: November 12, 2007
    Publication date: October 30, 2008
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Chien-Kai Hung, Hsin-Shu Chen