Abstract: An embodiment method includes: forming fins extending from a semiconductor substrate; depositing an inter-layer dielectric (ILD) layer on the fins; forming masking layers on the ILD layer; forming a cut mask on the masking layers, the cut mask including a first dielectric material, the cut mask having first openings exposing the masking layers, each of the first openings surrounded on all sides by the first dielectric material; forming a line mask on the cut mask and in the first openings, the line mask having slot openings, the slot openings exposing portions of the cut mask and portions of the masking layers, the slot openings being strips extending perpendicular to the fins; patterning the masking layers by etching the portions of the masking layers exposed by the first openings and the slot openings; and etching contact openings in the ILD layer using the patterned masking layers as an etching mask.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.

Abstract: An integrated heat dissipating assembly includes two heat sinks, a heat dissipating fan mounted between the two sinks and a body provided below the two heat sinks and the heat dissipating fan. The body is composed of a hollow body, a pump received inside the hollow body and a base attached to a bottom face of the hollow body for conducting heat from a heat source. The hollow body is divided into receiving spaces respectively communicating with water channels of the two heat sinks such that cooling water flowing inside the hollow body and the water channels of the two heat sinks is able to take away heat from the base. The heat is then dissipated by cool air due to the heat dissipating fan.

Abstract: A heat dissipator fastening kit includes two retaining bars, at least one and as many as three different brackets and multiple fasteners. The retaining bars are resilient, attach to opposite sides of an appropriate heat dissipator and respectively have two ends. The bracket attaches to a motherboard around a CPU and to the retaining bars and has several embodiments to accommodate different types of CPUs, e.g. AM2, K8, LGA775 or P4, and their motherboards. The fasteners attach the retaining bars to a heat dissipator and the bracket and the bracket to a motherboard. With such an arrangement, the heat dissipator fastening kit will be convenient and easy to use.

Abstract: An integrated heat dissipating assembly includes two heat sinks, a heat dissipating fan mounted between the two sinks and a body provided below the two heat sinks and the heat dissipating fan. The body is composed of a hollow body, a pump received inside the hollow body and a base attached to a bottom face of the hollow body for conducting heat from a heat source. The hollow body is divided into receiving spaces respectively communicating with water channels of the two heat sinks such that cooling water flowing inside the hollow body and the water channels of the two heat sinks is able to take away heat from the base. The heat is then dissipated by cool air due to the heat dissipating fan.