Patents by Inventor Chien-Kai Lin

Chien-Kai Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7466550
    Abstract: An integrated heat dissipating assembly includes two heat sinks, a heat dissipating fan mounted between the two sinks and a body provided below the two heat sinks and the heat dissipating fan. The body is composed of a hollow body, a pump received inside the hollow body and a base attached to a bottom face of the hollow body for conducting heat from a heat source. The hollow body is divided into receiving spaces respectively communicating with water channels of the two heat sinks such that cooling water flowing inside the hollow body and the water channels of the two heat sinks is able to take away heat from the base. The heat is then dissipated by cool air due to the heat dissipating fan.
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: December 16, 2008
    Assignee: Xigmatek Co., Ltd
    Inventors: Yun-Yu Yeh, Chia-Ming Tung, Chien-Kai Lin
  • Publication number: 20080266785
    Abstract: A heat dissipator fastening kit includes two retaining bars, at least one and as many as three different brackets and multiple fasteners. The retaining bars are resilient, attach to opposite sides of an appropriate heat dissipator and respectively have two ends. The bracket attaches to a motherboard around a CPU and to the retaining bars and has several embodiments to accommodate different types of CPUs, e.g. AM2, K8, LGA775 or P4, and their motherboards. The fasteners attach the retaining bars to a heat dissipator and the bracket and the bracket to a motherboard. With such an arrangement, the heat dissipator fastening kit will be convenient and easy to use.
    Type: Application
    Filed: March 22, 2007
    Publication date: October 30, 2008
    Applicant: XIGMATEK CO., LTD.
    Inventors: Yun-Yu YEH, Chia-Ming TUNG, Chien-Kai LIN
  • Publication number: 20080105407
    Abstract: An integrated heat dissipating assembly includes two heat sinks, a heat dissipating fan mounted between the two sinks and a body provided below the two heat sinks and the heat dissipating fan. The body is composed of a hollow body, a pump received inside the hollow body and a base attached to a bottom face of the hollow body for conducting heat from a heat source. The hollow body is divided into receiving spaces respectively communicating with water channels of the two heat sinks such that cooling water flowing inside the hollow body and the water channels of the two heat sinks is able to take away heat from the base. The heat is then dissipated by cool air due to the heat dissipating fan.
    Type: Application
    Filed: November 3, 2006
    Publication date: May 8, 2008
    Inventors: Yun-Yu Yeh, Chia-Ming Tung, Chien-Kai Lin