Patents by Inventor Chien-Kai Wang

Chien-Kai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11937932
    Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: March 26, 2024
    Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, TUNGHAI UNIVERSITY
    Inventors: Chieh-Liang Wu, Chun-Te Huang, Cheng-Hsu Chen, Tsai-Jung Wang, Kai-Chih Pai, Chun-Ming Lai, Min-Shian Wang, Ruey-Kai Sheu, Lun-Chi Chen, Yan-Nan Lin, Chien-Lun Liao, Ta-Chun Hung, Chien-Chung Huang, Chia-Tien Hsu, Shang-Feng Tsai
  • Publication number: 20240075558
    Abstract: A processing method of a single crystal material includes the following steps. A single crystal material is provided as an object to be modified. The amorphous phase modification apparatus is used for emitting a femtosecond laser beam to process an internal portion of the object to be modified. The processing includes using a femtosecond laser beam to form a plurality of processing lines in the internal portion of the object to be modified, wherein each of the processing lines include a zigzag pattern processing, and a processing line spacing between the plurality of processing lines is in a range of 200 ?m to 600 ?m, wherein after the object to be modified is processed, a modified layer is formed in the object to be modified. Slicing or separating out a portion in the object to be modified that includes the modified layer.
    Type: Application
    Filed: August 23, 2023
    Publication date: March 7, 2024
    Applicants: GlobalWafers Co., Ltd., mRadian Femto Sources Co., Ltd.
    Inventors: Chien Chung Lee, Bo-Kai Wang, Shang-Chi Wang, Chia-Chi Tsai, I-Ching Li
  • Publication number: 20150121575
    Abstract: The present invention relates to an atomic resolution deformation distribution measurement device that can measure a deformation rate of an atomic scale with low expense by improving resolution using an AFM system, and the atomic resolution deformation distribution measurement device includes: a laser source generating a laser beam; a first cantilever and a second cantilever provided close to a measurement specimen or a reference specimen to cause deformation by an atomic force; an optical system controlling a light path of the laser beam so as to cause the laser beam to be sequentially reflected to the first cantilever and the second cantilever and locate the first cantilever and the second cantilever to an image point; a measurement unit measuring the laser beam reflected from the second cantilever; and a stage on which a measurement specimen or a reference specimen is located and movable in X, Y, and Z axis directions.
    Type: Application
    Filed: April 10, 2014
    Publication date: April 30, 2015
    Applicants: KOREA INSTITUTE OF MACHINERY & MATERIALS, Brown University
    Inventors: Bong Kyun JANG, Jae-Hyun KIM, Hak Joo LEE, Kyung-Suk Kim, Chien-Kai Wang
  • Patent number: 9003561
    Abstract: The present invention relates to an atomic resolution deformation distribution measurement device that can measure a deformation rate of an atomic scale with low expense by improving resolution using an AFM system, and the atomic resolution deformation distribution measurement device includes: a laser source generating a laser beam; a first cantilever and a second cantilever provided close to a measurement specimen or a reference specimen to cause deformation by an atomic force; an optical system controlling a light path of the laser beam so as to cause the laser beam to be sequentially reflected to the first cantilever and the second cantilever and locate the first cantilever and the second cantilever to an image point; a measurement unit measuring the laser beam reflected from the second cantilever; and a stage on which a measurement specimen or a reference specimen is located and movable in X, Y, and Z axis directions.
    Type: Grant
    Filed: April 10, 2014
    Date of Patent: April 7, 2015
    Assignees: Korea Institute of Machinery & Materials, Brown University
    Inventors: Bong Kyun Jang, Jae-Hyun Kim, Hak Joo Lee, Kyung-Suk Kim, Chien-Kai Wang