Patents by Inventor CHIEN-KAI WEI

CHIEN-KAI WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11920036
    Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: March 5, 2024
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chien-Kai Wei, Chia-Lin Liu
  • Patent number: 11859083
    Abstract: A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: January 2, 2024
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Chien-Kai Wei
  • Publication number: 20230279226
    Abstract: A polyimide resin is obtained by polymerizing a modified polyphenylene ether resin with terminal amine groups and tetracarboxylic dianhydride. The polyimide has the following characteristics: the dissipation factor under 10 GHz electromagnetic wave is less than 0.0040; the water absorption rate is less than 0.3%; or, the temperature of glass transition is greater than 250° C.
    Type: Application
    Filed: May 10, 2022
    Publication date: September 7, 2023
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu, Chien Kai Wei
  • Publication number: 20230167297
    Abstract: A resin composition, including resin and imidazole, is provided. The resin includes cyanate ester resin and bismaleimide resin, and the imidazole does not have acidic hydrogen.
    Type: Application
    Filed: July 1, 2022
    Publication date: June 1, 2023
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Chien Kai Wei, Hung-Yi Chang
  • Publication number: 20230167298
    Abstract: A resin composition includes resin and inorganic filler. The resin includes CE resin and BMI resin, and a purity of the inorganic filler is at least greater than 99%.
    Type: Application
    Filed: July 21, 2022
    Publication date: June 1, 2023
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Chien Kai Wei, Hung-Yi Chang
  • Publication number: 20230167300
    Abstract: A resin composition including resin and other additives is provided. The resin includes bisphenol M-type cyanate ester (CE) resin and bismaleimide (BMI) resin. The other additives are selected from at least one of flame retardants, inorganic fillers, and accelerators.
    Type: Application
    Filed: September 6, 2022
    Publication date: June 1, 2023
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Chien Kai Wei, Hung-Yi Chang
  • Publication number: 20230128476
    Abstract: A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are dispersed in the resin composition. The resin composition includes 10 wt % to 40 wt % of a liquid rubber, 20 wt % to 50 wt % of a polyphenylene ether resin, and 10 wt % to 30 wt % of a crosslinker. The polyphenylene ether resin includes a first polyphenylene ether that has a bismaleimide group at a molecular end.
    Type: Application
    Filed: August 11, 2022
    Publication date: April 27, 2023
    Inventors: TE-CHAO LIAO, HUNG-YI CHANG, CHIEN-KAI WEI, CHIA-LIN LIU, WEI-RU HUANG
  • Publication number: 20230089728
    Abstract: A polyphenylene ether resin modified with benzoxazine, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the benzoxazine has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.
    Type: Application
    Filed: July 24, 2022
    Publication date: March 23, 2023
    Inventors: TE-CHAO LIAO, HUNG-YI CHANG, YU-TING LIU, CHIEN-KAI WEI, Chi-Lin Chen
  • Publication number: 20230090736
    Abstract: A polyphenylene ether resin modified with two amino functional groups, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the two amino functional groups has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.
    Type: Application
    Filed: August 15, 2022
    Publication date: March 23, 2023
    Inventors: TE-CHAO LIAO, HUNG-YI CHANG, YU-TING LIU, CHUNG-YU CHEN, CHIA-RUEY TSAI, JUNG-TSU WU, CHIEN-KAI WEI
  • Publication number: 20230091594
    Abstract: A polyphenylene ether resin modified with bismaleimide, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the bismaleimide has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.
    Type: Application
    Filed: June 27, 2022
    Publication date: March 23, 2023
    Inventors: TE-CHAO LIAO, HUNG-YI CHANG, YU-TING LIU, CHIEN-KAI WEI, Chi-Lin Chen
  • Publication number: 20230072223
    Abstract: A resin composition, including resin and peroxide, is provided. The resin includes liquid rubber resin, polyphenylene ether resin, and a crosslinking agent. The sum of the liquid rubber resin, the polyphenylene ether resin, and the crosslinking agent is 100 parts by mass. The amount of the peroxide used is between 0.1 phr and 5 phr. The peroxide is composed of tertiary butyl cumyl peroxide and an inorganic compound.
    Type: Application
    Filed: December 14, 2021
    Publication date: March 9, 2023
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Wei-Ru Huang, Hung-Yi Chang, Chia-Lin Liu, Chien Kai Wei
  • Publication number: 20230046004
    Abstract: A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.
    Type: Application
    Filed: May 9, 2022
    Publication date: February 16, 2023
    Inventors: TE-CHAO LIAO, HUNG-YI CHANG, CHIA-LIN LIU, CHIEN-KAI WEI
  • Publication number: 20230047133
    Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.
    Type: Application
    Filed: May 9, 2022
    Publication date: February 16, 2023
    Inventors: TE-CHAO LIAO, HUNG-YI CHANG, CHIEN-KAI WEI, CHIA-LIN LIU
  • Publication number: 20230002611
    Abstract: A thermosetting resin material, a prepreg, and a metal substrate are provided. The thermosetting resin material includes a resin composition and inorganic fillers. The resin composition includes: 10 wt % to 30 wt % of a polyphenylene ether resin, 40 wt % to 60 wt % of a cyanate resin, and 20 wt % to 40 wt % of a bismaleimide resin. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.
    Type: Application
    Filed: December 22, 2021
    Publication date: January 5, 2023
    Inventors: TE-CHAO LIAO, HUNG-YI CHANG, CHIEN-KAI WEI