Patents by Inventor Chien-Kuo Hsieh

Chien-Kuo Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926017
    Abstract: A cleaning process monitoring system, comprising: a cleaning container comprising an inlet for receiving a cleaning solution and an outlet for draining a waste solution; a particle detector coupled to the outlet and configured to measure a plurality of particle parameters associated with the waste solution so as to provide a real-time monitoring of the cleaning process; a pump coupled to the cleaning container and configured to provide suction force to draw solution through the cleaning system; a controller coupled to the pump and the particle detector and configured to receive the plurality of particle parameters from the particle detector and to provide control to the cleaning system; and a host computer coupled to the controller and configured to provide at least one control parameter to the controller.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Charlie Wang, Yu-Ping Tseng, Y. J. Chen, Wai-Ming Yeung, Chien-Shen Chen, Danny Kuo, Yu-Hsuan Hsieh, Hsuan Lo
  • Patent number: 11246238
    Abstract: A heat conductive device includes a heat conductive unit, a wick structure, a heat transferring unit, and a heat conductive fluid. The heat conductive unit has a closed chamber. The wick structure is disposed on the inner side surface of the closed chamber. The heat transferring unit includes a plurality of heat conductive elements agglomerated into islands and separated from each other. The heat conductive elements are disposed on the partial surface of the wick structure. The heat conductive fluid is disposed in the closed chamber. An electronic device including the heat conductive device is also provided. The heat conductive device has a good heat conductive efficiency.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: February 8, 2022
    Assignees: SULFURSCIENCE TECHNOLOGY CO., LTD., MING CHI UNIVERSITY OF TECHNOLOGY
    Inventors: Zhen-Yu Juang, Sung-Yen Wei, Chia-Chin Cheng, Chien-Kuo Hsieh