Patents by Inventor Chien-Kuo Ko

Chien-Kuo Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8093883
    Abstract: The invention provides an ion current measurement device for a tool having an ion source. The ion current measurement device comprises an ion collecting cup and a replaceable liner. The ion collecting cup is disposed in the tool and the ion collecting cup possesses a cup opening facing the ion source. The replaceable liner is disposed in the ion collecting cup and the replaceable liner entirely covers a continuous inner sidewall of the ion collecting cup.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: January 10, 2012
    Assignee: United Microelectronics Corp.
    Inventors: Jui-Fang Chen, Cheng-Hung Chang, Chung-Jung Chen, Chien-Kuo Ko, Chi-Chun Yao
  • Patent number: 8063389
    Abstract: A method of performing an ion implantation is provided. A workpiece is installed in the ion implanter. A wafer is provided in a receiving space within an ion implanter. An ion beam is generated by an ion source of the ion implanter. The bombard of the ion beam is blocked and particles generated during or after conducting the step of generating the ion beam are collected by the workpiece.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: November 22, 2011
    Assignee: United Microelectronics Corp.
    Inventors: Jui-Fang Chen, Cheng-Hung Chang, Chung-Jung Chen, Chih-Ming Yang, Chien-Kuo Ko
  • Publication number: 20100085033
    Abstract: The invention provides an ion current measurement device for a tool having an ion source. The ion current measurement device comprises an ion collecting cup and a replaceable liner. The ion collecting cup is disposed in the tool and the ion collecting cup possesses a cup opening facing the ion source. The replaceable liner is disposed in the ion collecting cup and the replaceable liner entirely covers a continuous inner sidewall of the ion collecting cup.
    Type: Application
    Filed: October 7, 2008
    Publication date: April 8, 2010
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jui-Fang Chen, Cheng-Hung Chang, Chung-Jung Chen, Chien-Kuo Ko, Chi-Chun Yao
  • Publication number: 20090166567
    Abstract: A method of performing an ion implantation is provided. A workpiece is installed in the ion implanter. A wafer is provided in a receiving space within an ion implanter. An ion beam is generated by an ion source of the ion implanter. The bombard of the ion beam is blocked and particles generated during or after conducting the step of generating the ion beam are collected by the workpiece.
    Type: Application
    Filed: March 12, 2009
    Publication date: July 2, 2009
    Applicant: United Microelectronics Corp.
    Inventors: Jui-Fang Chen, Cheng-Hung Chang, Chung-Jung Chen, Chih-Ming Yang, Chien-Kuo Ko
  • Patent number: 7518130
    Abstract: An ion beam blocking component suitable for blocking an ion beam generated by an ion source of an ion implanter is provided. The blocking component includes a front plate, a back plate, and a plurality of side plates. The front plate has at least one opening. The back plate is behind the front plate, and has a plurality of grooves formed on one surface thereof facing the front plate. The side plates are connected between the front plate and the back plate, and a receiving space is formed between these plates.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: April 14, 2009
    Assignee: United Microelectronics Corp.
    Inventors: Jui-Fang Chen, Cheng-Hung Chang, Chung-Jung Chen, Chih-Ming Yang, Chien-Kuo Ko
  • Publication number: 20080265184
    Abstract: An ion beam blocking component suitable for blocking an ion beam generated by an ion source of an ion implanter is provided. The blocking component includes a front plate, a back plate, and a plurality of side plates. The front plate has at least one opening. The back plate is behind the front plate, and has a plurality of grooves formed on one surface thereof facing the front plate. The side plates are connected between the front plate and the back plate, and a receiving space is formed between these plates.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Jui-Fang Chen, Cheng-Hung Chang, Chung-Jung Chen, Chih-Ming Yang, Chien-Kuo Ko