Abstract: A power supply with dimming control for a high-power DC LED lamp is provided. Particularly, a variable resistor is provided to a circuit of the high-power DC LED lamp for changing a current supplied to a light-emitting unit of the high-power DC LED lamp, thereby adjusting luminance (brightness) and power consumption (consumed watts) of the high-power DC LED unit of the high-power DC LED lamp. The variable resistor is provided to a driver, transformer, adaptor or power supply of the high-power DC LED lamp in a built-in manner or a remotely connected manner.

Abstract: A power supply with dimming control for a high-power DC LED lamp is provided. Particularly, a variable resistor is provided to a circuit of the high-power DC LED lamp for changing a current supplied to a light-emitting unit of the high-power DC LED lamp, thereby adjusting luminance (brightness) and power consumption (consumed watts) of the high-power DC LED unit of the high-power DC LED lamp.

Abstract: A data cartridge device for computer equipment includes a data cartridge which is assembled in an interior of an outer cover, so to be provided with a shock-proof effect. Widths of two side walls of the data cartridge are effectively decreased to reduce entire size of the data cartridge, and an upper and a lower layer of the outer covers are stacked with each other to effectively utilize a storage space. By the modularized design of the outer covers and the data cartridges, the present invention can be flexibly applied to outer housings with various heights (such as an industrial computer cabinet, or a server cabinet).

Abstract: A thermal module assembly is applied to dissipate heat energy released from a lighting assembly when working, and comprises a plurality of heat-dissipating fins being chain-connected and a fixing ring. The heat-dissipating fins are radially extended from a central region, and each heat-dissipating fin comprises a fin body, a chain-connected mechanism and an extended folded plate. The chain-connected mechanism is located on an inner side of the fin body for chain-connecting the neighbor heat-dissipating fin, and the extended folded plate is located on an outer side of the fin body. The fixing ring hitches the outer side of each heat-dissipating fin, and the fixing ring is formed with a plurality of positioning folded plates along an inner ring edge thereof, so as to fix the extended folded plate and keep any two neighboring heat-dissipating fins in a unit pitch distance.

Abstract: A three-dimensional miniaturized power supply is composed of at least two of a first circuit board and a second circuit board which are assembled in a chamber of a container in a three-dimensional spatial form, wherein an insulation spacing, which is in compliance with an ITE safety regulation, is provided between a circuit of the first circuit board and a circuit of the second circuit board, allowing an area and a volume of the power supply to be miniaturized, such that the power supply can be emplaced in a small container.

Abstract: An in-wall LED lamp can be adjustable in angles is provided. More particularly, the LED lamp includes a light-emitting assembly that is mounted in a frame and adjustable to various projection angles. The LED lamp is characterized in that a lamp body is provided with heat-dissipation fins, a transformer, and a light-emitting unit, and the lamp body is coupled to an in-wall frame by screws, so as for the LED lamp to have a simplified structure and be adjustable to various projection angles.

Abstract: An LED road lamp includes a heat dissipater module containing circuit boards, LED chips, and a cooling fin seat; and a completely sealed power supply. By directly using the cooling fin seat as an outer cover of a road lamp to contact with atmosphere for cooling, and directly transmitting heat from the LED chips and the circuit boards to a stand pipe, a dual cooling effect is achieved. Heat of the power supply is dissipated from the stand pipe through its sealed outer casing, to largely increase cooling area, lower temperature, and increase a cooling efficiency, preventing the power supply from being affected by ambient weather. Therefore, lifetimes of usage of the LED circuit boards, the LED chips, and the power supply are prolonged, the circuit boards are quickly assembled on and disassembled from a cooling base, and convenience in assembling and disassembling the circuit boards is improved.

Abstract: A heat dissipating device for LED light-emitting module, which embodies: A heat dissipating unit; An LED light-emitting module, in which light emitting diode are connected to a baseplate; A heat dissipating base; The heat dissipating base and the heat dissipating unit are mutually fixedly joined to form an integrated body, and the heat conducting layer is used to uniformly and efficiently transmit heat from the baseplate to the heat dissipating base, whereupon the heat dissipating base then transmits the heat to the heat dissipating unit. Accordingly, the quick and effective direct heat conduction of the heat conducting layer is used to conduct away and dissipate the high temperature produced by the LED, thereby extending serviceable life and improving stability and luminous efficiency of the LED, thus increasing heat dissipation efficiency of the entire LED light-emitting module.

Abstract: The main objective of the present invention is a modular outdoor LED power supply disposed inside or outside of an outdoor LED light or an LED device so as to decrease the distance between the power supply and a LED light base for preventing an output power drop from an output of the power supply to the LED light base. One or more than one power supply can be disposed in a groove of a main heat-dissipating outer cover of the power supply according to the actual requirements, so that the production and installation thereof become more convenient. The power supply is characterized by being water-resistant, moisture-proof, dust-proof, antirust and direct heat-dissipating, wherein the water-resistant effect is above the IP 65 standard, and thus the reliability and the lifetime of the power supply are increased.

Abstract: A connection device of an LED lamp and cooling fins is composed of a central tube unit, above which is connected with a ring-shape lamp seat, and below which is connected with a lower housing; and a plurality of cooling fins which are connected on surfaces of the lamp seat, the central tube unit, and a lower annular disk of the central tube unit. A sheet of each cooling fin is punched into at least one protruded member, and each protruded member of one cooling fin is abutted on a surface of the adjacent cooling fin; therefore, by the abutting of the protruded members of every two adjacent cooling fins, stability, intensity, and heat transmissibility of all the cooling fins can be improved, and spacing between every two adjacent cooling fins can be kept at a constant.

Abstract: The main objective of the present invention is a modular outdoor LED power supply disposed inside or outside of an outdoor LED light or an LED device so as to decrease the distance between the power supply and a LED light base for preventing an output power drop from an output of the power supply to the LED light base. One or more than one power supply can be disposed in a groove of a main heat-dissipating outer cover of the power supply according to the actual requirements, so that the production and installation thereof become more convenient. The power supply is characterized by being water-resistant, moisture-proof, dust-proof, antirust and direct heat-dissipating, wherein the water-resistant effect is above the IP 65 standard, and thus the reliability and the lifetime of the power supply are increased.

Abstract: An LED road lamp includes a heat dissipater module containing circuit boards, LED chips, and a cooling fin seat; and a completely sealed power supply. By directly using the cooling fin seat as an outer cover of a road lamp to contact with atmosphere for cooling, and directly transmitting heat from the LED chips and the circuit boards to a stand pipe, a dual cooling effect is achieved. Heat of the power supply is dissipated from the stand pipe through its sealed outer casing, to largely increase cooling area, lower temperature, and increase a cooling efficiency, preventing the power supply from being affected by ambient weather. Therefore, lifetimes of usage of the LED circuit boards, the LED chips, and the power supply are prolonged, the circuit boards are quickly assembled on and disassembled from a cooling base, and convenience in assembling and disassembling the circuit boards is improved.

Abstract: A connection device of an LED lamp and cooling fins is composed of a central tube unit, above which is connected with a ring-shape lamp seat, and below which is connected with a lower housing; and a plurality of cooling fins which are connected on surfaces of the lamp seat, the central tube unit, and a lower annular disk of the central tube unit. A sheet of each cooling fin is punched into at least one protruded member, and each protruded member of one cooling fin is abutted on a surface of the adjacent cooling fin; therefore, by the abutting of the protruded members of every two adjacent cooling fins, stability, intensity, and heat transmissibility of all the cooling fins can be improved, and spacing between every two adjacent cooling fins can be kept at a constant.

Abstract: A three-dimensional miniaturized power supply is composed of at least two of a first circuit board and a second circuit board which are assembled in a chamber of a container in a three-dimensional spatial form, wherein an insulation spacing, which is in compliance with an ITE safety regulation, is provided between a circuit of the first circuit board and a circuit of the second circuit board, allowing an area and a volume of the power supply to be miniaturized, such that the power supply can be emplaced in a small container.

Abstract: A hermetic modular power supply is a lumpish power supply which is completely enclosed and fixed as a heating unit formed by a circuit board and electronic elements, with a heat conductive and dissipative material. A modular base has a plural set of power plug holes, and at least one power supply can be plugged into the power plug holes, such that the power supply can be quickly and conveniently plugged into the power plug holes for use, selectively. In addition, the power supply has functions of improving heat dissipation efficiency and prolonging a lifetime of usage of the heating unit.

Abstract: A data cartridge device for computer equipment includes a data cartridge which is assembled in an interior of an outer cover, so to be provided with a shock-proof effect. Widths of two side walls of the data cartridge are effectively decreased to reduce entire size of the data cartridge, and an upper and a lower layer of the outer covers are stacked with each other to effectively utilize a storage space. By the modularized design of the outer covers and the data cartridges, the present invention can be flexibly applied to outer housings with various heights (such as an industrial computer cabinet, or a server cabinet).

Abstract: A memory cooling device includes a left clamping seat and a right clamping seat that clamp at least one heat pipe. At least one side of the heat pipe is a straight surface which is affixed with a clamping surface of the left clamping seat or the right clamping seat through a thermal adhesive, and another surface of the thermal adhesive is affixed on a bottom surface of the memory, such that operating temperature generated by the working memory can be directly transmitted to the heat pipe and the left and right clamping seats through the thermal adhesive, to increase the heat dissipation efficiency for the memory, and actually and effectively dissipate the heat, thereby improving a lifetime of usage of the memory.

Abstract: A heat dissipating device for LED light-emitting module, which embodies: A heat dissipating unit; An LED light-emitting module, in which light emitting diode are connected to a baseplate; A heat dissipating base; The heat dissipating base and the heat dissipating unit are mutually fixedly joined to form an integrated body, and the heat conducting layer is used to uniformly and efficiently transmit heat from the baseplate to the heat dissipating base, whereupon the heat dissipating base then transmits the heat to the heat dissipating unit. Accordingly, the quick and effective direct heat conduction of the heat conducting layer is used to conduct away and dissipate the high temperature produced by the LED, thereby extending serviceable life and improving stability and luminous efficiency of the LED, thus increasing heat dissipation efficiency of the entire LED light-emitting module.

Abstract: A thermal module assembly is applied to dissipate heat energy released from a lighting assembly when working, and comprises a plurality of heat-dissipating fins being chain-connected and a fixing ring. The heat-dissipating fins are radially extended from a central region, and each heat-dissipating fin comprises a fin body, a chain-connected mechanism and an extended folded plate. The chain-connected mechanism is located on an inner side of the fin body for chain-connecting the neighbor heat-dissipating fin, and the extended folded plate is located on an outer side of the fin body. The fixing ring hitches the outer side of each heat-dissipating fin, and the fixing ring is formed with a plurality of positioning folded plates along an inner ring edge thereof, so as to fix the extended folded plate and keep any two neighboring heat-dissipating fins in a unit pitch distance.

Abstract: A three-dimensional miniaturized power supply is composed of at least two of a first circuit board and a second circuit board which are assembled in a chamber of a container in a three-dimensional spatial form, wherein an insulation spacing, which is in compliance with an ITE safety regulation, is provided between a circuit of the first circuit board and a circuit of the second circuit board, allowing an area and a volume of the power supply to be miniaturized, such that the power supply can be emplaced in a small container.