Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a gate structure over the substrate, a layer of dielectric material over the gate structure, a source/drain (S/D) contact layer formed through and adjacent to the gate structure, and a trench conductor layer over and in contact with the S/D contact layer. The S/D contact layer can include a layer of platinum-group metallic material and a silicide layer formed between the substrate and the layer of platinum-group metallic material. A top width of a top portion of the layer of platinum-group metallic material can be greater than or substantially equal to a bottom width of a bottom portion of the layer of platinum-group metallic material.

Abstract: An integrated circuit (IC) comprising an enhanced passivation scheme for pad openings and trenches is provided. In some embodiments, an interlayer dielectric (ILD) layer covers a substrate and at least partially defines a trench. The trench extends through the ILD layer from a top of the ILD layer to the substrate. A conductive pad overlies the ILD layer. A first passivation layer overlies the ILD layer and the conductive pad, and further defines a pad opening overlying the conductive pad. A second passivation layer overlies the ILD layer, the conductive pad, and the first passivation layer, and further lines sidewalls of the first passivation layer in the pad opening and sidewalls of the ILD layer in the trench. Further, the second passivation layer has a low permeability for moisture or vapor relative to the ILD layer.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.

Abstract: A wireless visible bougie based on cloud transmission mainly includes a WIFI or 3G/4G communication module and mediation platform server placed on an internet cloud. The WIFI or 3G/4G communication module is connected to and exchanges data with an endpoint of a mediation platform server placed on a cloud of an internet through the internet to store image data captured by the visible bougie, thereby building a database in the mediation platform server of the cloud and then forming data control on the cloud, and allowing relevant personnel to download the data from the cloud for observation so as to achieve the objects of mutual observation and learning.

Abstract: A miniature observation mirror imaging lens structure is disclosed, an outer tube body is in engagement with a front end of a bougie, and only an optical filter, lens, integrated circuit and circuit board are configured inside the outer tube body in sequence from front to rear, where a light emitting diode (LED) is configured on one side of the optical filter, electronic elements are soldered on the circuit board, a upper edge and lower edge thereof are respectively configured with a plurality of upper contacts and lower contacts; the integrated circuit can be linked with a control circuit on the rear end of the bougie after it is soldered on the upper contacts and conducting lines are soldered on the lower contacts, thereby allowing the diameter of the imaging lens on the front end of the bougie to be reduced for facilitating endotracheal intubation operation.

Abstract: A miniature observation mirror imaging lens structure is disclosed, an outer tube body is in engagement with a front end of a bougie, and only an optical filter, lens and integrated circuit are configured inside the outer tube body in sequence from front to rear, where a light emitting diode (LED) is configured on one side of the optical filter, electronic elements are soldered on the integrated circuit, a lower edge thereof is configured with a plurality of contacts on which electronic elements are soldered; the contacts are connected with conducting lines so as to be in connection with a control circuit configured on the rear end of the bougie, furthermore, the contacts, electronic element and conducting lines are encapsulated with sealing glue, thereby allowing the diameter of the imaging lens to be reduced for facilitating endotracheal intubation operation through the simplification of elements on the front end.

Abstract: The instant disclosure relates to a lighting module, which includes at least a pair of light fixtures. Each of the light fixtures has a frame, a light source assembly, and a cover. The frame has a base plate, a first side plate, and a second side plate. The first side plate has a first engaging portion, and the second side plate has a second engaging portion and a plurality of third engaging portions. The two light fixtures are interlocked to one another by the following means: the first engaging portion and the first side plate of one light fixture are engaged to the second engaging portion and the third engaging portions of the other light fixture, respectively.