Patents by Inventor Chien-Liang Lee

Chien-Liang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8697489
    Abstract: A package structure and a package process are provided. In the package process, firstly, a first electronic component having a plurality of first conductive bumps at a bottom thereof is provided. Then, a first insulation paste is coated on the first conductive bumps. The first electronic component is disposed on a circuit substrate having a plurality of substrate pads, and the first conductive bumps are respectively situated on the substrate pads. Next, a heating process is performed to both of the first conductive bumps and the first insulation paste, wherein the first conductive bumps is reflowed to bond the first electronic component and the substrate pads, and the first insulation paste is cured.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: April 15, 2014
    Assignee: HTC Corporation
    Inventor: Chien-Liang Lee
  • Publication number: 20130299231
    Abstract: A holder of a portable electric device includes a main body formed integrally. The main body has an intermediate portion formed with a recessed wire-collecting portion, having one end provided with a holding portion having an outer wall disposed with a crevice and a wire-positioning hole bored under the crevice, and another end formed with a clamping portion having an outer wall cut with a clamping opening, a crevice, and a wire-positioning hole bored inside the crevice. Thus, the clamping opening can clamp the portable electric device and the holding portion can be fixed on a table top to have the portable electric device positioned obliquely at an appropriate angle for facilitating browsing and operating. Further, the wires of the portable electric device or of its peripheral products can be positioned in the wire-collecting holes and orderly wound on the wire-collecting portion.
    Type: Application
    Filed: May 9, 2012
    Publication date: November 14, 2013
    Inventors: Chien Liang LEE, Peng Li XU
  • Patent number: 8269619
    Abstract: A wireless light indication and control device connected with a helmet is provided. The wireless light indication and control device includes a direction detector, a wireless transmitter, and at least one light element, wherein the direction detector senses a movement of the helmet to generate a turning signal, the wireless transmitter receives the turning signal and cooperates with a frequency hopping unit and a matching unit to generate a wireless signal, and the light element includes a wireless receiver for receiving the wireless signal. As the user wears the helmet of the present invention, the light can generate warning effect based on the movement of the helmet, so as to provide the user a more comprehensive traffic safety.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: September 18, 2012
    Assignee: Abocom Systems, Inc.
    Inventor: Chien-Liang Lee
  • Publication number: 20110057781
    Abstract: A wireless light indication and control device connected with a helmet is provided. The wireless light indication and control device includes a direction detector, a wireless transmitter, and at least one light element, wherein the direction detector senses a movement of the helmet to generate a turning signal, the wireless transmitter receives the turning signal and cooperates with a frequency hopping unit and a matching unit to generate a wireless signal, and the light element includes a wireless receiver for receiving the wireless signal. As the user wears the helmet of the present invention, the light can generate warning effect based on the movement of the helmet, so as to provide the user a more comprehensive traffic safety.
    Type: Application
    Filed: September 10, 2009
    Publication date: March 10, 2011
    Inventor: Chien-Liang LEE
  • Publication number: 20110031605
    Abstract: A package structure and a package process are provided. In the package process, firstly, a first electronic component having a plurality of first conductive bumps at a bottom thereof is provided. Then, a first insulation paste is coated on the first conductive bumps. The first electronic component is disposed on a circuit substrate having a plurality of substrate pads, and the first conductive bumps are respectively situated on the substrate pads. Next, a heating process is performed to both of the first conductive bumps and the first insulation paste, wherein the first conductive bumps is reflowed to bond the first electronic component and the substrate pads, and the first insulation paste is cured.
    Type: Application
    Filed: December 11, 2009
    Publication date: February 10, 2011
    Applicant: HTC CORPORATION
    Inventor: Chien-Liang Lee
  • Patent number: 6572673
    Abstract: A process for preparing metal nanoparticles, comprising reacting suitable metal salts and anionic surfactant containing an anionic group of carboxylic group (COO−), sulfate group (SO42−) or sulfonate group (SO32−) as reducing agent in water under reflux at a temperature of 50-140° C., such that under the reducing power of said anionic surfactant itself, the metal salts can be effectively reduced into metal nanoparticles having a uniform particle size and that the reaction will be not too fast, no large microparticle will be formed, the yield will not be lowered, and the nanoparticle thus prepared can be dispersed stably in polar and non-polar solvent.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: June 3, 2003
    Assignee: Chang Chun Petrochemical Co., Ltd.
    Inventors: Chien-Liang Lee, Chi-Chao Wan
  • Publication number: 20020197404
    Abstract: A method of activating a non-conductive substrate for use in electroless deposition is proposed, in which an aqueous solution containing nanoparticles of noble metals and their alloys is used as an activation solution in an electroless plating process, so as to electrolessly deposit a conductive metal deposition on the substrate and into micrometer-sized trenches formed on the substrate. By using this method with provision of a solution of a copper or nickel salt, copper or nickel can be deposited on the non-conductive substrate, allowing high aspect-ratio trenches on the substrate to be filled with copper or nickel for subsequent use in fabrication of integrated circuit interconnection.
    Type: Application
    Filed: April 11, 2002
    Publication date: December 26, 2002
    Applicant: Chang Chun Plastics Co., Ltd., Taiwan R.O.C.
    Inventors: Chien-Liang Lee, Chi-Chao Wan
  • Publication number: 20020194958
    Abstract: A process for preparing metal nanoparticles, comprising reacting suitable metal salts and anionic surfactant containing an anionic group of carboxylic group (COO−), sulfate group (SO42−) or sulfonate group (SO32−) as reducing agent in water under reflux at a temperature of 50-140° C., such that under the reducing power of said anionic surfactant itself, the metal salts can be effectively reduced into metal nanoparticles having a uniform particle size and that the reaction will be not too fast, no large microparticle will be formed, the yield will not be lowered, and the nanoparticle thus prepared can be dispersed stably in polar and non-polar solvent.
    Type: Application
    Filed: June 8, 2001
    Publication date: December 26, 2002
    Inventors: Chien-Liang Lee, Chi-Chao Wan