Patents by Inventor Chien-Lin Liu
Chien-Lin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250070092Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.Type: ApplicationFiled: November 12, 2024Publication date: February 27, 2025Inventors: Harry-Hak-Lay Chuang, Wei-Cheng Wu, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang, Chung-Jen Huang, Shun-Kuan Lin, Chien Lin Liu, Ping-Tzu Chen, Yung Chun Tu
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Patent number: 12191282Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.Type: GrantFiled: March 23, 2022Date of Patent: January 7, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Harry-Hak-Lay Chuang, Wei-Cheng Wu, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang, Chung-Jen Huang, Shun-Kuan Lin, Chien Lin Liu, Ping-Tzu Chen, Yung Chun Tu
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Publication number: 20240153895Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.Type: ApplicationFiled: April 19, 2023Publication date: May 9, 2024Inventors: Harry-HakLay CHUANG, Wei-Cheng WU, Chung-Jen HUANG, Yung Chun TU, Chien Lin LIU, Shun-Kuan LIN, Ping-tzu CHEN
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Publication number: 20230170328Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.Type: ApplicationFiled: March 23, 2022Publication date: June 1, 2023Inventors: Harry-Hak-Lay Chuang, Wei Cheng Wu, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang, Chung-Jen Huang, Shun-Kuan Lin, Chien Lin Liu, Ping-Tzu Chen, Yung Chun Tu
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Patent number: 11368115Abstract: A vehicle driving device is driven by a power unit. A three-phase motor includes a first stator winding and a second stator winding. The first stator winding is connected in parallel to the second stator winding, and the first stator winding and the second stator winding are synchronized with each other. A first current sensor is coupled to the first stator winding for measuring a first-phase current. A second current sensor is coupled to the first stator winding for measuring a second-phase current. A third-phase current of the first stator winding is generated according to a calculating procedure of the first-phase current and the second-phase current. A duty cycle between a first power module and a second power module is controlled according to a feedback compensation of the first-phase current, the second-phase current and the third-phase current.Type: GrantFiled: December 20, 2020Date of Patent: June 21, 2022Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd.Inventors: Chih-Huang Chen, Su-Hui Wang, Chih-Hung Huang, Lee-Han Lin, Chien-Lin Liu
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Patent number: 11349422Abstract: A power detecting device includes a vehicle driving system, a battery detecting module and a controlling module. A first stator winding and a second stator winding are synchronized and connected in parallel with each other. A first end of a first current sensor is coupled to a first-phase winding end of the first stator winding for measuring a first-phase current. A first end of a second current sensor is coupled to a second-phase winding end of the first stator winding for measuring a second-phase current. The battery detecting module is coupled to a first power supply for measuring a current signal and a voltage signal. A controller generates a first power according to the current signal and the voltage signal and generates a second power according to a plurality of data from a database. The controller compares the first power with the second power to generate a detecting result.Type: GrantFiled: December 24, 2020Date of Patent: May 31, 2022Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd.Inventors: Chih-Huang Chen, Su-Hui Wang, Chih-Hung Huang, Lee-Han Lin, Chien-Lin Liu
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Publication number: 20220103103Abstract: A vehicle driving device is driven by a power unit. A three-phase motor includes a first stator winding and a second stator winding. The first stator winding is connected in parallel to the second stator winding, and the first stator winding and the second stator winding are synchronized with each other. A first current sensor is coupled to the first stator winding for measuring a first-phase current. A second current sensor is coupled to the first stator winding for measuring a second-phase current. A third-phase current of the first stator winding is generated according to a calculating procedure of the first-phase current and the second-phase current. A duty cycle between a first power module and a second power module is controlled according to a feedback compensation of the first-phase current, the second-phase current and the third-phase current.Type: ApplicationFiled: December 20, 2020Publication date: March 31, 2022Inventors: Chih-Huang CHEN, Su-Hui WANG, Chih-Hung HUANG, Lee-Han LIN, Chien-Lin LIU
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Publication number: 20220103105Abstract: A power detecting device includes a vehicle driving system, a battery detecting module and a controlling module. A first stator winding and a second stator winding are synchronized and connected in parallel with each other. A first end of a first current sensor is coupled to a first-phase winding end of the first stator winding for measuring a first-phase current. A first end of a second current sensor is coupled to a second-phase winding end of the first stator winding for measuring a second-phase current. The battery detecting module is coupled to a first power supply for measuring a current signal and a voltage signal. A controller generates a first power according to the current signal and the voltage signal and generates a second power according to a plurality of data from a database. The controller compares the first power with the second power to generate a detecting result.Type: ApplicationFiled: December 24, 2020Publication date: March 31, 2022Inventors: Chih-Huang CHEN, Su-Hui WANG, Chih-Hung HUANG, Lee-Han LIN, Chien-Lin LIU
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Publication number: 20170312791Abstract: A method and apparatus for substrate, such as glass substrate, surface cleaning include one or more nozzles to deliver a cleaning fluid to one or more edges of a substrate and a roller that includes a plurality of angled channels on the outer surface of the roller. The roller is configured to contact a surface of the substrate and the angled channels are configured to laterally channel fluid and particles toward opposite axial ends of the roller.Type: ApplicationFiled: November 17, 2015Publication date: November 2, 2017Inventors: Chen-Kun Kuo, Chien-Lin Liu, Kuo-Sung Pan
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Publication number: 20020183747Abstract: A spinal fixation apparatus consists of a connection means, a plurality of implant elements, washers and fastening elements. The implant elements are fastened to chines of the spine, and then the connection means is coupled on the upper side of the implant elements. Then corresponding washers and fastening elements are sequentially assembled. Finally the fastening elements are tightened on the implant elements to fasten the injured or ill-inflicted chines to the splint securely to form an integrated member to achieve a secure anchoring effect.Type: ApplicationFiled: May 28, 2002Publication date: December 5, 2002Applicant: Merries International Inc.Inventors: Wei-Tai Jao, Chih-Ming Wu, Chen-Dao Shaio, Ben-Hwa Jang, Audy Choeo, Chien-Lin Liu, Hung-Yi Chen
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Patent number: 6328739Abstract: An enhanced spine fixation apparatus for fixing a number of vertebrae of a spine column is disclosed. The spine fixation apparatus comprises a plurality of pedicel screws, a plurality of coupling blocks, a plurality of first securing elements, a plurality of second securing elements, a connecting rod, and a plurality of third securing elements. Each coupling block is secured on a pedicel screw by the first securing element while the connecting rod is secured on the coupling block by the second securing element. Each first securing element is fixed by the third securing element. By virtue of the provisions of a first and a second spherical convex surfaces as well as a first and a second recesses respectively on the surfaces of the pedicel screw and the first securing element as well as the surfaces of the coupling block which are being abutted, an adjustment concerning a vertical tilt angle and a horizontal rotating angle of the coupling block relative to the pedicel screw is available.Type: GrantFiled: November 8, 1999Date of Patent: December 11, 2001Assignee: Industrial Technology Research InstituteInventors: Chien-Lin Liu, Chi-Ming Shih, Tze-Hong Wong, Ben-Hwa Jang, Wei-Tai Jao, Chih-Ming Wu, Chen-Dao Shaio, Audy Choeo