Patents by Inventor Chien-Lin Wang
Chien-Lin Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240114619Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.Type: ApplicationFiled: December 2, 2022Publication date: April 4, 2024Applicant: InnoLux CorporationInventors: Cheng-Chi WANG, Chin-Ming HUANG, Chien-Feng LI, Chia-Lin YANG
-
Publication number: 20230253736Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.Type: ApplicationFiled: April 21, 2023Publication date: August 10, 2023Inventors: John C. Laurx, Chien-Lin Wang, Vivek Shah
-
Patent number: 11652321Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.Type: GrantFiled: May 24, 2021Date of Patent: May 16, 2023Assignee: Molex, LLCInventors: John C. Laurx, Chien-Lin Wang, Vivek Shah
-
Publication number: 20210281016Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.Type: ApplicationFiled: May 24, 2021Publication date: September 9, 2021Applicant: Molex, LLCInventors: John C. LAURX, Chien-Lin WANG, Vivek SHAH
-
Patent number: 11018454Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. The wafers omit a ground terminal between adjacent terminal pairs. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.Type: GrantFiled: May 4, 2020Date of Patent: May 25, 2021Assignee: Molex, LLCInventors: John C. Laurx, Chien-Lin Wang, Vivek Shah
-
Patent number: 10879651Abstract: A connector system includes a wafer that has a shield that replaces standard ground terminals and an additional isolation shield to provide enhanced electrical isolation. To further improve electrical performance, transmit and receive channels can be provided in separate wafers on one side of connector system with a space or wafer between the transmit and signal wafers. On the other side of the connector system the wafer will have one or two spaces that are either black or filled with terminals that operate at lower frequencies. A conductive insert can provide further isolation intra-wafer.Type: GrantFiled: June 16, 2017Date of Patent: December 29, 2020Assignee: Molex, LLCInventors: John Laurx, Chien-Lin Wang, Vivek Shah
-
Publication number: 20200266583Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. The wafers omit a ground terminal between adjacent terminal pairs. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.Type: ApplicationFiled: May 4, 2020Publication date: August 20, 2020Applicant: Molex, LLCInventors: John C. LAURX, Chien-Lin WANG, Vivek SHAH
-
Patent number: 10644453Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. The wafers omit a ground terminal between adjacent terminal pairs. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.Type: GrantFiled: December 14, 2016Date of Patent: May 5, 2020Assignee: Molex, LLCInventors: John C. Laurx, Chien-Lin Wang, Vivek Shah
-
Publication number: 20200119498Abstract: A connector system includes a wafer that has a shield that replaces standard ground terminals and an additional isolation shield to provide enhanced electrical isolation. To further improve electrical performance, transmit and receive channels can be provided in separate wafers on one side of connector system with a space or wafer between the transmit and signal wafers. On the other side of the connector system the wafer will have one or two spaces that are either black or filled with terminals that operate at lower frequencies. A conductive insert can provide further isolation intra-wafer.Type: ApplicationFiled: June 16, 2017Publication date: April 16, 2020Applicant: Molex, LLCInventors: John LAURX, Chien-Lin WANG, Vivek SHAH
-
Patent number: 10199774Abstract: A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.Type: GrantFiled: November 27, 2017Date of Patent: February 5, 2019Assignee: Molex, LLCInventors: John C. Laurx, Vivek M. Shah, Chien-Lin Wang, Peerouz Amleshi
-
Publication number: 20180358751Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. The wafers omit a ground terminal between adjacent terminal pairs. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.Type: ApplicationFiled: December 14, 2016Publication date: December 13, 2018Applicant: Molex, LLCInventors: John C. LAURX, Chien-Lin WANG, Vivek SHAH
-
Publication number: 20180083389Abstract: A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.Type: ApplicationFiled: November 27, 2017Publication date: March 22, 2018Applicant: Molex, LLCInventors: John C. Laurx, Vivek M. Shah, Chien-Lin Wang, Peerouz Amleshi
-
Patent number: 9831607Abstract: A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.Type: GrantFiled: March 4, 2016Date of Patent: November 28, 2017Assignee: Molex, LLCInventors: John C. Laurx, Vivek M. Shah, Chien-Lin Wang, Peerouz Amleshi
-
Publication number: 20160261075Abstract: A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.Type: ApplicationFiled: March 4, 2016Publication date: September 8, 2016Applicant: Molex, LLCInventors: John C. Laurx, Vivek M. Shah, Chien-Lin Wang, Peerouz Amleshi
-
Patent number: D1024932Type: GrantFiled: March 10, 2022Date of Patent: April 30, 2024Assignee: WALSIN LIHWA CORPORATIONInventors: Ko-Ming Chen, Shih-Hsiang Wang, An-Hung Lin, Min-Chuan Wu, Shao-Pei Lin, Chien-Chung Ni, Chun-Ying Lin