Patents by Inventor Chien-Lin Wu
Chien-Lin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240153895Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.Type: ApplicationFiled: April 19, 2023Publication date: May 9, 2024Inventors: Harry-HakLay CHUANG, Wei-Cheng WU, Chung-Jen HUANG, Yung Chun TU, Chien Lin LIU, Shun-Kuan LIN, Ping-tzu CHEN
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Patent number: 11967601Abstract: A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.Type: GrantFiled: August 13, 2021Date of Patent: April 23, 2024Assignee: Prilit Optronics, Inc.Inventors: Biing-Seng Wu, Chao-Wen Wu, Chun-Bin Wen, Chien-Lin Lai, Hsing-Ying Lee
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Publication number: 20240120313Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
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Publication number: 20210225190Abstract: An interactive education system includes a storage, an output device, a processor, an input device and a recognition device. The processor controls the output device to produce voice based on a hint on a target answer stored in the storage. The recognition device generates a response through performing speech recognition on input data generated by the input device from voice of a user. The processor controls the output device to produce voice based on whether the response matches the target answer or any relevant characteristic. Depending on a count of consecutive occurrences of a failed event, the processor controls the output device to produce voice based on another hint or the target answer.Type: ApplicationFiled: September 2, 2020Publication date: July 22, 2021Applicant: National Taiwan Normal UniversityInventors: Jon-Chao HONG, Chia-Hung YEH, Miao-Ling HSIEH, Jung LIN, Chien-Lin WU, Wan-Shan LIN
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Patent number: 10871514Abstract: A handler for holding an electronic device during high voltage testing includes conductive lead guides for shorting leads on one side of the isolator together and connectors connecting the lead guides to conductors.Type: GrantFiled: May 10, 2016Date of Patent: December 22, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Chi-Tsung Lee, Ming-Chuan You, Chien-Lin Wu, David Anthony Graham, Andrew Patrick Couch
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Patent number: 10205125Abstract: This invention discloses a method of manufacturing a package assembly, a package assembly, and a display device. The method includes: providing a base substrate, provided with a first pattern layer and a second pattern layer located outside the first pattern layer; forming a first cladding layer on the base substrate, the first cladding layer covering a second pattern layer and a region surrounded by the second pattern layer; forming a second cladding layer on the first cladding layer, the second cladding layer covering a top portion of the first pattern layer and a region surrounded by the first pattern layer; forming an organic layer on the first cladding layer and the second cladding layer, the organic layer covering the first pattern layer and a region surrounded by the first pattern layer; and forming a third cladding layer on the organic layer and the first cladding layer.Type: GrantFiled: August 18, 2017Date of Patent: February 12, 2019Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.Inventors: Fenghao Cai, Dong Hwan Kim, Chien Lin Wu, Young Su Kim
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Publication number: 20190019985Abstract: This invention discloses a method of manufacturing a package assembly, a package assembly, and a display device. The method includes: providing a base substrate, provided with a first pattern layer and a second pattern layer located outside the first pattern layer; forming a first cladding layer on the base substrate, the first cladding layer covering a second pattern layer and a region surrounded by the second pattern layer; forming a second cladding layer on the first cladding layer, the second cladding layer covering a top portion of the first pattern layer and a region surrounded by the first pattern layer; forming an organic layer on the first cladding layer and the second cladding layer, the organic layer covering the first pattern layer and a region surrounded by the first pattern layer; and forming a third cladding layer on the organic layer and the first cladding layer.Type: ApplicationFiled: August 18, 2017Publication date: January 17, 2019Applicant: Wuhan China Star Optoelectronics Semiconductor Dis play Technology Co., Ltd.Inventors: Fenghao CAI, DONG HWAN KIM, CHIEN LIN WU, YOUNG SU KIM
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Publication number: 20170328947Abstract: A handler for holding an electronic device during high voltage testing includes conductive lead guides for shorting leads on one side of the isolator together and connectors connecting the lead guides to conductors.Type: ApplicationFiled: May 10, 2016Publication date: November 16, 2017Inventors: Chi-Tsung Lee, Ming-Chuan You, Chien-Lin Wu, David Anthony Graham, Andrew Patrick Couch
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Patent number: 8425077Abstract: An illuminating cosmetic applicator is revealed. The illuminating cosmetic applicator includes a cosmetic applicator part, a connector, and a lighting unit. The cosmetic applicator part is made from a transparent material. One end of the connector is connected to the cosmetic applicator part while the other end thereof is mounted with the lighting unit. The lighting unit consists of a light gathering cover mounted in a housing, and a light emitting element in the light gathering cover. Batteries are received in the housing. Moreover, a groove mounted with a switch is arranged at the housing. A block is connected to the inner side of the switch. Thereby light is emitted through the cosmetic applicator part while applying cosmetics in a dark place. Furthermore, the lighting unit can be separated with the cosmetic applicator part and used for illumination independently. The illuminating cosmetic applicator has more practical value.Type: GrantFiled: May 6, 2011Date of Patent: April 23, 2013Assignee: Li Shin Tai Co., Ltd.Inventor: Chien-Lin Wu
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Publication number: 20120281396Abstract: An illuminating cosmetic applicator is revealed. The illuminating cosmetic applicator includes a cosmetic applicator part, a connector, and a lighting unit. The cosmetic applicator part is made from a transparent material. One end of the connector is connected to the cosmetic applicator part while the other end thereof is mounted with the lighting unit. The lighting unit consists of a light gathering cover mounted in a housing, and a light emitting element in the light gathering cover. Batteries are received in the housing. Moreover, a groove mounted with a switch is arranged at the housing. A block is connected to the inner side of the switch. Thereby light is emitted through the cosmetic applicator part while applying cosmetics in a dark place. Furthermore, the lighting unit can be separated with the cosmetic applicator part and used for illumination independently. The illuminating cosmetic applicator has more practical value.Type: ApplicationFiled: May 6, 2011Publication date: November 8, 2012Applicant: LI SHIN TAI CO., LTD.Inventor: CHIEN-LIN WU
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Patent number: 8023204Abstract: A compact short back focus imaging lens system with two lenses is revealed and includes along the optical axis from an object side to an image side: an aperture stop, a first lens with positive refractive power that is a meniscus aspherical lens with convex surface facing the object side, a second lens with negative refractive power that is a meniscus aspherical lens with convex surface facing the image side, an IR cut-off filter and an image sensor. Moreover, the following conditions are satisfied by the imaging lens system: - 0.3 ? f 1 f 2 ? - 0.01 0.25 ? bf TL ? 0.4 wherein f1 is focal length of the first lens, f2 is focal length of the second lens, bf is back focal length of the imaging lens system, and TL (overall length) is the distance from the aperture stop to the image plane.Type: GrantFiled: September 11, 2009Date of Patent: September 20, 2011Assignee: E-Pin Optical Industry Co., Ltd.Inventors: Chien-Lin Wu, San-Woei Shyu
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Patent number: 8023208Abstract: A miniature stacked glass lens module is disclosed. The miniature stacked glass lens module includes at least one stacked optical glass lens element, a lens holder and other optical element. The stacked optical glass lens element is formed by cutting along alignment notches on a glued and stacked optical glass lens array. Then the stacked optical glass lens element and other optical element are mounted into the lens holder to form a miniature stacked glass lens module. Thereby the precise alignment of the optical axis of the lens in the lens module can be achieved. The manufacturing processes of the lens module can be simplified dramatically and the manufacturing cost is reduced significantly.Type: GrantFiled: September 9, 2009Date of Patent: September 20, 2011Assignee: E-Pin Optical Industry Co., Ltd.Inventors: San-Woei Shyu, Chih-Hsiung Huang, Chien-Lin Wu
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Publication number: 20100284077Abstract: A miniature stacked glass lens module is disclosed. The miniature stacked glass lens module includes at least one stacked optical glass lens element, a lens holder and other optical element. The stacked optical glass lens element is formed by cutting along alignment notches on a glued and stacked optical glass lens array. Then the stacked optical glass lens element and other optical element are mounted into the lens holder to form a miniature stacked glass lens module. Thereby the precise alignment of the optical axis of the lens in the lens module can be achieved. The manufacturing processes of the lens module can be simplified dramatically and the manufacturing cost is reduced significantly.Type: ApplicationFiled: September 9, 2009Publication date: November 11, 2010Inventors: San-Woei SHYU, Chih-Hsiung HUANG, Chien-Lin WU
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Publication number: 20100085650Abstract: A compact short back focus imaging lens system with two lenses is revealed and includes along the optical axis from an object side to an image side: an aperture stop, a first lens with positive refractive power that is a meniscus aspherical lens with convex surface facing the object side, a second lens with negative refractive power that is a meniscus aspherical lens with convex surface facing the image side, an IR cut-off filter and an image sensor. Moreover, the following conditions are satisfied by the imaging lens system: - 0.3 ? f 1 f 2 ? - 0.01 0.25 ? bf TL ? 0.4 wherein f1 is focal length of the first lens, f2 is focal length of the second lens, bf is back focal length of the imaging lens system, and TL (overall length) is the distance from the aperture stop to the image plane.Type: ApplicationFiled: September 11, 2009Publication date: April 8, 2010Inventors: Chien-Lin WU, San-Woei SHYU
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Patent number: D1024932Type: GrantFiled: March 10, 2022Date of Patent: April 30, 2024Assignee: WALSIN LIHWA CORPORATIONInventors: Ko-Ming Chen, Shih-Hsiang Wang, An-Hung Lin, Min-Chuan Wu, Shao-Pei Lin, Chien-Chung Ni, Chun-Ying Lin