Patents by Inventor Chien Ling Hwang

Chien Ling Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250052965
    Abstract: A molding apparatus includes a mold chase and a sensor. The mold chase includes an upper portion and a lower portion engaged with the upper portion to form a cavity therebetween for receiving a workpiece. The upper portion includes a top surface and an alignment mark on the top surface. A pattern is provided on at least one of inner surfaces of the upper and lower portions. The sensor facing the mold chase is configured to detect the alignment mark of the upper portion and a position of the workpiece in the mold chase.
    Type: Application
    Filed: August 9, 2023
    Publication date: February 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Chien-Ling Hwang
  • Publication number: 20250054798
    Abstract: Disclosed are a bonding system and a bonding method. In one embodiment, the bonding system includes a chamber, first and second electrostatic chucks, a visible light sensor module and a nonvisible light module. The chamber is configured to provide a vacuum state. The first electrostatic chuck is configured to hold a first substrate having a first alignment mark in the chamber, wherein the first electrostatic chuck has a first window. The second electrostatic chuck is configured to hold a second substrate having a second alignment mark in the chamber, wherein the second electrostatic chuck has a second window. The visible light sensor module is configured to capture images of the first and the second alignment marks. The nonvisible light module is configured to capture a combined image of the first and second alignment marks via the first and second windows overlapping each other in the vacuum state.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Ling Hwang, Chung-Jung Wu, Tung Li Wu, Wei-Chih Chen, Hsu-Chin Tseng, Jeng-Nan Hung
  • Patent number: 12176279
    Abstract: A package structure includes a carrier substrate, a die, and an encapsulant. The carrier substrate includes through carrier vias (TCV). The die is disposed over the carrier substrate. The die includes a semiconductor substrate and conductive posts disposed over the semiconductor substrate. The conductive posts face away from the carrier substrate. The encapsulant laterally encapsulates the die.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: December 24, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Yueh Wu, Chien-Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu
  • Publication number: 20240379404
    Abstract: A method for handling a semiconductor substrate includes: placing a semiconductor substrate over a semiconductor apparatus, where a central portion of the semiconductor substrate overlies a carrying surface of a chuck table of the semiconductor apparatus, an edge portion of the semiconductor substrate overlies a top surface of a first flexible member of the semiconductor apparatus, the first flexible member is disposed within a recess of the chuck table and extends along a perimeter of the carrying surface, and a gap forms among the semiconductor substrate, the carrying surface of the chuck table, and the top surface of the first flexible member; and introducing a vacuum in vacuum holes in the chuck table to form a vacuum seal among the semiconductor substrate, the chuck table, and the first flexible member.
    Type: Application
    Filed: July 23, 2024
    Publication date: November 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jen-Chun Liao, Sung-Yueh Wu, Chien-Ling Hwang, Ching-Hua Hsieh
  • Publication number: 20240371726
    Abstract: In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.
    Type: Application
    Filed: July 19, 2024
    Publication date: November 7, 2024
    Inventors: Shu-Rong Chun, Kuo-Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu
  • Publication number: 20240356199
    Abstract: A method of manufacturing an electronic device includes: providing a composite structure, wherein the composite structure comprises a core dielectric layer with two conductive layers formed on two opposite surfaces of the core dielectric layer; thinning the two conductive layers to form two thinned conductive layers; forming an antenna pattern using one of the two thinned conductive layers; forming an antenna package to encapsulate the antenna pattern therein; forming a circuit pattern by patterning the other one of the two thinned conductive layers; and forming a chip package to encapsulate the circuit pattern therein, wherein the chip package is electrically coupled to the antenna package.
    Type: Application
    Filed: July 2, 2024
    Publication date: October 24, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Hsuan Lee, Ching-Hua Hsieh, Chien-Ling Hwang, Yu-Ting Chiu, Jui-Chang Kuo
  • Publication number: 20240332132
    Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a carrier substrate, a through substrate via (TSV), a first conductive pattern, and an encapsulated die. The TSV penetrates through the carrier substrate and includes a first portion and a second portion connected to the first portion, the first portion includes a first slanted sidewall with a first slope, the second portion includes a second slanted sidewall with a second slope, and the first slope is substantially milder than the second slope. The first conductive pattern is disposed on the carrier substrate and connected to the first portion of the TSV. The encapsulated die is disposed on the carrier substrate and electrically coupled to the TSV through the first conductive pattern.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jen-Chun Liao, Sung-Yueh Wu, Chien-Ling Hwang, Ching-Hua Hsieh
  • Publication number: 20240312859
    Abstract: A manufacturing method of a package system includes: providing a base plate with a first thermal interface material (TIM) layer; placing a semiconductor package on the first TIM layer over the base plate, wherein the semiconductor package comprises a plurality of packaging units arranged in an array and a plurality of electrical connectors surrounding the array of the plurality of packaging units; stacking a gasket and a top plate on the array of the plurality of packaging units, wherein the gasket is interposed between the top plate and the array of the plurality of packaging units; and securing the top plate, the gasket, the plurality of packaging units, and the base plate together through a plurality of fasteners, wherein each of the plurality of fasteners is arranged at a gap between two of the adjacent packaging units.
    Type: Application
    Filed: May 26, 2024
    Publication date: September 19, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Hsuan Lee, Ching-Hua Hsieh, Chien-Ling Hwang
  • Patent number: 12062832
    Abstract: A method of manufacturing an electronic device includes providing a core dielectric layer with two conductive layers formed on two opposite surfaces of the core dielectric layer, and removing at least a portion of each of the two conductive layers to respectively form an antenna pattern and a circuit pattern of a chip package at the two opposite surfaces of the core dielectric layer.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: August 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Hsuan Lee, Ching-Hua Hsieh, Chien-Ling Hwang, Yu-Ting Chiu, Jui-Chang Kuo
  • Publication number: 20240262096
    Abstract: A method for laminating a film to a wafer and apparatus for performing the lamination process are disclosed. The method includes providing the wafer and the film in a process chamber where the wafer and the film are separated from each other, achieving a vacuum state and a process temperature in the process chamber, and laminating the film to contact a surface of the wafer.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 8, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Ting Chiu, Ying-Jui Huang, Chien-Ling Hwang, Ching-Hua Hsieh
  • Patent number: 12040255
    Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a carrier substrate, a through substrate via (TSV), a first conductive pattern, and an encapsulated die. The TSV penetrates through the carrier substrate and includes a first portion and a second portion connected to the first portion, the first portion includes a first slanted sidewall with a first slope, the second portion includes a second slanted sidewall with a second slope, and the first slope is substantially milder than the second slope. The first conductive pattern is disposed on the carrier substrate and connected to the first portion of the TSV. The encapsulated die is disposed on the carrier substrate and electrically coupled to the TSV through the first conductive pattern.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: July 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jen-Chun Liao, Sung-Yueh Wu, Chien-Ling Hwang, Ching-Hua Hsieh
  • Patent number: 12040247
    Abstract: A package system and a manufacturing method thereof are provided. The package system includes a semiconductor package and a thermal-dissipating structure. The semiconductor package includes a first surface and a second surface opposing to each other, and a planarity of the second surface is greater than that of the first surface. The thermal-dissipating structure includes a first plate secured to the semiconductor package, a gasket interposed between the first plate and the semiconductor package, a second plate secured to the semiconductor package opposite to the first plate, and a first thermal interface material layer interposed between the second plate and the second surface of the semiconductor package. The gasket includes a plurality of hollow regions corresponding to portions of the first surface of the semiconductor package.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: July 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Hsuan Lee, Ching-Hua Hsieh, Chien-Ling Hwang
  • Patent number: 12027494
    Abstract: A semiconductor device includes an integrated circuit, first conductive features, second conductive features, a package structure, and an encapsulant. The integrated circuit has an active surface and a rear surface opposite to the active surface. The first conductive features surround the integrated circuit. The second conductive features are stacked on the first conductive features. The package structure is disposed on the second conductive features and the rear surface of the integrated circuit. The encapsulant laterally encapsulates the integrated circuit, the first conductive features, the second conductive features, and the package structure.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: July 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Tzuan-Horng Liu, Chien-Ling Hwang
  • Patent number: 11990381
    Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Po-Yuan Teng, Chen-Hua Yu
  • Patent number: 11955349
    Abstract: A method includes coating a release film over a carrier. The carrier includes a first material having a first Coefficient of Thermal Expansion (CTE), and a second material having a second CTE different from the first CTE. The method further includes placing a device die over the release film, encapsulating the device die in an encapsulant, and planarizing the encapsulant until the device die is revealed.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chien Ling Hwang
  • Publication number: 20230387039
    Abstract: A semiconductor package includes a first package component comprising: an integrated circuit die; an encapsulant surrounding the integrated circuit die; and a fan-out structure electrically connected to the integrated circuit die, wherein a first opening extends completely through the fan-out structure and at least partially through the encapsulant in a cross-sectional view, and wherein the encapsulant at least completely surrounds the first opening in a top-down view. The semiconductor package further includes a package substrate bonded to the first package component.
    Type: Application
    Filed: August 4, 2022
    Publication date: November 30, 2023
    Inventors: Sung-Yueh Wu, Jen-Chun Liao, Mao-Yen Chang, Yu-Chia Lai, Chien Ling Hwang, Ching-Hua Hsieh
  • Publication number: 20230386974
    Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a carrier substrate, a through substrate via (TSV), a first conductive pattern, and an encapsulated die. The TSV penetrates through the carrier substrate and includes a first portion and a second portion connected to the first portion, the first portion includes a first slanted sidewall with a first slope, the second portion includes a second slanted sidewall with a second slope, and the first slope is substantially milder than the second slope. The first conductive pattern is disposed on the carrier substrate and connected to the first portion of the TSV. The encapsulated die is disposed on the carrier substrate and electrically coupled to the TSV through the first conductive pattern.
    Type: Application
    Filed: July 31, 2023
    Publication date: November 30, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jen-Chun Liao, Sung-Yueh Wu, Chien-Ling Hwang, Ching-Hua Hsieh
  • Publication number: 20230378040
    Abstract: A package structure includes a carrier substrate, a die, and an encapsulant. The carrier substrate includes through carrier vias (TCV). The die is disposed over the carrier substrate. The die includes a semiconductor substrate and conductive posts disposed over the semiconductor substrate. The conductive posts face away from the carrier substrate. The encapsulant laterally encapsulates the die.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 23, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Yueh Wu, Chien-Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu
  • Patent number: 11764127
    Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a carrier substrate, a through substrate via (TSV), a first conductive pattern, and an encapsulated die. The TSV penetrates through the carrier substrate and includes a first portion and a second portion connected to the first portion, the first portion includes a first slanted sidewall with a first slope, the second portion includes a second slanted sidewall with a second slope, and the first slope is substantially milder than the second slope. The first conductive pattern is disposed on the carrier substrate and connected to the first portion of the TSV. The encapsulated die is disposed on the carrier substrate and electrically coupled to the TSV through the first conductive pattern.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jen-Chun Liao, Sung-Yueh Wu, Chien-Ling Hwang, Ching-Hua Hsieh
  • Patent number: 11756872
    Abstract: A package structure includes a carrier substrate, a die, and a first redistribution structure. The carrier substrate has a first surface and a second surface opposite to the first surface. The carrier substrate includes an insulating body and through carrier vias (TCV) embedded in the insulating body. The die is disposed over the firs surface of the carrier substrate. The die is electrically connected to the TCVs. The first redistribution structure is disposed on the second surface of the carrier substrate.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: September 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Yueh Wu, Chien-Ling Hwang, Jen-Chun Liao, Ching-Hua Hsieh, Pei-Hsuan Lee, Chia-Hung Liu