Abstract: A film transfer tool has a casing, a tape-supplying assembly having a supply reel and a take-up reel linked therewith, a brake component which can move relative to the supply reel, and a transfer head. The transfer head moves between an original position and an operating position to drive the tape-supplying assembly and the brake component to move relative to the other. When the transfer head moves toward the operating position, a relative movement between the supply reel and the brake component is caused and the braking capacity gradually decreases.

Abstract: The disclosure provides an image sensor integrated chip and a method for forming the same. The image sensor integrated chip includes a substrate including a pixel region, an isolation structure disposed in the substrate and configured at opposite sides of the pixel region, an image sensing element disposed in the pixel region of the substrate, a gate structure disposed on the pixel region of the substrate, a first dielectric layer disposed above the pixel region of the substrate and covering sidewalls and a portion of a top surface of the gate structure, and a reflective layer disposed on the first dielectric layer. The reflective layer overlaps with the image sensing element and the portion of the top surface of the gate structure in a first direction perpendicular to a surface of the substrate.

Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.

Abstract: A manufacturing method of an image sensor structure including the following steps is provided. A substrate structure is provided. A first patterned hard mask layer is formed on the substrate structure. The first patterned hard mask layer has a first opening. A first ion implantation process is performed on the substrate structure by using the first patterned hard mask layer as a mask to form a first isolation region in the substrate structure. A first hard mask layer is formed on the first patterned hard mask layer. The first hard mask layer is formed in the first opening to form a first recess. The width of the first recess is smaller than the width of the first opening. A second ion implantation process is performed on the substrate structure by using the first hard mask layer as a mask to form a doped region in the substrate structure.

Abstract: A charging and discharging circuit and a control method of the charging and discharging circuit are provided. When any one of the plurality of first DC/DC conversion circuit board modules is discharging, the operation of the discharging load is determined according to the charging requirement of the other first DC/DC conversion circuit board modules for consuming the power or recycling energy. The charging and discharging circuit determines the charging method according to the charging state of the first DC/DC conversion circuit board and the battery. Namely, according to the control method of the charging and discharging circuit the charging state and the discharging state of the various batteries are controlled according to the various requirements for distributing the power of the various batteries. The charging and discharging circuit comprises a distribution panel to enhance the heat dissipation efficiency.

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

Abstract: An optical sensing apparatus includes an optical signal receiving circuit configured to receive a photocurrent signal from an optoelectronic detector and generate a differential voltage signal. The optical signal receiving circuit includes a transimpedance amplifier coupled to the optoelectronic detector and configured to convert the photocurrent signal from the optoelectronic detector into a first voltage signal. The optical signal receiving circuit includes a first power source configured to provide a first bias voltage for the optoelectronic detector. The optical signal receiving circuit includes an adjustment circuit coupled to the transimpedance amplifier and configured to adjust the first voltage signal to generate a second voltage signal. The optical signal receiving circuit includes a single-ended-to-differential converter coupled to the adjustment circuit and configured to convert the second voltage signal into the differential voltage signal.

Abstract: Examples are disclosed that relate to fans configured to automatically adjust for imbalances in mass. One example provides a self-balancing fan, comprising a hub comprising a plurality of blade interfaces, and a plurality of blade structures each attached to a corresponding blade interface of the hub, each blade interface comprising a tapered notch in the hub and being configured to increase a balancing force exerted by the hub against the blade structure as a function of increasing distance of the blade structure from the hub.

Abstract: A controller for controlling a blocking switch of a power converter is provided. The controller includes a control pin and a sensing circuit. The control pin is coupled to a control terminal of the blocking switch and an output terminal of the blocking switch. The sensing circuit includes a control switch, a variable resistance circuit, and a judgment circuit. A first terminal of the control switch is coupled to the control pin. The variable resistance circuit is coupled between a second terminal of the control switch and a reference low voltage. The judgment circuit controls the variable resistance circuit to provide a detection resistance value with a minimum value, and turns on the control switch to obtain a sensing voltage value. When the detection resistance value has a maximum value and the sensing voltage value is lower than a reference voltage value, the judgment circuit provides a notification signal.

Abstract: A controller for controlling a blocking switch of a power converter is provided. The controller includes a control pin and a sensing circuit. The control pin is coupled to a control terminal of the blocking switch and an output terminal of the blocking switch. The sensing circuit includes a control switch and a judgment circuit. A first terminal of the control switch is coupled to the control pin. A second terminal of the control switch is coupled to a reference low voltage. The judgment circuit turns on the control switch during a period when the blocking switch is turned off to obtain a sensing current value of a current flowing through the control switch. When the sensing current value is lower than a reference current value, the judgment circuit provides a notification signal for allowing the blocking switch to be turned on.

Abstract: A control circuit for a synchronous rectification switch of a power converter is provided. The synchronous rectification switch and a transformer of the power converter are coupled to a connection node. The control circuit includes a first logic circuit, an integrating circuit, a setting comparator, a logic gate, and a second logic circuit. The first logic circuit provides a detection signal according to a detection voltage on the connection node. The integrating circuit performs an accumulation operation on the integrated voltage value based on the detection signal to generate a setting pulse. The setting comparator provides a comparison signal according to the detection voltage and a first predetermined voltage. The logic gate outputs a setting signal according to the setting pulse and the comparison signal. The second logic circuit continuously provides a turn-on control signal in response to the setting signal. The synchronous rectification switch is turned on in response to the turn-on control signal.

Abstract: A synchronous rectifier device for a power converter is provided. A power converter includes at least one secondary circuit and a transformer. The synchronous rectifier device includes a synchronous rectification circuit and a controller. The synchronous rectification circuit includes a synchronous rectification switch and a current receiving circuit. The synchronous rectification switch is coupled between the secondary circuit and a secondary winding of the transformer. The current receiving circuit provides a current signal based on a current flowing through the synchronous rectification switch. The controller controls the synchronous rectification switch according to the current signal. In a case that the synchronous rectification switch is turned off, when the current signal indicates that a current value of the current is greater than a predetermined value, the controller turns on the synchronous rectification switch.

Abstract: A circuit, including: a photodetector including a first readout terminal and a second readout terminal different than the first readout terminal; a first readout circuit coupled with the first readout terminal and configured to output a first readout voltage; a second readout circuit coupled with the second readout terminal and configured to output a second readout voltage; and a common-mode analog-to-digital converter (ADC) including: a first input terminal coupled with a first voltage source; a second input terminal coupled with a common-mode generator, the common-mode generator configured to receive the first readout voltage and the second readout voltage, and to generate a common-mode voltage between the first and second readout voltages; and a first output terminal configured to output a first output signal corresponding to a magnitude of a current generated by the photodetector.

Abstract: A wireless charging control method and a wireless charging system employing the same are provided. The wireless charging control method is applicable for the wireless charging system including a transmitter module and a receiver module and includes steps of: (a) by the transmitter module, when an input power is higher than a threshold power or a component temperature is higher than a threshold temperature, determining a target output power according to the input power or the component temperature; (b) by the transmitter module, modulating information of the target output power into an input electric energy; (c) by the receiver module, receiving and sampling the input electric energy to demodulate the information of the target output power; and (d) by the receiver module, converting the input electric energy into the target output power according to the information of the target output power.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for eye gesture recognition. In one aspect, a method includes obtaining an electrical signal that represents a measurement, by a photodetector, of an optical signal reflected from an eye and determining a depth map of the eye based on phase differences between the electrical signal generated by the photodetector and a reference signal. Further, the method includes determining gaze information that represents a gaze of the eye based on the depth map and providing output data representing the gaze information.

Abstract: A computing device comprises a cover, a chassis, a cover closure sensor, and a cooling fan. An airflow detector and a thermal sensor are located within the chassis. The computing device comprises a processor and a memory storing instructions executable by the processor to detect a thermal trip condition using at least signals from the airflow detector, the thermal sensor, and the cover closure sensor. A cooling action is performed at least on condition of (1) determining that a velocity of an airflow within at least a portion of the chassis is less than or equal to a threshold velocity, (2) determining that the cover is closed, and (3) determining that a temperature of the computing device is greater than or equal to a threshold temperature.

Abstract: The present disclosure provides a scalable power distribution system including a power distribution device, the power distribution includes a plurality of input modules and a plurality of output modules. The input module includes a connector for receiving the input power. The output module has a plurality of output ports. The output module receives the input power of the connector of the corresponding input module, or receives the input power of the connector of the input module neighboring to the corresponding input module. The input module receives the plural types of input power, and the power distribution system selectively receives one or more times of the input power through one or more of the plurality of input modules to provide one or more times of the output power to one or more of the plurality of output ports.

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for eye gesture recognition. In one aspect, a method includes obtaining an electrical signal that represents a measurement, by a photodetector, of an optical signal reflected from an eye and determining a depth map of the eye based on phase differences between the electrical signal generated by the photodetector and a reference signal. Further, the method includes determining gaze information that represents a gaze of the eye based on the depth map and providing output data representing the gaze information.

Abstract: An electronic device includes a circuit board assembly and an expansion card assembly. The circuit board assembly includes a circuit board body, a first circuit board connection port, a second circuit board connection port, and a third circuit board connection port. The expansion card assembly is adapted for plugging in the circuit board assembly, and includes an expansion card body, a first expansion card connection port, and a second expansion card connection port. When the expansion card assembly is plugged in the circuit board assembly, the first expansion card connection port is docked with the first circuit board connection port, the second expansion card connection port is docked with the second circuit board connection port, and the third circuit board connection port is electrically connected to the expansion card body through the second circuit board connection port and the second expansion card connection port.