Patents by Inventor Chien-lung Yang

Chien-lung Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11829214
    Abstract: The description relates to devices and air cooling of devices. One example can include a heat generating component positioned in a housing and a temperature-based gas separation assembly configured to receive ambient air and to separate the ambient air into warmer air that is directed outside the housing and cooler air that is directed inside the housing to cool the heat generating component.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: November 28, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Chien Lung Yang, Matthew Gen, Todd Chiles
  • Publication number: 20230324965
    Abstract: The description relates to devices and air cooling of devices. One example can include a heat generating component positioned in a housing and a temperature-based gas separation assembly configured to receive ambient air and to separate the ambient air into warmer air that is directed outside the housing and cooler air that is directed inside the housing to cool the heat generating component.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 12, 2023
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Chien Lung YANG, Matthew GEN, Todd CHILES
  • Patent number: 11090909
    Abstract: Examples of forming metal composites are described herein. In an example, a metal sheet is formed into a predetermined shape using superplastic thermal forming technique. Further, a carbon fiber-reinforced polymer sheet is shaped into the predetermined shape by thermal forming. The metal sheet and the carbon fiber-reinforced polymer sheet are coupled by applying an adhesive between the metal sheet and the carbon fiber-reinforced polymer sheet, to form a metal composite.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: August 17, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chien Lung Yang, Cheng-Feng Liao
  • Publication number: 20180250915
    Abstract: Examples of forming metal composites are described herein. In an example, a metal sheet is formed into a predetermined shape using superplastic thermal forming technique. Further, a carbon fiber-reinforced polymer sheet is shaped into the predetermined shape by thermal forming. The metal sheet and the carbon fiber-reinforced polymer sheet are coupled by applying an adhesive between the metal sheet and the carbon fiber-reinforced polymer sheet, to form a metal composite.
    Type: Application
    Filed: November 4, 2015
    Publication date: September 6, 2018
    Inventors: KUAN-TING WU, CHIEN-LUNG YANG, CHENG-FENG LIAO
  • Publication number: 20100212868
    Abstract: An assembled configuration of cooling fins and heat pipes facilitates filling of a thermal interface material between contact surfaces of the cooling fins and the heat pipes and enhances stability of the cooling fins. The configuration is characterized in that each of the juxtaposed cooling fins is formed at an end thereof contacting the heat pipes with a bent portion having at least two sections so as to define an accommodating space for the thermal interface material and an extending section, wherein the accommodating space can be sufficiently filled with the thermal interface material and the extending section can be nestingly overlapped by an adjacent cooling fin, so as to effectively prevent the thermal interface material from leaking out and enhance stability of the assembled cooling fins.
    Type: Application
    Filed: February 15, 2008
    Publication date: August 26, 2010
    Inventor: Chien-Lung Yang
  • Publication number: 20060034057
    Abstract: A heatsink clamper includes a buckle piece and a main body. The buckle piece includes a latch member buckled to a side of a seat that mounts the heatsink and the hot element of an electronic device, and a press member one end pivoted on an end of the latch member and another end includes a latch end correspondent to the latch portion of the latch member. The latch member includes a latch portion and a raised end. The main body includes a buckle latched to another side of the seat, and a pressing arm linked together included a hole correspondent to the raised end for passing through the raised end and moving relatively. When pressing the press member to move the latch end into the latch portion, the pressing arm is also pressed and deformed to provide a pressure to the heatsink through a receptacle groove.
    Type: Application
    Filed: August 11, 2004
    Publication date: February 16, 2006
    Applicant: Mitac Precision Technology
    Inventor: Chien-lung Yang