Abstract: A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes a substrate; a gate electrode disposed within the substrate; a gate dielectric layer disposed within the substrate and surrounding the gate electrode; a plurality of first protection structures disposed over the gate electrode; a second protection structure disposed over the gate dielectric layer and contacting the gate dielectric layer; and a pair of source/drain regions on opposing sides of the gate dielectric layer.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.

Abstract: A camera module suited for assembled in a casing is provided. The camera module includes a camera and a switch cover. The camera is disposed in the casing and aligned with a camera hole of the casing. The switch cover is slidably disposed in the casing, wherein the switch cover includes a sliding member and a shielding member secured to the sliding member, and a thickness of the shielding member is less than a thickness of the sliding member. The camera hole is seated on a sliding path of the shielding member. The shielding member is suited for blocking between the camera and the camera hole or moving out between the camera and the camera hole. An electronic device is also provided.

Abstract: A method includes providing a detector disposed above a semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector, rotating the stage; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Abstract: A processing method for vehicle surround view, a vehicle surround view system and an in-vehicle processing device are provided. The processing method for vehicle surround view includes the following steps: obtaining a first exterior image and a second exterior image; recognizing a first interest object in the first exterior image and a second interest object in the second exterior image; fitting the first interest object to a first geometric contour and fitting the second interest object to a second geometric contour; applying the first geometric contour and the second geometric contour on a 3D model, to obtain a ground point, a first contour position and a second contour position; obtaining a merged contour position according to the ground point; and projecting the first interest object or the second interest object at the merged contour position on a vehicle surround image.

Abstract: An operation method for a memory device is provided. The memory device includes a two-terminal selector and a resistance variable storage element coupled to the two-terminal selector. The method includes providing a voltage pulse to the memory device. A voltage applied across the two-terminal selector during a falling part of the voltage pulse falls below a holding voltage of the two-terminal selector. A voltage falling rate of the falling part at which the voltage applied across the two-terminal selector reaches the holding voltage is raised for reducing threshold voltage drift of the two-terminal selector.

Abstract: A method includes providing a detector disposed above a semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.

Abstract: A phototherapy device includes a base, at least one light conversion device and a light source module. The base has an installation slot. The light conversion device is detachably arranged in the installation slot. Each light conversion device includes a plurality of light conversion patterns. The light source module is arranged on a side of the base and configured to provide an excitation beam to the light conversion patterns, so that each of the light conversion patterns emits a converted beam. In this way, the light conversion device of the phototherapy device can be replaced according to the user's needs.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A semiconductor device includes a substrate and a gate structure. The gate structure is disposed on the substrate, and the gate structure includes a titanium nitride barrier layer a titanium aluminide layer, and a middle layer. The titanium aluminide layer is disposed on the titanium nitride barrier layer, and the middle layer is disposed between the titanium aluminide layer and the titanium nitride barrier layer. The middle layer is directly connected with the titanium aluminide layer and the titanium nitride barrier layer, and the middle layer includes titanium and nitrogen. A concentration of nitrogen in the middle layer is gradually decreased in a vertical direction towards an interface between the middle layer and the titanium aluminide layer.

Abstract: A dual drive pressing apparatus for plural pressing heads is disclosed. The dual drive pressing apparatus includes a platform, a first rotation plate, a second rotation plate, a return set and a switch set. While the first rotation plate is driven by a first driving force, the first rotation plate rotates with the second rotation plate to a selectively specific angle relative to the platform, and the set of pressing columns is selectively aligned with a corresponding pressing head. While a second driving force is provided by the switch set to resist the resilience of the return set and push against the end of the supporting cylinder to move towards the second surface, the supporting cylinder of the second rotation plate drives the fourth surface separated from the first rotation plate, and the set of pressing columns on the third surface pushes the corresponding pressing head set.

Abstract: The disclosure relates to a dual drive pressing apparatus for plural pressing heads. The dual drive pressing apparatus includes a platform, a first rotation plate, a second rotation plate, a return set and a switch set. While the first rotation plate is driven by a first driving force, the first rotation plate rotates with the second rotation plate to a selectively specific angle relative to the platform, and the set of pressing columns is selectively aligned with a corresponding pressing head. While a second driving force is provided by the switch set to resist the resilience of the return set and push against the end of the supporting cylinder to move towards the second surface, the supporting cylinder of the second rotation plate drives the fourth surface separated from the first rotation plate, and the set of pressing columns on the third surface pushes the corresponding pressing head set.

Abstract: A roller-type lateral force generation device includes a roller, a first plate, a second plate, a connection plate, a first spring, a rotation shaft, a second spring, a fixing element and an adjustment element. The connection plate is disposed along a set direction, which is perpendicular to a paper-feeding direction. The first spring is disposed between the first plate and a first shaft portion of a roller shaft of the roller. The second spring is disposed between the second plate and a second shaft portion of the roller shaft. The adjustment element has a limitation plate perpendicular to the first plate. The limitation plate has a limitation groove. The first shaft portion is penetrated through the limitation groove. The set direction and the connection line of the rotation shaft and the roller shaft have an angle larger than 0 degree. A lateral force is generated, thereby avoiding paper squeezing inward.

Abstract: A mobile device includes a processing module, an external connection interface and a current monitoring unit. The external connection interface is electrically connected to the processing module and includes a first pin, a second pin and a third pin. The first pin is configured to transmit a first speaker signal and the second pin is configured to transmit a second speaker signal. The current monitoring unit is electrically connected to the processing module and the third pin of the external connection interface and configured to monitor a current state of the third pin and feedback the monitored current state to the processing module. The processing module is configured to provide one of a plurality of different voltage levels to the third pin according to the monitored current state. A noise-canceling earphone is also disclosed.

Abstract: A mobile device includes a processing module, an external connection interface and a current monitoring unit. The external connection interface is electrically connected to the processing module and includes a first pin, a second pin and a third pin. The first pin is configured to transmit a first speaker signal and the second pin is configured to transmit a second speaker signal. The current monitoring unit is electrically connected to the processing module and the third pin of the external connection interface and configured to monitor a current state of the third pin and feedback the monitored current state to the processing module. The processing module is configured to provide one of a plurality of different voltage levels to the third pin according to the monitored current state. A noise-canceling earphone is also disclosed.

Abstract: An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.

Abstract: A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.

Abstract: An exemplary method for making backlight module frame includes: providing a plurality of metallic sheets cooperatively defining a frame shape, and a positioning device comprising a worktable and a plurality of positioning portions defined at corners of the worktable, wherein each metallic sheet comprises a first positioning protrusion corresponding to the positioning portions, positioning the metallic sheets on the worktable of the positioning device with the first positioning protrusions of the metallic sheets engaging with the positioning portions of the positioning device, welding the metallic sheets together to form a semi-manufactured frame, and pressing the semi-manufactured frame to form a backlight module frame.

Abstract: An exemplary method for making backlight module frames includes: method includes: providing a first metallic sheet and a second metallic sheet, each of the first and second metallic sheets having at least two L-shaped portions connected side by side and oriented in the same direction; welding the two metallic sheets to form a plurality of connected semi-manufactured frames corresponding to s subsequent backlight module frame; and pressing the connected semi-manufactured frames to form a plurality of backlight module frames. The method costs less welding time and it is convenient for the backlight module frames to be mass-produced.