Abstract: The present application discloses an adapter for data transmission between a first communication device and a second communication device, in which the first communication device reads data in the second communication device, and the data includes a plurality of data segments, wherein a size of each data segment is the maximum transmission unit of the second communication device. The adapter includes a buffer and a plurality of counters. The buffer stores the data transmitted by the second communication device temporarily. The plurality of counters are initially set to zero. Each counter corresponds to each data segment and indicates a size of partial data of each data segment that has been stored. The adapter transmits the partial data to the first communication device, when each counter indicates that the size of the partial data reaches a predetermined transmission unit but does not reach the maximum transmission unit.

Abstract: A dual drive pressing apparatus for plural pressing heads is disclosed. The dual drive pressing apparatus includes a platform, a first rotation plate, a second rotation plate, a return set and a switch set. While the first rotation plate is driven by a first driving force, the first rotation plate rotates with the second rotation plate to a selectively specific angle relative to the platform, and the set of pressing columns is selectively aligned with a corresponding pressing head. While a second driving force is provided by the switch set to resist the resilience of the return set and push against the end of the supporting cylinder to move towards the second surface, the supporting cylinder of the second rotation plate drives the fourth surface separated from the first rotation plate, and the set of pressing columns on the third surface pushes the corresponding pressing head set.

Abstract: The disclosure relates to a dual drive pressing apparatus for plural pressing heads. The dual drive pressing apparatus includes a platform, a first rotation plate, a second rotation plate, a return set and a switch set. While the first rotation plate is driven by a first driving force, the first rotation plate rotates with the second rotation plate to a selectively specific angle relative to the platform, and the set of pressing columns is selectively aligned with a corresponding pressing head. While a second driving force is provided by the switch set to resist the resilience of the return set and push against the end of the supporting cylinder to move towards the second surface, the supporting cylinder of the second rotation plate drives the fourth surface separated from the first rotation plate, and the set of pressing columns on the third surface pushes the corresponding pressing head set.

Abstract: A roller-type lateral force generation device includes a roller, a first plate, a second plate, a connection plate, a first spring, a rotation shaft, a second spring, a fixing element and an adjustment element. The connection plate is disposed along a set direction, which is perpendicular to a paper-feeding direction. The first spring is disposed between the first plate and a first shaft portion of a roller shaft of the roller. The second spring is disposed between the second plate and a second shaft portion of the roller shaft. The adjustment element has a limitation plate perpendicular to the first plate. The limitation plate has a limitation groove. The first shaft portion is penetrated through the limitation groove. The set direction and the connection line of the rotation shaft and the roller shaft have an angle larger than 0 degree. A lateral force is generated, thereby avoiding paper squeezing inward.

Abstract: A mobile device includes a processing module, an external connection interface and a current monitoring unit. The external connection interface is electrically connected to the processing module and includes a first pin, a second pin and a third pin. The first pin is configured to transmit a first speaker signal and the second pin is configured to transmit a second speaker signal. The current monitoring unit is electrically connected to the processing module and the third pin of the external connection interface and configured to monitor a current state of the third pin and feedback the monitored current state to the processing module. The processing module is configured to provide one of a plurality of different voltage levels to the third pin according to the monitored current state. A noise-canceling earphone is also disclosed.

Abstract: A mobile device includes a processing module, an external connection interface and a current monitoring unit. The external connection interface is electrically connected to the processing module and includes a first pin, a second pin and a third pin. The first pin is configured to transmit a first speaker signal and the second pin is configured to transmit a second speaker signal. The current monitoring unit is electrically connected to the processing module and the third pin of the external connection interface and configured to monitor a current state of the third pin and feedback the monitored current state to the processing module. The processing module is configured to provide one of a plurality of different voltage levels to the third pin according to the monitored current state. A noise-canceling earphone is also disclosed.

Abstract: An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.

Abstract: A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.

Abstract: An exemplary method for making backlight module frame includes: providing a plurality of metallic sheets cooperatively defining a frame shape, and a positioning device comprising a worktable and a plurality of positioning portions defined at corners of the worktable, wherein each metallic sheet comprises a first positioning protrusion corresponding to the positioning portions, positioning the metallic sheets on the worktable of the positioning device with the first positioning protrusions of the metallic sheets engaging with the positioning portions of the positioning device, welding the metallic sheets together to form a semi-manufactured frame, and pressing the semi-manufactured frame to form a backlight module frame.

Abstract: An exemplary method for making backlight module frames includes: method includes: providing a first metallic sheet and a second metallic sheet, each of the first and second metallic sheets having at least two L-shaped portions connected side by side and oriented in the same direction; welding the two metallic sheets to form a plurality of connected semi-manufactured frames corresponding to s subsequent backlight module frame; and pressing the connected semi-manufactured frames to form a plurality of backlight module frames. The method costs less welding time and it is convenient for the backlight module frames to be mass-produced.

Abstract: A semiconductor package includes a substrate, a number of electrodes formed in the substrate, a heat dissipating member fixed on the substrate, and at least one semiconductor chip mounted on the heat dissipating member and electrically connected to the electrodes. The heat dissipating member defines a receiving through hole and includes a conducting portion formed at the bottom of the receiving through hole. The at least one semiconductor chip is mounted on the conducting portion. The conducting portion efficiently conducts the heat generated by the semiconductor chip to the heat dissipating member and improves the heat dissipating efficiency of the semiconductor package.

Abstract: A method of fabricating a light emitting device initially forms a copper clad ceramic board of the light emitting device using hot-pressing technique at high temperature and photolithography process. Next, a circuit of the light emitting device is formed using die bonding and wire bonding/flipchip processes. Finally, the light emitting device is sealed using transfer molding or injection molding process.

Abstract: A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.

Abstract: An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge.

Abstract: The present invention relates to a belt tension adjustment mechanism for use with a device including a main body and a belt pulley set. The belt pulley set includes a belt. The belt tension adjustment mechanism includes a slab, at least two tension pulleys and a fixing element. A tight tension force and a slack tension force are exerted on the opposite sides of the belt to define a tight side and a slack side of the belt when the belt pulley set runs. A counterforce is generated from the tight side of the belt to exert on the tension pulley contacting with the tight side, the slab is moved in response to the counterforce. The slack side of the belt is suppressed by the tension pulley contacting with the slack side such that the slack tension force is adjustable.

Abstract: A paper guide adjusting mechanism of an office machine includes a main body, a plurality of elastic elements, a transmission member, a plurality of fixing elements and a pressing plate. The main body includes a plurality of confining elements, which have respective recess structures. The transmission member includes a roller axle and a plurality of rollers, wherein the roller axle is partially received in the recess structures and the rollers are sheathed around the roller axle. The fixing elements are disposed in respective recess structures of the confining elements, wherein each fixing element has a base and the base has a first surface sustained against a corresponding elastic element and a second surface sustained against the roller axle. The pressing plate is sustained against the elastic elements.

Abstract: A sheet separating device having a noise suppressing function is used with an auto document feeder. The sheet separating device includes a sheet separating pad, a sheet separating holder, a resilient element and a noise suppressing element. The sheet separating pad cooperates with a sheet separating roller to separate a paper sheet fed into a sheet-guiding path of the auto document feeder. The sheet separating pad is disposed on the sheet separating holder. The resilient element is sustained against or coupled to the sheet separating holder, so that sheet separating pad disposed on the sheet separating holder is urged against the sheet separating roller.

Abstract: A DVD player with language learning function using a general DVD as an audio source of language learning. The DVD player includes a DVD play unit for playing the audio and video of the DVD and outputting a subtitle picture and display information for the subtitle picture according to a play control signal, a text identifying unit for receiving the subtitle picture and converting the subtitle picture into text data, a text-to-speech unit for receiving the text data and converting the text data into synthesized voice signal, and a control module for receiving the display information of the subtitle picture and generating the play control signal according to the display information and a learning mode selected by the user. Thus, the DVD player of the invention does not need specific audio source media.

Abstract: An exemplary process for making a light guide includes the steps of: providing a transparent base sheet; punching the base sheet to form an array of first apertures therein; coating a melted resin material in the first apertures and making the melted resin material fill up the first apertures; solidifying the melted resin material to form a plurality of resin blocks; punching the base sheet to form an array of second apertures in the resin blocks, the second apertures configured for illuminating the keys via at least one light source; and trimming the base sheet with the second apertures to form a light guide. A light guide made by the process is also provided.

Abstract: A method of fabricating a light emitting device initially forms a copper clad ceramic board of the light emitting device using hot-pressing technique at high temperature and photolithography process. Next, a circuit of the light emitting device is formed using die bonding and wire bonding/flip-chip processes. Finally, the light emitting device is sealed using transfer molding or injection molding process.