Abstract: The present invention provides a probe card. The probe card comprises a circuit board, a cantilever-type space transformer electrically connected to the circuit board, and a vertical probe head electrically connected to the cantilever-type space transformer. The vertical probe head comprises a probe base and a plurality of vertical probes. The cantilever-type space transformer comprises a mounting base and a plurality of cantilever converting probes, wherein each cantilever converting probe has a fixed segment and an exposed segment. The fixed segment is secured to the mounting base, and the exposed segment is located outside the mounting base. The fixing segment enters from the side of the mounting base and forms a contact at the bottom of the mounting base.

Abstract: A semiconductor device includes a pixel array comprising a first pixel and a second pixel. The semiconductor device includes a metal structure overlying a portion of a substrate between the first pixel and the second pixel. The semiconductor device includes a first barrier layer adjacent a sidewall of the metal structure. The semiconductor device includes a passivation layer adjacent a sidewall of the first barrier layer. The first barrier layer is between the passivation layer and the metal structure.

Abstract: A codebook generation method and an electronic apparatus are provided. The codebook generation method includes: collecting a plurality of pieces of electric field information of a plurality of antenna units in at least one millimeter-wave antenna module based on an initial codebook; correspondingly generating a full chain codebook (Full Chain Codebook) based on the electric field information; then, extendedly generating a sub chain codebook (Sub Chain Codebook) based on the full chain codebook; and finally generating, based on the full chain codebook and the sub chain codebook, an optimized codebook (Optimized Codebook) by using a power saving algorithm or a cumulative distribution function 50% gain loss algorithm. Therefore, the electronic apparatus using the optimized codebook is more excellent in power saving efficiency and overall efficiency performance.

Abstract: A semiconductor structure includes a first layer, a second layer, a first interconnection layer, and a second interconnection layer. The first layer includes an upper passive component pattern, and the second layer includes a lower passive component pattern, wherein the upper passive component pattern is opposite to the lower passive component pattern. The first interconnection layer includes at least one first interconnect structure electrically connected on the upper passive component pattern. The second interconnection layer includes at least one second interconnect structure electrically connected on the passive component pattern. The first interconnect structure on the upper passive component pattern is hybrid bonded with the second interconnect structure on the lower passive component pattern. Therefore, the upper passive component pattern and the lower passive component pattern are joined by hybrid bonding to form a passive device.

Abstract: A device includes a body having an outer surface. The device includes a plurality of pins in the body, a first pin of the plurality of pins configured to receive a first signal having a first rate, a second pin of the plurality of pins configured to receive a second signal having a second rate less than the first rate. The device includes a shield on a first portion of the outer surface to define an exposed second portion of the outer surface, wherein the second pin is positioned closer to the exposed second portion than the first pin.

Abstract: A wideband antenna system includes a first metal radiation portion, having a coupling distance with a second metal radiation portion; a first feeding contact and a second feeding contact, electrically connected to the first metal radiation portion and the second metal radiation portion respectively, and close to the coupling distance; a first ground contact, electrically connected to the second metal radiation portion; a second ground contact, electrically connected to the first metal radiation portion; an impedance tuner, electrically connected to the first feeding contact, the second feeding contact, the first ground contact, the second ground contact, and a radio frequency signal source, to switch the first metal radiation portion and the second metal radiation portion; an aperture contact, electrically connected to the first metal radiation portion; and an aperture tuner, electrically connected to the aperture contact.

Abstract: An temperature control method including the following steps: driving an temperature control device to generate air circulation for a first server and a second server; monitoring operation state of the temperature control device, the first server and the second server continuously to establish a first learning model; receiving an temperature control state data of the temperature control device, a first state data of the first server, and a second state data of the second server, wherein the first state data includes a first temperature, and the second state data includes a second temperature; inputting the temperature control state data, the first state data, and the second state data into the first learning model to obtain a first temperature prediction value output by the first learning model; and adjusting the temperature control device according to the first temperature prediction value.

Abstract: An antenna-in-module includes a ground plate, three radiating elements, and two feed stubs. A first radiating element and a ground plate are arranged at an interval along a Z-axis and are disposed opposite to each other. The first radiating element and a second radiating element are arranged at an interval along an X-axis. A first gap between the first radiating element and the second radiating element extends along a Y-axis. A third radiating element and the second radiating element are arranged at an interval along the Z-axis and are disposed opposite to each other. At least a part of a first feed stub is disposed in a first aperture that includes space between the first gap and the ground plate. At least a part of a second feed stub is disposed in a second aperture that includes space between the second radiating element and the third radiating element.

Abstract: A fan efficiency control method, for a server, wherein the server comprises a plurality of fans and at least one sensor, the fan efficiency control method includes determining a plurality of system parameters of the plurality of fans of the server; obtaining a current temperature through the at least one sensor, and obtaining a temperature parameter corresponding to a main heat source of the server according to the current temperature; obtaining a modulation function; calculating a speed weight of each fan of the plurality of fans according to the plurality of system parameters, the modulation function and the temperature parameter; and adjusting a speed of one of the plurality of fans according to the speed weight.

Abstract: A heat flow control method, for a data center cooling system, includes determining a plurality of features corresponding to a current scene of the data center cooling system at a first time point; and determining a plurality of cooling parameters at a second time point according to the plurality of features; wherein the data center cooling system utilizes the plurality of cooling parameters to control heat flow at the second time point; wherein the second time point lags the first time point.

Abstract: A cover includes a cover body and a first line layer. The cover body is made of an insulating material, and the first line layer is made of a conductive material. The first line layer is completely built into the cover body, and the first line layer is configured to form a radiator, and is coupled to a radio frequency transceiver circuit of an electronic device. The first line layer includes a plurality of first conducting wires and a plurality of second conducting wires. The plurality of first conducting wires are arranged at intervals in a first direction, and the plurality of second conducting wires are arranged at intervals in a second direction. The plurality of first conducting wires and the plurality of second conducting wires are disposed intersecting each other. The first direction is different from the second direction.

Abstract: A foam is provided. The foam includes a foaming material and a plurality of cells arranged within the foaming material. The foaming material is prepared from a composition, which includes 0.01-2.0 parts by weight of a flow aid and 100 parts by weight of a block copolymer. The block copolymer includes a first block, a second block, and a linking moiety. The first block is connected to the second block via the linking moiety. The first block is an aromatic polyester block. The second block is an aliphatic polyether block, an aliphatic polyester block, or an aliphatic polycarbonate block. The linking moiety is a residue of a dehydrogenated polyol.

Abstract: The disclosure provides a low band antenna device, arranged on a folding screen electronic device, and the folding screen electronic device includes a first casing and a second casing that are foldable. A first antenna and a second antenna are located on the first casing and separated, and a third antenna and a fourth antenna are located on the second casing and separated. The first antenna corresponds to the fourth antenna, and the second antenna corresponds to the third antenna. When the folding screen electronic device is in an open mode, the first through forth antennas all maintain a normal working state. When the folding screen electronic device is in a close mode, one of the first antenna and the fourth antenna and one of the second antenna and the third antenna maintain the normal working state, and the remaining antennas are in a detuned and disabled state.

Abstract: An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.

Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic component and a heat dissipation structure having an opening are arranged on a carrier structure, a heat sink is arranged in the opening and bonded to the electronic component, and the electronic component, the heat dissipation structure and the heat sink are covered with an encapsulation layer, such that the heat sink can be arranged according to a heat source of a specific part of the electronic component so as to effectively dissipate heat.

Abstract: An impeller for a diagonal fan includes a hub, a cylindrical part, a conical section shell, a plurality of blades and a plurality of extended blades. The cylindrical part is connected to the hub and extends axially from a lower end of the hub. The conical section shell surrounds the hub. The blades are connected to the hub and an inner surface of the conical section shell. The extended blades are disposed on an outer surface of the conical section shell and project from the outer surface of the conical section shell.

Abstract: A semiconductor device includes a pixel array comprising a first pixel and a second pixel. The semiconductor device includes a metal structure overlying a portion of a substrate between the first pixel and the second pixel. The semiconductor device includes a first barrier layer adjacent a sidewall of the metal structure. The semiconductor device includes a passivation layer adjacent a sidewall of the first barrier layer. The first barrier layer is between the passivation layer and the metal structure.

Abstract: The present invention relates to an electronic device testing apparatus and a testing method thereof. When the test is completed, a pressing head picks up a tested electronic device from a test socket and places the tested electronic device on an output carrier, the output carrier moves out of a test zone, and an input carrier follows immediately after the output carrier and successively moves into the test zone at the same speed; after the pressing head picks up an electronic device to be tested from the input carrier, the input carrier moves out of the test zone, and the pressing head places the electronic device to be tested in the test socket. Accordingly, in the present invention, the operation of the pressing head is simplified, and the overall test efficiency is improved.

Abstract: An antenna design solution is provided. A metal frame and a PCB ground layer of an electronic device are used to form a slot. Through symmetric feeding and anti-symmetric feeding, the slot can be excited to generate two slot antenna patterns: a CM slot antenna pattern and a DM slot antenna pattern. In addition, the two slot antenna patterns share a same slot antenna radiator.

Abstract: A slurry sprayer for supplying a slurry to a wire saw during ingot slicing is disclosed. The slurry sprayer includes a main body and a cover plate that is detachable from the main body for cleaning the slurry sprayer. In some embodiments, the slurry sprayer includes an adjustable support that allows the incline angle of the sprayer to be adjusted and allows the vertical and horizontal position of the slurry sprayer to be adjusted. In some embodiments, the slurry sprayer includes two feed openings to allow the slurry pressure to be more equalized across the slurry sprayer.