Abstract: The present invention provides an electroencephalogram measurement structure formed by an ear-hanging structure and a second circuit board. The ear-hanging structure includes a body. An ear-hanging member is disposed at the extension of the body. The body can be worn on the ear via the ear-hanging member. In addition, a first reference electrode and a second reference electrode are disposed on the body and coupled to a first circuit board. The first circuit board is coupled to an electrical jack; the second circuit board is coupled to the electrical jack via an electrical plug. Thereby, the electroencephalogram measurement can be performed simply by wearing the ear-hanging member on the ear of the person under test. Hence, the problems of complicated wiring and inconvenience in wearing can be solved concurrently.

Abstract: The present invention provides an integrated circuit layout including a first bank and a second bank. The first bank includes a plurality of I/O circuits and at least one first ESD clamp device. The second bank includes at least one second ESD clamp device, wherein the at least one second ESD clamp device is different in type from the at least one first ESD clamp device.

Abstract: A silica aerogel-containing polyester masterbatch includes a polyethylene terephthalate resin, a silica aerogel powder, and a dispersing agent. The silica aerogel powder is dispersed in the polyethylene terephthalate resin, and is present in an amount ranging from 5 wt % to 30 wt % based on 100 wt % of the silica aerogel-containing polyester masterbatch. The dispersing agent is dispersed in the polyethylene terephthalate resin, is selected from the group consisting of a paraffin oil, a silane compound, a wax including C28-C32 straight chain monoacids, and combinations thereof, and is present in an amount ranging from 0.1 wt % to 4.0 wt % based on 100 wt % of the silica aerogel-containing polyester masterbatch. A method for preparing the silica aerogel-containing polyester masterbatch, and a silica aerogel-containing polyester fiber made from the same are also disclosed.

Abstract: A semiconductor structure including a first substrate, a first conductive layer, and first bonding pads is provided. The first conductive layer is located on the first substrate. The first conductive layer includes a main body portion and an extension portion. The extension portion is connected to the main body portion and includes a terminal portion away from the main body portion. The first bonding pads are connected to the main body portion and the extension portion. The number of the first bonding pads connected to the terminal portion of the extension portion is plural.

Abstract: This application provides an antenna unit and an electronic device. A signal at a C-mode port and a signal at a D-mode port of a same loop antenna in any antenna unit are respectively excited by using two feeds, and the antenna unit is electrically symmetrically disposed, so that the signal at the C-mode port is self-cancelled at the D-mode port, and the signal at the D-mode port is self-cancelled at the C-mode port, to implement signal isolation between the two ports and interference self-cancel, and the signal at the C-mode port and the signal at the D-mode port can be complementary to each other in different radiation directions, to implement two antennas with high isolation and a low envelope correlation coefficient ECC based on the same loop antenna.

Abstract: A method and a system for wireless positioning are provided. Multiple received signal strengths corresponding to multiple wireless access points are measured by a user device. The received signal strengths include multiple first received signal strengths. A reference positioning position is obtained according to positioning reference information provided by the user device. A first positioning position based on the first received signal strengths is obtained. The reference positioning position is compared with the first positioning position. In response to the distance between the reference positioning position and the first positioning position being greater than a tolerance value, at least one of the first received signal strengths is excluded from the multiple received signal strengths, so as to obtain multiple filtered received signal strengths. A user position of the user device is obtained according to the filtered received signal strengths.

Abstract: A server comprising a circuitry, wherein the circuitry is configured to perform: generating an emulator in response to a request from a first user terminal of a first user; launching an application via the emulator; receiving streaming data and interaction data via the application; rendering the streaming data with the interaction data; recording the rendered streaming data and interaction data as a clip; and storing the clip for access from the first user terminal of the first user. According to the present disclosure, the clips may be generated in a more efficient and accurate manner, and a more immersive experience on watching the clips may be provided. Moreover, the review and share of clips may be more flexible. Therefore, the user experience may be improved.

Abstract: A diving backplate includes a device body, a first frame, a second frame and multiple counterweights. The device body includes an inward face and an outward face opposite to the inward face. The first frame is connected to the outward face. The second frame is connected to the inward face and includes multiple first assembly holes. The multiple counterweights are detachable mounted to the second frame. Each counterweight includes multiple second assembly holes each respectively aligned with a respective one of the multiple first assembly holes. A fastener is provided for mounting with each aligned first assembly hole and second assembly hole.

Abstract: An optical engine module used in a projection device and configured to generate an image beam includes a housing and a plate. The housing has a surrounding side wall and a bottom wall connected to each other. The bottom wall has a first opening. The surrounding side wall has an off-state beam irradiation zone adjacent to the first opening. The first opening is configured to allow the image beam to exit. The off-state beam irradiation zone is configured to be irradiated by an off-state beam. The plate has a light receiving part and a heat dissipating part. The light receiving part is disposed in the off-state beam irradiation zone. The heat dissipating part passes through the bottom wall and extends out of the housing. A projection device adopting the optical engine module is also provided.

Abstract: A semiconductor structure for wafer level bonding includes an interconnecting layer on a substrate, a bonding dielectric layer on the interconnecting layer, and a bonding pad in the bonding dielectric layer. The bonding pad includes a top surface exposed from the bonding dielectric layer, a bottom surface opposite to the top surface and physically contacting a dielectric portion of the interconnecting layer, and a sidewall between the top surface and the bottom surface. A bottom angle between the sidewall and the bottom surface is smaller than 90 degrees, and the bonding pad is not electrically connected to the interconnecting layer.

Abstract: An antenna includes a grounding plate; a first electric dipole; a first feeding unit, where the first feeding unit includes a first coupling structure coupled to the first electric dipole, and the first feeding unit performs coupled feeding on the first electric dipole through the first coupling structure; a second electric dipole, where the second electric dipole is disposed between the first electric dipole and the grounding plate; a second feeding unit, where the second feeding unit includes a second coupling structure coupled to the second electric dipole, and the second feeding unit performs coupled feeding on the second electric dipole through the second coupling structure; and a magnetic dipole, where the magnetic dipole is electrically connected to the grounding plate, the first electric dipole, and the second electric dipole.

Abstract: A magnetic lock for charging an electric vehicle and an operating method of the magnetic lock are provided. The magnetic lock includes a voltage conversion circuit, a detection circuit, and a magnetic attraction circuit. The voltage conversion circuit receives a first voltage from a power supplying connector and converts the first voltage into a second voltage and a third voltage. The detection circuit is driven according to the second voltage, provides a first control signal according to a first status signal from the power supplying connector, and provides a second control signal according to the second status signal from the power supplying connector. The magnetic attraction circuit uses the third voltage to generate a magnetic attraction force according to the first control signal. The power supplying connector is fixed to a charging port of the electric vehicle by the magnetic attraction force.

Abstract: The present invention provides a probe card. The probe card comprises a circuit board, a cantilever-type space transformer electrically connected to the circuit board, and a vertical probe head electrically connected to the cantilever-type space transformer. The vertical probe head comprises a probe base and a plurality of vertical probes. The cantilever-type space transformer comprises a mounting base and a plurality of cantilever converting probes, wherein each cantilever converting probe has a fixed segment and an exposed segment. The fixed segment is secured to the mounting base, and the exposed segment is located outside the mounting base. The fixing segment enters from the side of the mounting base and forms a contact at the bottom of the mounting base.

Abstract: A semiconductor device includes a pixel array comprising a first pixel and a second pixel. The semiconductor device includes a metal structure overlying a portion of a substrate between the first pixel and the second pixel. The semiconductor device includes a first barrier layer adjacent a sidewall of the metal structure. The semiconductor device includes a passivation layer adjacent a sidewall of the first barrier layer. The first barrier layer is between the passivation layer and the metal structure.

Abstract: A codebook generation method and an electronic apparatus are provided. The codebook generation method includes: collecting a plurality of pieces of electric field information of a plurality of antenna units in at least one millimeter-wave antenna module based on an initial codebook; correspondingly generating a full chain codebook (Full Chain Codebook) based on the electric field information; then, extendedly generating a sub chain codebook (Sub Chain Codebook) based on the full chain codebook; and finally generating, based on the full chain codebook and the sub chain codebook, an optimized codebook (Optimized Codebook) by using a power saving algorithm or a cumulative distribution function 50% gain loss algorithm. Therefore, the electronic apparatus using the optimized codebook is more excellent in power saving efficiency and overall efficiency performance.

Abstract: A semiconductor structure includes a first layer, a second layer, a first interconnection layer, and a second interconnection layer. The first layer includes an upper passive component pattern, and the second layer includes a lower passive component pattern, wherein the upper passive component pattern is opposite to the lower passive component pattern. The first interconnection layer includes at least one first interconnect structure electrically connected on the upper passive component pattern. The second interconnection layer includes at least one second interconnect structure electrically connected on the passive component pattern. The first interconnect structure on the upper passive component pattern is hybrid bonded with the second interconnect structure on the lower passive component pattern. Therefore, the upper passive component pattern and the lower passive component pattern are joined by hybrid bonding to form a passive device.

Abstract: A device includes a body having an outer surface. The device includes a plurality of pins in the body, a first pin of the plurality of pins configured to receive a first signal having a first rate, a second pin of the plurality of pins configured to receive a second signal having a second rate less than the first rate. The device includes a shield on a first portion of the outer surface to define an exposed second portion of the outer surface, wherein the second pin is positioned closer to the exposed second portion than the first pin.

Abstract: An temperature control method including the following steps: driving an temperature control device to generate air circulation for a first server and a second server; monitoring operation state of the temperature control device, the first server and the second server continuously to establish a first learning model; receiving an temperature control state data of the temperature control device, a first state data of the first server, and a second state data of the second server, wherein the first state data includes a first temperature, and the second state data includes a second temperature; inputting the temperature control state data, the first state data, and the second state data into the first learning model to obtain a first temperature prediction value output by the first learning model; and adjusting the temperature control device according to the first temperature prediction value.

Abstract: A wideband antenna system includes a first metal radiation portion, having a coupling distance with a second metal radiation portion; a first feeding contact and a second feeding contact, electrically connected to the first metal radiation portion and the second metal radiation portion respectively, and close to the coupling distance; a first ground contact, electrically connected to the second metal radiation portion; a second ground contact, electrically connected to the first metal radiation portion; an impedance tuner, electrically connected to the first feeding contact, the second feeding contact, the first ground contact, the second ground contact, and a radio frequency signal source, to switch the first metal radiation portion and the second metal radiation portion; an aperture contact, electrically connected to the first metal radiation portion; and an aperture tuner, electrically connected to the aperture contact.