Abstract: An unmanned aerial vehicle (UAV) includes one or more processors, and a memory storing instructions. When executed by the one or more processors, the instructions cause the UAV to perform operations including: recognizing a first gesture of a hand; responsive to a recognition of the first gesture, moving the unmanned aerial vehicle to hover above the hand; detecting a distance between the unmanned aerial vehicle and the hand; responsive to a determination that the distance falls in a range, monitoring the hand to recognize a second gesture of the hand; and responsive to a recognition of the second gesture, landing the unmanned aerial vehicle on the hand.

Abstract: An unmanned aerial vehicle (UAV) includes one or more processors, and a memory storing instructions. When executed by the one or more processors, the instructions cause the UAV to perform operations including: recognizing a first gesture of a hand; responsive to a recognition of the first gesture, moving the unmanned aerial vehicle to hover above the hand; detecting a distance between the unmanned aerial vehicle and the hand; responsive to a determination that the distance falls in a range, monitoring the hand to recognize a second gesture of the hand; and responsive to a recognition of the second gesture, landing the unmanned aerial vehicle on the hand.

Abstract: A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.

Abstract: A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.