Patents by Inventor CHIEN-NAN CHENG

CHIEN-NAN CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STACKED VIA STRUCTURES AND METHODS FOR FORMING THE SAME
    Publication number: 20240145379
    Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.
    Type: Application
    Filed: February 23, 2023
    Publication date: May 2, 2024
    Inventors: Yen-Kun Lai, Wei-Hsiang Tu, Ching-Ho Cheng, Cheng-Nan Lin, Chiang-Jui Chu, Chien Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii
  • Fan frame and heat dissipation fan having the same
    Patent number: 10385876
    Abstract: A vibration-proofed fan frame includes a housing and a base surrounded by the housing. A hollow tube is arranged on the base and has the rotary connection with an impeller of the heat dissipation fan. The base includes a disc and a plurality of ribs extending outwards from periphery of the disc. The fan frame further includes a buffer member within the structural interconnections between the disc and the housing. The buffer member includes first elements. The first elements are embedded in the disc. A heat dissipation fan having the fan frame described is also presented.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: August 20, 2019
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Hsien-Chou Lin, Xiao-Guang Ma, Yung-Ping Lin, Chien-Nan Cheng, Zheng Luo
  • FAN FRAME AND HEAT DISSIPATION FAN HAVING THE SAME
    Publication number: 20170146032
    Abstract: A vibration-proofed fan frame includes a housing and a base surrounded by the housing. A hollow tube is arranged on the base and has the rotary connection with an impeller of the heat dissipation fan. The base includes a disc and a plurality of ribs extending outwards from periphery of the disc. The fan frame further includes a buffer member within the structural interconnections between the disc and the housing. The buffer member includes first elements. The first elements are embedded in the disc. A heat dissipation fan having the fan frame described is also presented.
    Type: Application
    Filed: July 25, 2016
    Publication date: May 25, 2017
    Inventors: HSIEN-CHOU LIN, XIAO-GUANG MA, YUNG-PING LIN, CHIEN-NAN CHENG, ZHENG LUO