Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A method of manufacturing a substrate structure is provided. An insulation substrate having an upper surface is provided. A portion of the upper surface of the insulation substrate is irradiated by a first laser beam so as to form a first intaglio pattern. The first laser beam is IR laser beam or fiber laser beam. The first intaglio pattern has a modification surface. A first metal layer is formed on the upper surface of the insulation substrate, and covers the upper surface of the insulation layer and the modification surface of the first intaglio pattern, and fills up the first intaglio pattern. A grinding process is performed on the first metal layer so as to expose the upper surface of the insulation substrate and define a first patterned circuit layer. A first upper surface of the first patterned circuit layer is aligned with the upper surface of the insulation substrate.

Abstract: A package carrier includes: a carrier having a main mounting surface and at least two side mounting surfaces connecting the main mounting surface; a dielectric layer disposed on the carrier, having multiple first openings and extending from the main mounting surface up, along boundaries between the main mounting surface and the side mounting surfaces, onto the side mounting surfaces, in which the first openings expose a portion of the main mounting surface and portions of the side mounting surfaces; a metal layer disposed on the dielectric layer and having multiple second openings disposed correspondingly to the first openings and multiple third openings exposing the partial dielectric layer at the above-mentioned boundaries; a surface treatment layer disposed on the partial metal layer; and a solder resist layer disposed on a portion of the metal layer and a portion of the dielectric layer both exposed out of the surface treatment layer.

Abstract: A method of making fine-pitch circuit lines includes steps of preparing an insulative substrate, disposing a conductive metal layer on the insulative substrate, disposing on a whole or a part of a top surface of the conductive metal layer a hetero layer having an etching rate smaller than that of the conductive metal layer, forming a patterned mask of circuit lines on the hetero layer, wet etching the hetero layer and the conductive metal layer, and removing the patterned mask and the hetero layer so as to form fin-pitch circuit lines having a high etching factor on the insulative substrate.

Abstract: A laminate for use in the production of a printed circuit board includes a main layer and a face layer made of a material different from the material that the main layer is made of. The main layer is made of a good electrically conductive metal and has a top surface. The face layer is disposed on the top surface of the main layer and made of a material having an etching rate substantially smaller than that of the material that the main layer is made of. The laminate can exhibit a high etching factor even if the laminate is etched by a conventional etchant.

Abstract: An auto-meter system includes a CAN-Bus for transmitting a CAN-Bus signal, and a first CAN module coupled to the CAN-Bus. The first CAN module is for receiving the CAN-Bus signal transmitted from the CAN-Bus and for transforming the CAN-Bus signal to a message signal. The auto-meter system further includes a display and a processor coupled to the CAN module and the display. The processor is for receiving the message signal and for controlling the display to show information corresponding to the message signal.

Abstract: A method of fabricating a film carrier is provided. The method comprises the steps of providing a film; forming a metallic layer on the film, patterning the metallic layer by etching to form a plurality of metallic leads; and, patterning the film by etching to form a plurality of openings so that processing time and manufacturing cost are reduced.

Abstract: A method of fabricating a film carrier is provided. The method comprises the steps of providing a film; forming a metallic layer on the film, patterning the metallic layer by etching to form a plurality of metallic leads; and, patterning the film by etching to form a plurality of openings so that processing time and manufacturing cost are reduced.

Abstract: A method of fabricating a film carrier. The method comprises the steps of providing a film; forming a plurality of sprocket holes in the film; forming a metallic layer on the film; patterning the film in an etching operation to form a plurality of openings; and, patterning the metallic layer to form a plurality of metallic leads.

Abstract: A damping assembly has a bracket, a damping wheel, a torsion spring, at least one pair of rotating wheels and a strap. The damping wheel is rotatably mounted in the bracket. The torsion spring is arranged between the bracket and the damping wheel to provide a torsion force to the damping wheel. A cord wound around each rotating wheel of one pair of the rotating wheels. The strap is connected between damping wheel and the secondary axle with the rotating wheels attached to the cords. By such an arrangement, the damping assembly can be used with a roller exerciser or a chest exerciser with little additional structure. The use of the damping assembly becomes more versatile. The cost for manufacturing different types of exercisers is decreased.