Abstract: A cooling apparatus uses a plurality of pipes to cool one or more integrated circuits disposed on a circuit board. The cooling apparatus uses an array of magnets to create magnetic fields across segments of the plurality of pipes. Electrical currents are induced across the magnetic fields. A flow of electrically conductive fluid in the plurality of pipes is dependent on and controllable by the magnetic fields and/or the electrical currents.

Abstract: A system for cooling a semiconductor includes a heat sink in thermal contact with the semiconductor, a thermal interface material (TIM) layer disposed between the heat sink and the semiconductor, and a picture frame support disposed between a substrate of the semiconductor and the heat sink, wherein the picture frame support encloses at least a portion of the semiconductor in a plane between the substrate and the heat sink, and wherein the picture frame support has a height that is greater than a height of the semiconductor.

Abstract: An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer.

Abstract: A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components; and controlling the active cooling based on temperature of the semiconductor. A cooling system for a semiconductor including: a passive component in thermal contact with the semiconductor; an active cooling component in thermal contact with the semiconductor; and a controller controlling the active cooling component.

Abstract: A method for transferring heat from a first location to a second location includes thermoelelectrically transferring heat from the first location to a third location; and transferring heat from the third location to the second location through a magneto-hydrodynamic (MHD) flow. A cooling system includes a thermoelectric cooling (TEC) component; and a magnetohydrodynamic (MHD) component, wherein the MHD component and the TEC component are in thermal contact.

Abstract: An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer.

Abstract: A heat sink has a plurality of pipes that are connected to an array of magnets. The plurality of pipes are connected to a lid that is operatively connected to an integrated circuit. Temperature sensors are disposed on the lid to measure temperatures of hot spots of the integrated circuit. Dependent on a temperature of one of the hot spots, the array of magnets may be used to propagate thermally conductive fluid toward the hot spot through the lid using the plurality of pipes.

Abstract: A heat sink uses a ferrofluid-based pump assembly for controlling the direction of nanofluid flow within the heat sink. The nanofluid is thermally conductive and absorbs heat from a heat source, which is then directed away from the heat source by the ferrofluid-based pump assembly. The ferrofluid-based pump assembly uses a motor to rotate at least one magnet so as to rotate ferrofluid contained in the ferrofluid-based pump assembly. The direction of nanofluid flow within the heat sink is dependent on the movement of ferrofluid in the ferrofluid-based pump assembly.

Abstract: A cooling device includes a base having cells. A pipe is coupled to the base for each of the cells. The pipes include passages that carry fluid toward the cell and away from the cell. A magnetohydrodynamic pump system coupled to the pipe circulates an electrically conductive cooling fluid within the passages and the cell. An orifice may emits jets of fluid into the cells. A controller coupled to the cooling device may independently control flow rates in two or more cells of the cooling device. The controller may receive information from the temperature sensors on the base of the cooling device for use in controlling the flow rates in the cells.

Abstract: A heat sink uses a pump assembly to generate a magnetic field. Flow directions of electrically and thermally conductive liquid flowing through multiple pipes that go through the pump assembly are dependent on an orientation of the magnetic field and/or the direction of electrical current induced across flowing fluid in the magnetic field. In such a manner, cool liquid may be directed toward a heat source and warmer liquid may be directed to flow away from the heat source, where heat transfer occurs between the liquid and the heat sink. Additional pump assemblies that generate separate magnetic fields may be used to increase fluid flow volume, thereby increasing heat transfer away from the heat source.

Abstract: A heat sink operatively connected to an integrated circuit is configured to generate a magnetic field. Fluid flow toward and away from a hot spot of the integrated circuit is dependent on the magnetic field and an induced electrical current. A temperature sensor is used to take temperature measurements of the hot spot. A value of the induced electrical current is adjusted dependent on one or more temperature measurements taken by the temperature sensor.

Abstract: A cooling apparatus includes a heat pipe base covering a heat source; a heat sink with a plurality of heat sink fins; a plurality of heat pipes connecting the heat pipe base and the heat sink; and a magneto-hydrodynamic (MHD) pump assembly connected to the heat sink. In a method for cooling a heat source with heat pipes, magneto-hydrodynamic (MHD) fluid pipes, and a heat sink, the method includes transmitting heat from evaporating ends of the heat pipes connected to a heat source to condensing ends of the heat pipes connected to the heat sink; and circulating MHD fluid inside the MHD fluid pipes embedded in the heat sink to dissipate heat.

Abstract: A heat sink has a plurality of pipes that are connected to an array of magnets. The plurality of pipes are connected to a lid that is operatively connected to an integrated circuit. Temperature sensors are disposed on the lid to measure temperatures of hot spots of the integrated circuit. Dependent on a temperature of one of the hot spots, the array of magnets may be used to propagate thermally conductive fluid toward the hot spot through the lid using the plurality of pipes.

Abstract: A cooling apparatus uses a plurality of pipes to cool one or more integrated circuits disposed on a circuit board. The cooling apparatus uses an array of magnets to create magnetic fields across segments of the plurality of pipes. Electrical currents are induced across the magnetic fields. A flow of electrically conductive fluid in the plurality of pipes is dependent on and controllable by the magnetic fields and/or the electrical currents.

Abstract: A heat sink operatively connected to an integrated circuit is configured to generate a magnetic field. Fluid flow toward and away from a hot spot of the integrated circuit is dependent on the magnetic field and an induced electrical current. A temperature sensor is used to take temperature measurements of the hot spot. A value of the induced electrical current is adjusted dependent on one or more temperature measurements taken by the temperature sensor.

Abstract: A heat sink has a heat spreader structure containing magneto-hydrodynamic fluid. Also, the heat spreader includes a central metallic cylinder and a metal ring screen surrounding the central metallic cylinder. Electrical and magnetic fields induce the magneto-hydrodynamic fluid to undergo a swirling motion. The swirling motion acts as an MHD pump and provides efficient heat dissipation from a heat source contacting the heat spreader. A heat sink spreader has a central metallic cylinder surrounded by a metallic ring screen, and a magneto-hydrodynamic fluid.

Abstract: A heat sink is configured to cool at least one hot spot of an integrated circuit. The heat sink has a first pipe and a second pipe disposed interior to and concentric with the first pipe, where at least a portion of each of the first pipe and the second pipe is arranged to be disposed vertically over the hot spot. An assembly connected to the first pipe and the second pipe is arranged to generate a magnetic field and induce electrical current flow through the magnetic field. A flow of thermally and electrically conductive fluid in the first pipe and a flow of the fluid in the second pipe are dependent on the electrical current flow and the magnetic field.

Abstract: A heat sink uses thermally conductive ferrofluid to cool an integrated circuit. A direction of flow of the ferrofluid in the heat sink is controlled by a motorized pump assembly. The motorized pump assembly uses a motor to rotate a metal plate to which at least one magnet is connected. The direction of flow of the ferrofluid is dependent on a magnetic field induced between the at least one magnet and at least one magnetic particle in the ferrofluid passing through the motorized pump assembly.

Abstract: A heat sink uses a ferrofluid-based pump assembly for controlling the direction of nanofluid flow within the heat sink. The nanofluid is thermally conductive and absorbs heat from a heat source, which is then directed away from the heat source by the ferrofluid-based pump assembly. The ferrofluid-based pump assembly uses a motor to rotate at least one magnet so as to rotate ferrofluid contained in the ferrofluid-based pump assembly. The direction of nanofluid flow within the heat sink is dependent on the movement of ferrofluid in the ferrofluid-based pump assembly.

Abstract: A heat sink uses a pump assembly to generate a radial magnetic field. Pipes arranged to house a portion of a first channel and a portion of a second channel are formed in the heat sink. The direction of fluid flow in the first channel and the direction of fluid flow in the second channel is dependent on the radial magnetic field. The radial magnetic field causes fluid in the first channel to flow toward a heat source and fluid in the second channel to flow away from the heat source, thereby resulting in heat transfer between the first and second channels and between the heat sink and the respective first and second channels. The heat sink may also use a heat exchanger assembly that is connected to the heat source, where the heat exchanger assembly is formed of a plurality of channels that each propagate fluid in one of the directions of the first channel and the second channel.