Abstract: Example implementations relate to computing device locations and computing devices having audio components thereon that change operational states. In some examples, a non-transitory computer-readable storage medium can include instructions that when executed cause a processor of an electronic device to determine a default host computing device of a plurality of computing devices, request a location of a first computing device of the plurality of computing devices using a sensor of the default host computing device, and request a location of a second computing device of the plurality of computing devices using the sensor. The instructions when executed can cause the processor to determine a first audio loop potential associated with the first computing device and a second audio loop potential associated with the second computing device, assign the first computing device as an active client and assign the second computing device as an inactive client.

Abstract: In some examples, a locking card tray can include a first elongated side, a second elongated side located opposite the first elongated side, a first end side connected to the first elongated side and the second elongated side, a rack tray, and an elastic deformable member, where in response to an integrated circuit card being received by the rack tray, the elastic deformable member is to rotate from a first position to a second position such that the elastic deformable member protrudes from the locking card tray.

Abstract: Example electronic devices are disclosed herein. In an example, the electronic device includes a housing including a plurality of portions that are pivotably coupled together. The plurality of portions including a first portion including a display panel, a second portion including a user input device, and a third portion including a touch sensitive surface. The second portion is pivotably coupled between the first portion and the third portion. The third portion is pivotable relative to the second portion to cover the user input device with the touch sensitive surface.

Abstract: An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.

Abstract: In some examples an electronic device includes a first wireless transceiver, a second wireless transceiver, and a processor. The processor is to transmit data via the first wireless transceiver, detect an indicator of a secure activity, and, in response to a detection of the indicator, stop transmission of the data via the first wireless transceiver and begin transmission of data of the secure activity via the second wireless transceiver.

Abstract: In some examples, the disclosure describes an electronic device with a display member, a base member rotatably coupled to the display member, the base member including an input component, a photovoltaic component coupled to an exterior surface of the display member to generate an amount of solar power, and an array of millimeter wave (mmWave) antennas to wirelessly transmit the amount of solar power to an external device.

Abstract: Examples of computing devices for establishing a communication link with a remote device to contact a remote technical support service are described herein. In an example, a computing device may include a cellular communication interface and a processor. The processor may receive a first user input indicative of contacting a remote technical support service for the computing device. Based on the first user input, the processor may further establish a communication link between the computing device and a remote device over the cellular communication interface to contact the remote technical support service when the computing device is unbootable.

Abstract: An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.

Abstract: An example device includes a conductive housing. The conductive housing has a slot containing a dielectric material. An antenna includes a resonating element disposed within the slot. A first connector is disposed within the slot. A second connector is disposed within the slot. The resonating element of the antenna is located between the first connector and the second connector.

Abstract: An example radio frequency (RF) front-end module may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.

Abstract: Techniques for antenna disposition in computing devices are described, in an example, a knuckle hinge coupled to a first component allows rotation of the first component relative to a second component. The knuckle hinge may be separated from the first component by a gap. An antenna may be disposed on the first component.

Abstract: An antenna includes a conductive monopole and a non-conductive slot. The non-conductive slot of the antenna has a shape complementary to a shape of the conductive monopole of the antenna. The conductive monopole of the antenna and the non-conductive slot of the antenna are 180-degree rotationally symmetric to one another about a center of the antenna.

Abstract: The present subject matter relates to examples of an antenna assembly that may include a SAR correction element. The antenna assembly may include a radiation body that can have transceiver portion and non-transceiver portion, such that the transceiver portion may send and receive a wireless signal. In one example, the SAR correction element may be electrically coupled between the non-transceiver portion and a ground plane in order to dissipate energy from the non-transceiver portion to the ground in way that the SAR correction element does not accumulate energy therein while dissipating the energy to the ground.

Abstract: An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.

Abstract: An example device includes a conductive housing. The conductive housing has a slot containing a dielectric material. An antenna includes a resonating element disposed within the slot. A first connector is disposed within the slot. A second connector is disposed within the slot. The resonating element of the antenna is located between the first connector and the second connector.

Abstract: A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor chip, a package body and an antenna layer. The semiconductor chip is disposed on the substrate. The package body encapsulates the semiconductor chip and includes an upper surface. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups connected together. Each antenna slot group includes a wave guiding slot extending along a first direction, and an irradiation slot group extending along a second direction, wherein the irradiation slot group is connected to the wave guiding slot.

Abstract: A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.