Abstract: A tip and stylus for a capacitive sensor are provided. The stylus includes a stylus body, an amplifier circuit, and a tip. The tip includes a first electrode, an insulating element, a second electrode, and a shield. The first electrode has a thread element at a distal end of the first electrode. The second electrode is aligned with a longitudinal axis of the stylus, the longitudinal axis being parallel with a central axis of the stylus. The shield is disposed between the first electrode and the second electrode. The first electrode and the second electrode are electrically insulated from the shield by a cap layer, in which the first electrode, the second electrode, and the shield selectively move in response to the tip of the stylus contacting a touch screen having the capacitive sensor in accordance to an angle of contact and a contact force.

Abstract: Embodiments of a stylus having a capacitive slide sensor and grip sensors are disclosed, for use with electronic devices and particularly with touchscreen devices. The stylus is in signal communication with the electronic device, either wired or wirelessly, and the slide sensor allows a user to generate a sliding data value as well as a contact/no-contact datum; these can be used as scaled control values or as buttonpress control values to control features of applications running on the electronic device. The capacitive sensors are formed on a single flexible PCB wrapped inside the stylus barrel.

Abstract: Embodiments of a circuit and a stylus for interacting with a capacitive sensor are disclosed. The stylus includes a stylus body, a circuit disposed within the stylus body, a tip, and a power source. The circuit includes an input terminal, an amplifier, and an output terminal. The tip includes a sensing electrode and an emitting electrode, and the tip is disposed on a proximal end of the stylus body. The power source is electrically coupled to the circuit. The input terminal of the circuit is electrically coupled to the sensing electrode of the tip, and the output terminal of the circuit is electrically coupled to the emitting electrode of the tip. The circuit receives a signal through the sensing electrode, amplifies and inverts the signal, and outputs the signal through the emitting electrode. The amplifier of the circuit amplifies only a portion of the signal that exceeds a threshold voltage.

Abstract: Embodiments of a stylus having a capacitive slide sensor and grip sensors are disclosed, for use with electronic devices and particularly with touchscreen devices. The stylus is in signal communication with the electronic device, either wired or wirelessly, and the slide sensor allows a user to generate a sliding data value as well as a contact/no-contact datum; these can be used as scaled control values or as buttonpress control values to control features of applications running on the electronic device. The capacitive sensors are formed on a single flexible PCB wrapped inside the stylus barrel.

Abstract: Embodiments of a circuit and a stylus for interacting with a capacitive sensor are disclosed. The stylus includes a stylus body, a circuit disposed within the stylus body, a tip, and a power source. The circuit includes an input terminal, an amplifier, and an output terminal. The tip includes a sensing electrode and an emitting electrode, and the tip is disposed on a proximal end of the stylus body. The power source is electrically coupled to the circuit. The input terminal of the circuit is electrically coupled to the sensing electrode of the tip, and the output terminal of the circuit is electrically coupled to the emitting electrode of the tip. The circuit receives a signal through the sensing electrode, amplifies and inverts the signal, and outputs the signal through the emitting electrode. The amplifier of the circuit amplifies only a portion of the signal that exceeds a threshold voltage.

Abstract: A method of fabricating a self-aligned metal layer structure is disclosed. The method includes: providing a substrate including a conductive layer; forming a pattern in the conductive layer; and electroplating the conductive layer to form thereon an electroplated metal layer such that the pattern is directly transferred in the electroplated metal layer in a self-aligned manner. Methods of fabricating optics are also disclosed. The methods are capable of high accuracy in alignment, and the optics can be used in the production of a lens module.

Abstract: A method of fabricating a self-aligned metal layer structure is disclosed. The method includes: providing a substrate including a conductive layer; forming a pattern in the conductive layer; and electroplating the conductive layer to form thereon an electroplated metal layer such that the pattern is directly transferred in the electroplated metal layer in a self-aligned manner. Methods of fabricating optics are also disclosed. The methods are capable of high accuracy in alignment, and the optics can be used in the production of a lens module.

Abstract: This invention provides a heat insulating cup sleeve formed by folding a blank and including a first heat insulating sheet having a first holding portion, a first extending portion, and a first fold line and a second heat insulating sheet having a second holding portion, a second extending portion, and a second fold line. The second fold line is connected with the first holding portion, and the first fold line is connected with the second holding portion. The first holding portion and the second holding portion are capable of being folded downward along the second fold line and the first fold line, respectively, to form an opening. When a cup is inserted into the opening, the first holding portion and the second holding portion press against an outer surface of the cup.

Abstract: A foldable bag, made of a flexible sheet or board like material having a plurality of fold lines, includes a bottom wall, two side walls respectively connected to two opposite sides of the bottom wall, and two connecting walls respectively connected with the side walls and the bottom wall to define a containing space therein. The side wall has a first fold line parallel to the bottom wall and is capable of being folded towards the center of the foldable bag. The connecting wall has two second fold lines respectively extended along the diagonal lines and intersected with each other, and a third fold line parallel to the bottom wall and extended through the intersection point of the two second lines, wherein the ends of the third fold line are connected to the respective ends of the first fold lines, wherein the second fold lines and the third fold lines are capable of being folded toward the center of the foldable bag.

Abstract: According to an embodiment of the present invention, a lens module is provided, which includes a first lens assembly including a first patterned substrate, a first recess formed from a first surface of the first patterned substrate, a first lens element disposed in the first recess, and a second lens element disposed on the first patterned substrate, wherein the second lens element aligns along an optical axis through the first lens element.

Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

Abstract: Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.

Abstract: An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.

Abstract: A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.

Abstract: Embodiments disclose an image sensor device, comprising a substrate comprising a plurality of photosensor cells located therein or thereon, a plurality of optical guide structures corresponding to the photosensor cells respectively, and a stacked layer surrounding the optical guide structures, comprising a plurality of top portions with sharp corners adjacent to the top edges of the optical guide structures.

Abstract: An image sensor device is disclosed. The image sensor device comprises a substrate having a pixel array therein. A first transparent layer with a curved surface is disposed on the substrate. A micro lens array is conformally disposed on the curved surface of the first transparent layer and corresponds to the pixel array in the substrate. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.

Abstract: A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.

Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

Abstract: Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.