Patents by Inventor Chien-Pin Chiu

Chien-Pin Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200287572
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Application
    Filed: May 21, 2020
    Publication date: September 10, 2020
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Yi-Hsiang KUNG, Shen-Fu TZENG, Li-Yuan FANG
  • Patent number: 10727569
    Abstract: A mobile device includes a first circuit board, a metal frame, an extension radiation element, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame includes a first portion coupled to the system ground plane. A clearance region is formed between the first portion and the system ground plane. The first portion and the extension radiation element are both coupled to a feeding point. An antenna structure is formed by the first portion and the extension radiation element. The second circuit board is coupled to the electronic component. The electronic component and the second circuit board are both adjacent to the first portion. The RF module is coupled to the feeding point, so as to excite the antenna structure.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: July 28, 2020
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Shen-Fu Tzeng, Yi-Hsiang Kung, Li-Yuan Fang
  • Patent number: 10714811
    Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: July 14, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Yi-Hsiang Kung
  • Patent number: 10700716
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: June 30, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang
  • Publication number: 20200161756
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Application
    Filed: January 23, 2020
    Publication date: May 21, 2020
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Publication number: 20200127368
    Abstract: A mobile device including a ground plane, a grounding branch, wherein a slot is formed between the ground plane and the grounding branch, a connecting element, wherein the grounding branch is electrically coupled through the connecting element to the ground plane and a feeding element, extending across the slot, and electrically coupled between the grounding branch and a signal source, wherein an antenna structure is formed by the grounding branch and the feeding element.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 23, 2020
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Ying-Chih WANG
  • Patent number: 10587041
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: March 10, 2020
    Assignee: Silicon Precision Industries Co., Ltd.
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Publication number: 20200052386
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.
    Type: Application
    Filed: October 22, 2019
    Publication date: February 13, 2020
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
  • Patent number: 10553932
    Abstract: A mobile device including a ground plane, a grounding branch, wherein a slot is formed between the ground plane and the grounding branch, a connecting element, wherein the grounding branch is electrically coupled through the connecting element to the ground plane and a feeding element, extending across the slot, and electrically coupled between the grounding branch and a signal source, wherein an antenna structure is formed by the grounding branch and the feeding element.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: February 4, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Ying-Chih Wang
  • Patent number: 10516202
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: December 24, 2019
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
  • Publication number: 20190386381
    Abstract: A mobile device, at least including a metal housing, being substantially a hollow structure, wherein the metal housing has a back region and at least one side region, a first slit, formed on the metal housing, a dielectric substrate, comprising at least a first protruded portion, a first connection element, positioned between the metal housing and the dielectric substrate, and electrically coupled to the metal housing and a first signal source, positioned inside and electrically coupled to the metal housing, wherein at least one portion of the metal housing is configured to receive and transmit at least one wireless signal.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
  • Patent number: 10490883
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: November 26, 2019
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
  • Publication number: 20190305024
    Abstract: A chip packaging device includes a chip carrier, a chip and a packaging structure that includes a packaging plate and a connecting unit. The chip carrier includes a substrate and the chip is disposed thereon. The packaging plate and the substrate are respectively disposed at two opposite sides of the chip. The connecting unit has first and a second ends, which are respectively connected to the packaging plate and the chip. The first and second ends respectively have first and second cross-sectional areas perpendicular to an axis, and the second cross-sectional area is smaller than the first cross-sectional area.
    Type: Application
    Filed: March 25, 2019
    Publication date: October 3, 2019
    Inventors: Zzu-Chi CHIU, Shao-Pin RU, Tsung-Pin HSIEH, Chien-Cheng WEI
  • Publication number: 20190288376
    Abstract: A mobile device including a ground plane, a grounding branch, wherein a slot is formed between the ground plane and the grounding branch, a connecting element, wherein the grounding branch is electrically coupled through the connecting element to the ground plane and a feeding element, extending across the slot, and electrically coupled between the grounding branch and a signal source, wherein an antenna structure is formed by the grounding branch and the feeding element.
    Type: Application
    Filed: June 5, 2019
    Publication date: September 19, 2019
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Ying-Chih WANG
  • Patent number: 10355341
    Abstract: A mobile device including a ground plane, a grounding branch, wherein a slot is formed between the ground plane and the grounding branch, a connecting element, wherein the grounding branch is electrically coupled through the connecting element to the ground plane and a feeding element, extending across the slot, and electrically coupled between the grounding branch and a signal source, wherein an antenna structure is formed by the grounding branch and the feeding element.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: July 16, 2019
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Ying-Chih Wang
  • Publication number: 20190165453
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a first nonconductive partition, a second nonconductive partition, a first connection element, and a second connection element. The dielectric substrate includes a first protruded portion. The metal layer lies on the dielectric substrate, and includes an upper element and a main element, wherein the upper element is separated from the main element by a first region. The metal housing is substantially a hollow structure, and has a first slit and a second slit, wherein a first projection of the first slit with respect to the dielectric substrate at least partially overlaps the first region, and a second projection of the second slit with respect to the dielectric substrate at least partially overlaps the first protruded portion. The mobile device is capable of operating in multiple bands.
    Type: Application
    Filed: February 1, 2019
    Publication date: May 30, 2019
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
  • Publication number: 20190148817
    Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.
    Type: Application
    Filed: January 14, 2019
    Publication date: May 16, 2019
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Yi-Hsiang KUNG
  • Publication number: 20190140671
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Application
    Filed: January 4, 2019
    Publication date: May 9, 2019
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Yi-Hsiang KUNG, Shen-Fu TZENG, Li-Yuan FANG
  • Patent number: 10218053
    Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: February 26, 2019
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Yi-Hsiang Kung
  • Patent number: 10211858
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: February 19, 2019
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang