Patents by Inventor Chien-Pin Chiu

Chien-Pin Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11411080
    Abstract: A heterojunction bipolar transistor includes a bottom sub-collector layer formed over a substrate. The heterojunction bipolar transistor also includes an upper sub-collector layer formed over the bottom sub-collector layer. The heterojunction bipolar transistor also includes a collector layer formed over the upper sub-collector layer. The heterojunction bipolar transistor also includes a base layer formed over the collector layer. The heterojunction bipolar transistor also includes an emitter layer formed over the base layer. The heterojunction bipolar transistor also includes a passivation layer covering the bottom sub-collector layer, the upper sub-collector layer, the collector layer, the base layer, and the emitter layer. The heterojunction bipolar transistor also includes a collector electrode that covers the portion of the passivation layer that is over the sidewall of the upper sub-collector layer.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: August 9, 2022
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Chien-Rong Yu, Shu-Hsiao Tsai, Jui-Pin Chiu, She-Hsin Hsiao
  • Publication number: 20220216303
    Abstract: A heterojunction bipolar transistor includes a bottom sub-collector layer formed over a substrate. The heterojunction bipolar transistor also includes an upper sub-collector layer formed over the bottom sub-collector layer. The heterojunction bipolar transistor also includes a collector layer formed over the upper sub-collector layer. The heterojunction bipolar transistor also includes a base layer formed over the collector layer. The heterojunction bipolar transistor also includes an emitter layer formed over the base layer. The heterojunction bipolar transistor also includes a passivation layer covering the bottom sub-collector layer, the upper sub-collector layer, the collector layer, the base layer, and the emitter layer. The heterojunction bipolar transistor also includes a collector electrode that covers the portion of the passivation layer that is over the sidewall of the upper sub-collector layer.
    Type: Application
    Filed: January 5, 2021
    Publication date: July 7, 2022
    Inventors: Chien-Rong YU, Shu-Hsiao TSAI, Jui-Pin CHIU, She-Hsin HSIAO
  • Patent number: 11362687
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: June 14, 2022
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang
  • Patent number: 11145958
    Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: October 12, 2021
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Shen-Fu Tzeng, Yi-Hsiang Kung, Li-Yuan Fang
  • Publication number: 20210313707
    Abstract: This document describes techniques and apparatuses that include a three-dimensional (3D) antenna module for transmitting or receiving electromagnetic millimeter waves (mmWaves). In general, a user equipment (UE) may include the 3D antenna module in a corner of a housing of the UE. The 3D antenna module may include three antenna panels that are generally planar and generally orthogonal to three respective axes of a Cartesian-coordinate system. The 3D antenna module may transmit and receive the electromagnetic mmWaves as part of a wireless link between the UE and another device, such as a satellite that is part of a wireless-communication network. In general, the 3D antenna module may mitigate propagation losses and allow the UE to maintain a link-budget for the wireless link.
    Type: Application
    Filed: June 16, 2021
    Publication date: October 7, 2021
    Applicant: Google LLC
    Inventors: Jibing Wang, Aamir Akram, Erik Richard Stauffer, Sharath Ananth, Chien Pin Chiu, ShihHao Chiu
  • Patent number: 11063343
    Abstract: A mobile device including a ground plane, a grounding branch, wherein a slot is formed between the ground plane and the grounding branch, a connecting element, wherein the grounding branch is electrically coupled through the connecting element to the ground plane and a feeding element, extending across the slot, and electrically coupled between the grounding branch and a signal source, wherein an antenna structure is formed by the grounding branch and the feeding element.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: July 13, 2021
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Ying-Chih Wang
  • Patent number: 11038258
    Abstract: A mobile device, at least including a metal housing, being substantially a hollow structure, wherein the metal housing has a back region and at least one side region, a first slit, formed on the metal housing, a dielectric substrate, comprising at least a first protruded portion, a first connection element, positioned between the metal housing and the dielectric substrate, and electrically coupled to the metal housing and a first signal source, positioned inside and electrically coupled to the metal housing, wherein at least one portion of the metal housing is configured to receive and transmit at least one wireless signal.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 15, 2021
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
  • Publication number: 20210013590
    Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 14, 2021
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Shen-Fu TZENG, Yi-Hsiang KUNG
  • Patent number: 10879588
    Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, a second feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second feeding element is directly or indirectly electrically connected to the second portion. A second antenna structure is formed by the second feeding element and the second portion. The RF module is electrically coupled to the first feeding element and the second feeding element, so as to excite the first antenna structure and second antenna structure.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: December 29, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
  • Patent number: 10879591
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a first nonconductive partition, a second nonconductive partition, a first connection element, and a second connection element. The dielectric substrate includes a first protruded portion. The metal layer lies on the dielectric substrate, and includes an upper element and a main element, wherein the upper element is separated from the main element by a first region. The metal housing is substantially a hollow structure, and has a first slit and a second slit, wherein a first projection of the first slit with respect to the dielectric substrate at least partially overlaps the first region, and a second projection of the second slit with respect to the dielectric substrate at least partially overlaps the first protruded portion. The mobile device is capable of operating in multiple bands.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: December 29, 2020
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
  • Patent number: 10833398
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: November 10, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
  • Publication number: 20200303810
    Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Shen-Fu TZENG, Yi-Hsiang KUNG, Li-Yuan FANG
  • Publication number: 20200287572
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Application
    Filed: May 21, 2020
    Publication date: September 10, 2020
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Yi-Hsiang KUNG, Shen-Fu TZENG, Li-Yuan FANG
  • Patent number: 10727569
    Abstract: A mobile device includes a first circuit board, a metal frame, an extension radiation element, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame includes a first portion coupled to the system ground plane. A clearance region is formed between the first portion and the system ground plane. The first portion and the extension radiation element are both coupled to a feeding point. An antenna structure is formed by the first portion and the extension radiation element. The second circuit board is coupled to the electronic component. The electronic component and the second circuit board are both adjacent to the first portion. The RF module is coupled to the feeding point, so as to excite the antenna structure.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: July 28, 2020
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Shen-Fu Tzeng, Yi-Hsiang Kung, Li-Yuan Fang
  • Patent number: 10714811
    Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: July 14, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Yi-Hsiang Kung
  • Patent number: 10700716
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: June 30, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang
  • Publication number: 20200127368
    Abstract: A mobile device including a ground plane, a grounding branch, wherein a slot is formed between the ground plane and the grounding branch, a connecting element, wherein the grounding branch is electrically coupled through the connecting element to the ground plane and a feeding element, extending across the slot, and electrically coupled between the grounding branch and a signal source, wherein an antenna structure is formed by the grounding branch and the feeding element.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 23, 2020
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Ying-Chih WANG
  • Publication number: 20200052386
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.
    Type: Application
    Filed: October 22, 2019
    Publication date: February 13, 2020
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
  • Patent number: 10553932
    Abstract: A mobile device including a ground plane, a grounding branch, wherein a slot is formed between the ground plane and the grounding branch, a connecting element, wherein the grounding branch is electrically coupled through the connecting element to the ground plane and a feeding element, extending across the slot, and electrically coupled between the grounding branch and a signal source, wherein an antenna structure is formed by the grounding branch and the feeding element.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: February 4, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Ying-Chih Wang
  • Patent number: 10516202
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: December 24, 2019
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo