Patents by Inventor Chien-Ping Kuo

Chien-Ping Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8305749
    Abstract: A clip mechanism includes a first lateral wall whereon a slot is formed, and a second lateral wall disposed on a side of the first lateral wall. At least one opening is formed on the second lateral wall for engaging with a protrusion of a casing. The clip mechanism further includes a bending part bent for connecting the first lateral wall and the second lateral wall. The clip mechanism further includes a resilient arm. A first end of the resilient arm is connected to an end of the slot of the first lateral wall, and a second end of the resilient arm protrudes out of a side of the slot. The resilient arm further includes a contacting part protruding out of the other side of the slot for contacting against an electronic device so as to ground the electronic device.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: November 6, 2012
    Assignee: Wistron Corporation
    Inventors: Kun-Hui Lai, Cheng-Hsiang Chuang, Chien-Ping Kuo
  • Publication number: 20110194236
    Abstract: A clip mechanism includes a first lateral wall whereon a slot is formed, and a second lateral wall disposed on a side of the first lateral wall. At least one opening is formed on the second lateral wall for engaging with a protrusion of a casing. The clip mechanism further includes a bending part bent for connecting the first lateral wall and the second lateral wall. The clip mechanism further includes a resilient arm. A first end of the resilient arm is connected to an end of the slot of the first lateral wall, and a second end of the resilient arm protrudes out of a side of the slot. The resilient arm further includes a contacting part protruding out of the other side of the slot for contacting against an electronic device so as to ground the electronic device.
    Type: Application
    Filed: September 13, 2010
    Publication date: August 11, 2011
    Inventors: Kun-Hui Lai, Cheng-Hsiang Chuang, Chien-Ping Kuo