Patents by Inventor Chien-Sen Huang

Chien-Sen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160332470
    Abstract: The present disclosure provides a dye ribbon for sublimation thermal transfer printing including a ribbon body and a dye layer. The ribbon body includes a substrate and a lubricating and thermal resistant material. The lubricating and thermal resistant material is dispersed in the substrate, and the content of which is 0.5-20% of weight of the substrate. The dye layer is disposed on the ribbon body.
    Type: Application
    Filed: July 20, 2015
    Publication date: November 17, 2016
    Inventors: Tze-Wei LIU, Chien-Sen HUANG
  • Patent number: 6736650
    Abstract: An electrical connector (1) includes a dielectric housing (10), a plurality of terminals (13) received in the housing, and a retention mechanism (12) pivotally attached to the housing. The housing defines a plurality of terminal-passages (108) and first mating members (103). Each of terminals includes a bent portion (134). The retention mechanism has an elongate stopper member (120). A pair of cantilevers (122) depends from the stopper member. A second mating member (1222) is formed on each of the cantilevers, for engaging one of the first mating members. Thus the stopper member is rotatable between a first position in which the stopper is protected from thermal warp or deformation, and a second position in which the terminals are secured in the corresponding terminal-passages.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: May 18, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: I-Hsin Chen, Chien-Sen Huang, Zhi-Kai Guo
  • Patent number: 6299432
    Abstract: A mold for forming a dielectric housing for a card edge connector, wherein the housing has an elongated body defining a central slot for receiving a lower edge of a memory module. The elongated body has two lateral ends each formed with a tower for pivotably receiving an ejector for latching or ejecting the memory module received by the connector. A number of contact passageways are defined beside the slot for receiving a number of contacts therein for electrically engaging with golden fingers on the lower edge of the memory module. The mold has a gate located proximate to a lateral end face of one of the towers of the housing to be formed by the mold, and a number of core pins in the cavity for forming the contact passageways. The core pins located nearest to the gate have a cross section larger than that of the other core pins so that they are strong enough to withstand a fluctuation of a high pressure for injecting molten plastics into the mold.
    Type: Grant
    Filed: May 26, 1999
    Date of Patent: October 9, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Yuh-Huey Kang, Chien-Sen Huang