Abstract: An apparatus for transferring an electronic component including a first platform, a second platform, an actuator mechanism, and a flexible push generator is provided. The first platform is configured to carry a carrier substrate. The second platform is configured to carry a target substrate. The actuator mechanism is configured to actuate the first platform and the second platform to approach and move away from each other. The flexible push generator is disposed near the first platform or the second platform and generating a plurality of flexible pushes toward the first platform and the second platform in response to the first platform and the second platform actuated in a way that the first platform and the second platform approach each other.

Abstract: A method for repairing a light-emitting device, which comprises a plurality of light-emitting units disposed on a circuit substrate with at least one of the plurality of light-emitting units being damaged. The method for repairing a light-emitting device including the following steps is provided: removing the at least one damaged light-emitting unit from the circuit substrate to form an unoccupied position on the circuit substrate; providing a good light-emitting unit on a bottom of which a volatile adhesive material has been applied; using a pick and place module to place the good light-emitting unit at the unoccupied position on the circuit substrate; and melting and solidifying the volatile adhesive material so that the good light-emitting unit is affixed at the unoccupied position.

Abstract: An image display and a combined-type circuit carrying and controlling module thereof are provided. The combined-type circuit carrying and controlling module includes a first circuit substrate structure, a control substrate structure, a second circuit substrate structure, an insulative connection structure and a conductive connection structure. The first circuit substrate structure includes a first carrier substrate, a first circuit layout layer and a plurality of first conductive penetration bodies. The control substrate structure includes a circuit substrate and a circuit control chip. The second circuit substrate structure includes a second carrier substrate and a second circuit layout layer. The insulative connection structure is connected between the first carrier substrate and the second carrier substrate. The conductive connection structure is electrically connected between the first circuit layout layer and the second circuit layout layer.

Abstract: A chip-detecting method, a chip-detecting structure and a chip-carrying structure are provided. The chip-detecting method includes providing a chip-detecting structure including a plurality of micro heater groups, a chip-carrying structure for carrying a plurality of chips, and a plurality of soldering material groups disposed between the chip-carrying structure and the chip-detecting structure; placing the chip-carrying structure and the chip-detecting structure adjacent to each other, so that each of the soldering material groups simultaneously contact the chip-carrying structure and the chip-detecting structure; respectively curing the low-temperature soldering material groups by heating of the micro heater groups, so that the chips are electrically connected to the chip-detecting structure respectively through the low-temperature soldering material groups that have been cured; and then detecting the chips so as to divide the chips into a plurality of good chips and a plurality of bad chips.

Abstract: A portable electronic assembly and an adherable earphone structure thereof are provided. The adherable earphone structure includes a carrier substrate, an audio signal receiver, an audio signal processor, an audio signal player, a protective layer, and an adhesive layer. The audio signal receiver is configured for receiving an audio signal provided by a portable electronic device. The audio signal processor and the audio signal player are disposed on the carrier substrate and electrically connected to the audio signal processor. The protective layer is configured for covering the audio signal receiver, the audio signal processor and the audio signal player. The adhesive layer is disposed on the carrier substrate or the protective layer. When the adhesive layer is disposed on a face and near an ear of a user, the adherable earphone structure is disposed outside the ear of the user without touching the ear by the adhesive layer.

Abstract: An electronic element soldering method includes providing a substrate, wherein the substrate has a to-be-soldered position, placing an electronic device including an electronic element, a heating element, and a parallel-connected circuit on the to-be-soldered position of the substrate, adding a solder between the electronic element of the electronic device and the to-be-soldered position of the substrate, applying a heating current into the parallel-connected circuit of the electronic device to allow the heating element of the parallel-connected circuit to generate a thermal energy for melting the solder, thereby securing the electronic element on the to-be-soldered position of the substrate via the solder that is melted, applying a breaking current that is larger than the heating current into the parallel-connected circuit to allow an open to occur in a parallel branch corresponding to the heating element of the parallel-connected circuit, and stopping the breaking current.

Abstract: A method for soldering electronic components includes providing a circuit substrate; providing a plurality of electronic components; placing the plurality of electronic components onto the circuit substrate; applying a conductor between the plurality of electronic components and the circuit substrate; providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage; and melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor. Besides, a method for manufacturing a LED display is disclosed.

Abstract: A chip removing device and a chip removing method are provided. The chip removing device includes: a carrier substrate, a laser generation module, and a blowing module. The carrier substrate carries at least one substrate, and a plurality of chips disposed on the substrate. The laser generation module corresponds to the carrier substrate and is used to apply a laser beam to the chip to reduce the bonding force between the chip and the substrate. The blowing module is disposed above the carrier substrate and close to the substrate for applying a gas to the chip to blow the chip away from the substrate.

Abstract: A display module includes a circuit substrate, a plurality of image display units and at least one optical sensor. The plurality of image display units is disposed on the circuit substrate in a matrix arrangement. The at least one optical sensor is disposed at a position of the circuit substrate where there is no image display unit disposed thereon. A quantity ratio of the image display units and the at least one optical sensor is between 1 and 100000.

Abstract: An LED chip package structure and a method of manufacturing the same are provided. The method of manufacturing the LED chip package structure includes providing a phosphor film including a phosphor layer and an outer enclosing layer for enclosing the phosphor layer that includes a plurality of phosphor particles; removing the outer enclosing layer from the phosphor layer for exposing the phosphor layer; and then covering an LED chip with the phosphor layer. The LED chip package structure includes an LED chip and a phosphor layer for covering the LED chip. The phosphor layer includes a plurality of phosphor particles tightly connected with each other, and the phosphor layer has no non-phosphor material. Therefore, the LED chip can be directly covered by the phosphor layer without the outer enclosing layer, and the phosphor particle without the non-phosphor material can directly contact the LED chip.

Abstract: A chip-transferring module, and a device and a method for transferring and bonding chips are provided. The chip-transferring module includes a mounting main body, a light-transmitting member, a first gas guiding structure and a second gas guiding structure. The mounting main body has a first accommodating space and a second accommodating space. The light-transmitting member is disposed in the first accommodating space. The first gas guiding structure is disposed in the mounting main body and has a plurality of suction openings exposed out of the mounting main body. The second gas guiding structure is disposed in the mounting main body and has at least one intake opening communicating with the second accommodating space.

Abstract: A method for transferring chips and a method for manufacturing an LED display are introduced. The method for manufacturing the LED display includes the method for transferring chips. The method for transferring chips includes providing a carrier substrate on which multiple LED chips are carried; providing a target substrate on which wires capable of forming circuits with the LED chips are disposed; transferring the LED chips carried on the carrier substrate onto the wires; galvanizing the wires to trigger at least partial of the LED chips to generate light by the circuits formed; checking the LED chips forming the circuit and fixing the LED chips generating light on the wire; and removing LED chips which fail to generate light.

Abstract: A method for repairing a light-emitting device, which comprises a plurality of light-emitting units disposed on a circuit substrate with at least one of the plurality of light-emitting units being damaged. The method for repairing a light-emitting device including the following steps is provided: removing the at least one damaged light-emitting unit from the circuit substrate to form an unoccupied position on the circuit substrate; providing a good light-emitting unit on a bottom of which a volatile adhesive material has been applied; using a pick and place module to place the good light-emitting unit at the unoccupied position on the circuit substrate; and melting and solidifying the volatile adhesive material so that the good light-emitting unit is affixed at the unoccupied position.

Abstract: A micro heater chip, a wafer-level electronic chip assembly and a chip assembly stacking system are provided. The chip assembly stacking system includes a plurality of wafer-level electronic chip assemblies stacked on top of one another and electrically connected with each other. Each wafer-level electronic chip assembly includes a wafer-level electronic chip and a micro heater chip disposed on the wafer-level electronic chip. The micro heater chip includes a heating structure and an insulative structure disposed between the heating structure and the wafer-level electronic chip. The heating structure includes a carrier body, at least one micro heater disposed on or inside the carrier body, and a plurality of conductive connection layers passing through the carrier body. The insulative structure includes an insulative body disposed between the heating structure and the wafer-level electronic chip, and a plurality of conductive material layers passing through the insulative body.

Abstract: A method of manufacturing a display module is provided and includes providing a substrate; disposing a plurality of light emitting components on the substrate in an array arrangement; and disposing at least one optical sensor on the substrate, wherein the at least one optical sensor is located between corresponding two of the plurality of light emitting components when the plurality of light emitting components and the at least one optical sensor are disposed on the substrate. Besides, a full screen image display device including a display module prepared in accordance with the aforementioned method is provided. The present invention can provide a full screen image without any notch.

Abstract: An LED chip structure, a chip transferring system and a chip transferring method are provided. The chip transferring system includes a liquid receiving tank, an electromagnetic field generating module and a connection layer removing module. A plurality of LED chip structures are randomly distributed in the liquid substance of the liquid receiving tank. The electromagnetic field generating module movably is disposed inside or removed from the liquid receiving tank. The connection layer removing module is disposed above the circuit substrate. Each of the LED chip structures includes an LED chip, a removable connection layer and a magnetic material layer. The LED chip structure can be transferred from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module, and the magnetic material layer can be separated from the LED chip while the removable connection layer is removed by the connection layer removing module.

Abstract: A full-screen image display and an optical assembly thereof are provided. The full-screen image display includes a first display module and a second display module. The first display module is an organic LED display, a liquid crystal display or an LED display for providing a first image, and the second display module is an LED display for providing a second image. The first display module and the second display module are adjacent or connected to each other, and the first image and the second image are combined to form a continuous image. The second display module includes a circuit substrate, an image display unit disposed on the circuit substrate, and a plurality of electronic units disposed on the circuit substrate. The image display unit includes a plurality of LED chips disposed on the circuit substrate, and the second image is provided by the LED chips.

Abstract: An optical wavelength conversion composite material is provided and includes a first wavelength conversion material and an inorganic covering layer. The first wavelength conversion material is selected from the group consisting of a first quantum dot, a first phosphor, and a combination thereof. The inorganic covering layer covers the first wavelength conversion material, and the inorganic covering layer includes SiO2, TiO2 and SixTiyO4?z, wherein x is from 0.1 to 0.4, y is from 0.5 to 0.8, and z is from 0.01 to 3.99. The optical wavelength conversion composite material has improved luminous efficiency and is stable. Besides, a related manufacturing method and a related optical wavelength conversion composite structure are provided.

Abstract: The present invention provides a chip carrier structure including: a non-circuit substrate, a plurality of micro heaters, and an adhesive layer. The micro heaters are disposed on the non-circuit substrate. The adhesive layer is disposed on the micro heaters, and a plurality of chips are disposed on the adhesive layer. Thereby, the present invention improves the solder yield of the process by a wafer carrying structure and a wafer carrying device.

Abstract: A method for repairing a semiconductor chip and a device for repairing a semiconductor chip is provided, and the method for repairing a semiconductor chip includes: providing a plurality of light-emitting units, and at least one of the light-emitting units being a damaged light-emitting unit; next, removing the damaged light-emitting unit to form an unoccupied position; then, using a pick and place module to obtain a good light-emitting unit from a carrier board; then, a volatile adhesive material is formed on the bottom of the good light-emitting unit; next, the volatile adhesive material is used to adhere the good light-emitting unit to the unoccupied position; finally, the good light-emitting unit is heated so that the good light-emitting unit is fixed onto the unoccupied position.