Abstract: A semiconductor package includes a circuit substrate, a die, a frame structure, and a heat sink lid. The die is disposed on the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies.

Abstract: A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.

Abstract: A radiation-emitting device having comprising: a substrate (1); a first electrode (2) and a second electrode; (9), at least one emitter layer (5) arranged between the first and second electrodes and emitting light in the violet or blue spectral range, wherein the emitter layer comprises a matrix material and, relative to the matrix material, 0.1%-5% by weight of a fluorescent, radiation-emitting emitter and 1-30% by weight of a phosphorescent exciton trap; and wherein the emission maximum of the fluorescent emitter and that of the phosphorescent exciton trap being situated in the blue, violet or ultraviolet spectral range.

Abstract: A radiation-emitting device comprising a substrate, a first electrode and a second electrode, and an emitter layer arranged between the first and second electrode. The emitter layer here comprises a matrix material, 0.5-5% by weight of a radiation emitting emitter and 5-30% by weight of a phosphorescent exciton scavenger. The proportion by weight of the exciton scavenger here is higher than that of the radiation emitting emitter, and the emission maximum of the exciton scavenger is at a shorter wavelength than that of the radiation emitting emitter. In addition, the radiation-emitting device is characterized in that the current efficiency of the emitter layer is increased by at least 10% compared to the current efficiency of an emitter layer without exciton scavenger.

Abstract: A radiation-emitting device having comprising: a substrate (1); a first electrode (2) and a second electrode; (9), at least one emitter layer (5) arranged between the first and second electrodes and emitting light in the violet or blue spectral range, wherein the emitter layer comprises a matrix material and, relative to the matrix material, 0.1%-5% by weight of a fluorescent, radiation-emitting emitter and 1-30% by weight of a phosphorescent exciton trap; and wherein the emission maximum of the fluorescent emitter and that of the phosphorescent exciton trap being situated in the blue, violet or ultraviolet spectral range.

Abstract: A radiation-emitting device comprising a substrate, a first electrode and a second electrode, and an emitter layer arranged between the first and second electrode. The emitter layer here comprises a matrix material, 0.5-5% by weight of a radiation emitting emitter and 5-30% by weight of a phosphorescent exciton scavenger. The proportion by weight of the exciton scavenger here is higher than that of the radiation emitting emitter, and the emission maximum of the exciton scavenger is at a shorter wavelength than that of the radiation emitting emitter. In addition, the radiation-emitting device is characterized in that the current efficiency of the emitter layer is increased by at least 10% compared to the current efficiency of an emitter layer without exciton scavenger.

Abstract: A calibration method of an optical transceiver module includes the steps of receiving an input voltage, detecting an optical signal for generating an input power based on the optical signal, generating a compensating power based on the input voltage, and generating a calibrating power based on the compensating power and the input power.

Abstract: An optical communication module includes a driving unit, an optical transmitting unit, a control unit and a signal transform control unit. The driving unit outputs a bias signal and a modulation signal in accordance with a bias control signal and a modulation control signal. The optical transmitting unit is electrically connected to the driving unit, outputs an optical signal in accordance with the bias signal and the modulation signal, and generates a feedback signal. The signal transform control unit is electrically connected to the driving unit and generates the bias control signal and the modulation control signal to be inputted to the driving unit. The control unit is electrically connected to the optical transmitting unit and the signal transform control unit, and controls the signal transform control unit in accordance with the feedback signal. A control method of the optical communication module is also disclosed.

Abstract: A calibration method of an optical transceiver module includes the steps of receiving an input voltage, detecting an optical signal for generating an input power based on the optical signal, generating a compensating power based on the input voltage, and generating a calibrating power based on the compensating power and the input power.

Abstract: An optical transceiver module for transmitting an optical signal includes a receiver, a clock data recovery circuit and a controller. The receiver receives the optical signal and converts the optical signal into an electric signal. The clock data recovery circuit receives the electric signal and recovers the clock and data of the electric signal. The controller is electrically connected with and monitors the clock data recovery circuit. Also, a control method of an optical transceiver module is provided.