Patents by Inventor Chien-Shu Hsu

Chien-Shu Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955439
    Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin
  • Publication number: 20060147749
    Abstract: A polymeric light emitting diode (PLED) device comprises: a substrate; a positive electrode formed above the substrate; a hole transportation layer formed above the positive electrode; an organic light emitting composite layer formed above the hole transportation layer, comprising a plurality of organic light emitting layers, wherein every organic light emitting layer has an polymeric host material with a higher energy gap, and at least one of the organic light emitting layers is doped with an polymeric material with a lower energy gap; and a negative electrode formed above the organic light emitting composite layer.
    Type: Application
    Filed: September 8, 2005
    Publication date: July 6, 2006
    Inventors: Hsin-Fei Meng, Sheng-Fu Horng, Chia-Hsun Chen, Je-Ping Hu, Chien-Shu Hsu, Kuo-Tong Lin
  • Publication number: 20060131568
    Abstract: A device having an organic transistor device integrated with an organic light-emitting diode's heterojunctions. This device at least comprises: a transparent substrate, an organic transistor and an organic light-emitting diode. The organic transistor at least includes an organic semiconductor layer, one of the organic semiconductor layers serves as the organic active layer of the organic light-emitting diode, and the organic active layer and the other organic semiconductor layers form heterojunctions. The present invention uses the organic semiconductor layer to simultaneously form the organic active layer of the organic transistor, so that the organic light-emitting diode and the organic transistor can be easily integrated together so as to solve the problem of the poor luminance efficiency of a conventional integrated organic transistor and organic light-emitting diode and the problem of its high manufacturing cost.
    Type: Application
    Filed: May 2, 2005
    Publication date: June 22, 2006
    Inventors: Hsin-Fei Meng, Sheng-Fu Horng, Chien-Shu Hsu, Wen-Tsang Liu, Yu-Zhong Yang