Patents by Inventor Chien-Shun Lin

Chien-Shun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Monitoring device with independent heat dissipation for image capture component
    Patent number: 8797454
    Abstract: A monitoring device with independent heat dissipation for an image capture component is provided. A body module and an image capture module are designed separately. Thus, the image capture component in the image module and the processing circuit board in the body module can dissipate heat separately. The device achieves the goal of improving the image capture component and the processing circuit board in capturing high quality images.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: August 5, 2014
    Assignee: Moxa Inc.
    Inventors: Chien Shun Lin, Pei Feng Tseng
  • MONITORING DEVICE WITH INDEPENDENT HEAT DISSIPATION FOR IMAGE CAPTURE COMPONENT
    Publication number: 20130278820
    Abstract: A monitoring device with independent heat dissipation for an image capture component is provided. A body module and an image capture module are designed separately. Thus, the image capture component in the image module and the processing circuit board in the body module can dissipate heat separately. The device achieves the goal of improving the image capture component and the processing circuit board in capturing high quality images.
    Type: Application
    Filed: April 20, 2012
    Publication date: October 24, 2013
    Applicant: MOXA INC.
    Inventors: Chien Shun LIN, Pei Feng TSENG
  • Computer enclosure with airflow-guiding device
    Patent number: 7839631
    Abstract: A computer enclosure includes a chassis and an airflow-guiding device mounted to the chassis. A receiving slot is defined in the chassis. An elastic receiving portion is formed around the receiving slot. One side of the airflow-guiding device is detachably fixed on the chassis. A first resilient securing member is formed on another side of the airflow-guiding device corresponding to the receiving slot. A wedge is formed on the first securing member to slide over the receiving portion and insert into the receiving slot.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: November 23, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Sheng-Hung Lee, Chien-Shun Lin, Li-Ping Chen
  • Heat-dissipating structure on case of industrial computer and manufacturing method thereof
    Publication number: 20100251536
    Abstract: A heat-dissipating structure on the case of an industrial computer and the method of manufacturing the same are provided. Heat-conducting elements are connected to the computer case by low-temperature soldering to reduce the use of heat-dissipating elements. This method also effectively reduces thermal resistance and production cost. Therefore, the structure achieves the goals of reducing heat dissipation resistance and production cost.
    Type: Application
    Filed: April 6, 2009
    Publication date: October 7, 2010
    Applicant: Moxa Inc.
    Inventor: Chien Shun Lin
  • COMPUTER ENCLOSURE WITH AIRFLOW-GUIDING DEVICE
    Publication number: 20100002372
    Abstract: A computer enclosure includes a chassis and an airflow-guiding device mounted to the chassis. A receiving slot is defined in the chassis. An elastic receiving portion is formed around the receiving slot. One side of the airflow-guiding device is detachably fixed on the chassis. A first resilient securing member is formed on another side of the airflow-guiding device corresponding to the receiving slot. A wedge is formed on the first securing member to slide over the receiving portion and insert into the receiving slot.
    Type: Application
    Filed: December 3, 2008
    Publication date: January 7, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHENG-HUNG LEE, CHIEN-SHUN LIN, LI-PING CHEN