Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A heat dissipating structure for a power supply is provided. The power supply includes a casing and a circuit module disposed in the casing. The heat dissipating structure includes at least one heat dissipating sheet, an inner material layer and an outer material layer, and a power device. The heat dissipating sheet is embedded in the casing through an insert molding process. The inner material layer and an outer material layer are formed on the inner surface and outer surface of the heat dissipating sheet respectively. The power device is disposed on the circuit board substrate. A hole portion corresponding to the contact member is disposed in the inner material layer such that the power device contacts the heat dissipating sheet through the hole portion.

Abstract: A metal photomask pod with a filter device and with atmoseal function is provided. The metal photomask pod includes a metal upper cover and a metal lower cover coupled to form an inner space for receiving a photomask. A side portion of the metal upper cover or the metal lower cover of the photomask pod includes at least one through hole for communicating the inner space with an outer space of the photomask pod. A filter device covers the through hole.