Abstract: Disclosed is a tungsten-doped lithium manganese iron phosphate-based particulate for a cathode of a lithium-ion battery. The particulates include a composition represented by a formula of LixMn0.998-y-zFeyMzW0.002PaO4a±p/C, wherein x, y, z, a, p, and M are as defined herein. Also disclosed is a powdery material including the particulates, and a method for preparing the powdery material.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A first die includes a first substrate and a first interconnect structure. A second die is bonded to the first die and includes a second substrate and a second interconnect structure, such that the first and second interconnect structures are arranged between the first and second substrates. A redistribution layer (RDL) stack is arranged on an outer side of the first die opposite the first interconnect structure. A heat path includes a through substrate via (TSV) extending from a conductive layer in the first interconnect structure, through the first substrate, and into the RDL stack. An RDL dielectric material is included in the RDL stack and separates the heat path from an ambient environment. A thermal conductivity of the RDL dielectric is over twenty times a thermal conductivity of an interconnect dielectric material of the first interconnect structure or of the second interconnect structure.

Abstract: A device structure according to the present disclosure includes a conductive feature disposed in a first dielectric layer, a ferroelectric tunnel junction (FTJ) stack disposed over the conductive feature, a spacer disposed along sidewalls of the FTJ stack, a second dielectric layer disposed over the spacer and the FTJ stack, a second dielectric layer disposed over the spacer and the FTJ stack, and a contact via extending through the second dielectric layer. The FTJ stack includes a bottom electrode layer electrically coupled to the conductive feature, a ferroelectric layer over the bottom electrode layer, and a top electrode layer on the ferroelectric layer. The top electrode layer is formed of a conductive metal oxide.

Abstract: A co-axial roller printing equipment includes a working platform, a roller, a grinding device, a cutting device and a coating structure. The working platform is configured for carrying a substrate and driving the substrate to move. The roller is disposed above the working platform and has a surface. The grinding device is disposed on the working platform and configured to contact and grind the surface of the roller. The cutting device is disposed on the working platform and configured to cut the surface of the roller to form a plurality of relief structure. The coating structure is configured to receive a slurry and coat the slurry on the relief structures. Wherein, the grinding device and the cutting device grind and cut the surface of the roller in sequence; wherein, the coating structure coats the slurry on the relief structures, then the roller prints the slurry on the substrate.

Abstract: An electromagnetic stamping apparatus includes a work platform configured to load a work piece. A stamping component is coupled to the work platform and has a first position and a second position. The stamping component includes a stamping rod and a stamping head. The stamping head stamps the work piece on the first position. An electromagnetic device is coupled to the stamping rod and generates a magnetic force according to an alternating current to push the stamping component to the first position to make the stamping component stamp the work piece. A compression spring pushes the stamping component to the second position according to the restoring force of the compression spring. Wherein, the magnetic force is greater than the restoring force of the compression spring to make the stamping component stamp the work piece twice in every waveform period of the alternating current.

Abstract: An electromagnetic stamping apparatus includes a work platform configured to load a work piece. A stamping component is coupled to the work platform and has a first position and a second position. The stamping component includes a stamping rod and a stamping head. The stamping head stamps the work piece on the first position. An electromagnetic device is coupled to the stamping rod and generates a magnetic force according to an alternating current to push the stamping component to the first position to make the stamping component stamp the work piece. A compression spring pushes the stamping component to the second position according to the restoring force of the compression spring. Wherein, the magnetic force is greater than the restoring force of the compression spring to make the stamping component stamp the work piece twice in every waveform period of the alternating current.

Abstract: A display panel is provided. The display panel includes a first substrate, a first insulating layer, a common electrode, a second insulating layer, a first pixel electrode, and a second pixel electrode. The first insulating layer is located on the first substrate. The common electrode having a first through hole is located on the first insulating layer. The second insulating layer covers the common electrode and partially covers the first through hole. The first pixel electrode is located on the second insulating layer and penetrates through the first through hole. The second pixel electrode is located on the second insulating layer. The second pixel electrode is adjacent to the first pixel electrode and overlaps a portion of the first through hole.

Abstract: A display panel is disclosed, which comprises a first substrate including: a base substrate; a semiconductor layer; a first insulating layer; a first scan line and a second scan line extended along a first direction respectively and portions of the first scan line and the second scan line overlapping with the semiconductor layer; a second insulating layer; a data line extended along a second direction and electrically connecting to the semiconductor layer through a first contact via, wherein the second direction is different from the first direction; and a first metal pad and a second metal pad electrically connecting to the semiconductor layer through two second contact vias respectively; wherein the first contact via and the two second contact vias are disposed between the first scan line and the second scan line.

Abstract: A display panel is provided. The display panel includes a first substrate, a first insulating layer, a common electrode, a second insulating layer, a first pixel electrode, and a second pixel electrode. The first insulating layer is located on the first substrate. The common electrode having a first through hole is located on the first insulating layer. The second insulating layer covers the common electrode and partially covers the first through hole. The first pixel electrode is located on the second insulating layer and penetrates through the first through hole. The second pixel electrode is located on the second insulating layer. The second pixel electrode is adjacent to the first pixel electrode and overlaps a portion of the first through hole.

Abstract: A display including a first substrate, a second substrate and spacers is provided. The first substrate includes a first base body, a device structure, an insulating layer, a pixel electrode layer and a planarization layer. The device structure is formed on the first base body. The insulating layer is formed on the device structure, and has at least one through hole. The pixel electrode layer is formed on the insulating layer. A portion of the pixel electrode layer extends into the through hole and electrically connects to the device structure. The pixel electrode layer forms a concave portion corresponding to the through hole. The planarization layer is formed on the pixel electrode layer and filled into the concave portion. The second substrate is disposed opposite to the first substrate. The spacers are disposed between the first substrate and the second substrate, and are correspondingly disposed on the planarization layer.

Abstract: A display panel is provided. The display panel includes a first substrate, a first insulating layer, a common electrode, a second insulating layer, a first pixel electrode, and a second pixel electrode. The first insulating layer is located on the first substrate. The common electrode having a first through hole is located on the first insulating layer. The second insulating layer covers the common electrode and partially covers the first through hole. The first pixel electrode is located on the second insulating layer and penetrates through the first through hole. The second pixel electrode is located on the second insulating layer. The second pixel electrode is adjacent to the first pixel electrode and overlaps a portion of the first through hole.

Abstract: A display panel is provided. The display panel includes a first substrate, a first insulating layer, a common electrode, a second insulating layer, a first pixel electrode, and a second pixel electrode. The first insulating layer is located on the first substrate. The common electrode having a first through hole is located on the first insulating layer. The second insulating layer covers the common electrode and partially covers the first through hole. The first pixel electrode is located on the second insulating layer and penetrates through the first through hole. The second pixel electrode is located on the second insulating layer. The second pixel electrode is adjacent to the first pixel electrode and overlaps a portion of the first through hole.

Abstract: A display including a first substrate, a second substrate and spacers is provided. The first substrate includes a first base body, a device structure, an insulating layer, a pixel electrode layer and a planarization layer. The device structure is formed on the first base body. The insulating layer is formed on the device structure, and has at least one through hole. The pixel electrode layer is formed on the insulating layer. A portion of the pixel electrode layer extends into the through hole and electrically connects to the device structure. The pixel electrode layer forms a concave portion corresponding to the through hole. The planarization layer is formed on the pixel electrode layer and filled into the concave portion. The second substrate is disposed opposite to the first substrate. The spacers are disposed between the first substrate and the second substrate, and are correspondingly disposed on the planarization layer.

Abstract: A display panel is disclosed, which comprises a first substrate including: a base substrate; a semiconductor layer; a first insulating layer; a first scan line and a second scan line extended along a first direction respectively and portions of the first scan line and the second scan line overlapping with the semiconductor layer; a second insulating layer; a data line extended along a second direction and electrically connecting to the semiconductor layer through a first contact via, wherein the second direction is different from the first direction; and a first metal pad and a second metal pad electrically connecting to the semiconductor layer through two second contact vias respectively; wherein the first contact via and the two second contact vias are disposed between the first scan line and the second scan line.

Abstract: A display device and a method for fabricating the same are provided. The device is an active matrix interference modulator (IMOD) display device which includes a thin film transistor and an interference modulator (IMOD). The interference modulator (IMOD) is integrated on the thin film transistor, a first metal layer is simultaneously used as a light-shielding pattern and a gate electrode, and a second metal layer is simultaneously used as a wiring and a source/drain metal layer. Therefore, the fabricating time and cost are saved. In addition, the aperture ratio of the display device is improved because the pixel thin film transistor is not below an optical gap.

Abstract: The present invention discloses a low temperature poly-silicon thin film transistor, a manufacturing method thereof, and a display device. Particularly, a metal film is formed between source and drain electrodes and a first conductive layer, and the metal film reacts with the poly-silicon of the source and drain electrodes to form metal silicide, whereby activating the source and drain electrodes at a low temperature. As such, the temperature of the manufacturing process of low temperature poly-silicon thin film transistor can be confined to 350° C. or lower.

Abstract: A single-outlet hot/cold water faucet of the type having a handle, a valve connected to the handle by a connecting plate and a lever and moved to open or close the water outlet, a revolving shaft turned by the handle to regulate the temperature of water in the mixing chamber, and a temperature detection and display device controlled by the handle to detect and show the temperature of water in the mixing chamber, wherein the temperature detection and display device includes a liquid crystal display mounted within a top chamber on the handle and covered by a transparent cap, a battery, a switch controlled by the handle to connect the battery to the liquid crystal display, and a temperature detecting probe connected to the liquid crystal display by a temperature detecting wire and inserted through the revolving shaft and disposed in a hole on the bottom extension rod of the connecting plate to detect the temperature of water in the mixing chamber.

Abstract: A faucet which having a spout, a handle, a middle cover, a temperature indicator and a top cover. A thermometer is installed in the hole of the strut of the middle cover for detecting the temperature of tap water which would be shown in the indicating window immediately.