Patents by Inventor Chien-Te Wu

Chien-Te Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11031352
    Abstract: A package includes a first dielectric layer, a device die over and attached to the first dielectric layer, an active through-via and a dummy through-via, and an encapsulating material encapsulating the device die, the active through-via, and the dummy through-via. The package further includes a second dielectric layer over and contacting the device die, the active through-via, and the dummy through-via. An active metal cap is over and contacting the second dielectric layer and electrically coupling to the active through-via. The active metal cap overlaps the active through-via. A dummy metal cap is over and contacting the second dielectric layer. The dummy metal cap overlaps the dummy through-via. The dummy metal cap is separated into a first portion and a second portion by a gap. A redistribution line passes through the gap between the first portion and the second portion of the dummy metal cap.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu, Chin-Te Wang
  • Publication number: 20210049246
    Abstract: Systems, methods, and devices are described herein for a deterministic approach that includes receiving an original layout of a semiconductor device that has a number of layers. A violation of a first design rule associated with a first layer of the number of layers is identified. A design rule compilation includes a plurality of design rules associated with each layer of the number of layers. A plurality of derived layers are generated based upon the plurality of design rules. Each derived layer of the plurality of derived layers includes one or more layers of the number of layers of the semiconductor device in which a physical movement to one layer impacts another layer. A forbidden region associated with a second layer of the plurality of layers is designated. A new layout of the number of layers having oriented differently than the original layout is generated such that no layer protrudes within the forbidden region.
    Type: Application
    Filed: November 8, 2019
    Publication date: February 18, 2021
    Inventors: Chin-Chang Hsu, Rachid Salik, Chien-Te Wu
  • Patent number: 10909297
    Abstract: Systems, methods, and devices are described herein for a deterministic approach that includes receiving an original layout of a semiconductor device that has a number of layers. A violation of a first design rule associated with a first layer of the number of layers is identified. A design rule compilation includes a plurality of design rules associated with each layer of the number of layers. A plurality of derived layers are generated based upon the plurality of design rules. Each derived layer of the plurality of derived layers includes one or more layers of the number of layers of the semiconductor device in which a physical movement to one layer impacts another layer. A forbidden region associated with a second layer of the plurality of layers is designated. A new layout of the number of layers having oriented differently than the original layout is generated such that no layer protrudes within the forbidden region.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: February 2, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chin-Chang Hsu, Rachid Salik, Chien-Te Wu
  • Publication number: 20200099368
    Abstract: An integrated circuit includes a semiconductor substrate and a plurality of circuit elements in or on the substrate. The circuit elements are defined by standard layout cells selected from a cell library. The circuit elements including a plurality of flip-flops. Each flip-flop has a data input terminal, a data output terminal, a clock input terminal, and a clock output terminal. A first one of the flip-flops directly abuts a second flip-flop such that the clock output terminal of the first flip-flop electrically connects with the clock input terminal of the second flip-flop.
    Type: Application
    Filed: August 9, 2019
    Publication date: March 26, 2020
    Inventors: Shao-Yu Steve Wang, Chien-Te Wu, Shang-Chih Hsieh, Nick Tsai
  • Publication number: 20200005991
    Abstract: The present disclosure provides a wireless charging coil, and the wireless charging coil comprises a first coil layer, a second coil layer and a first magnetic material. The second coil layer is stacked in parallel on a surface of the first coil layer to form a stacked structure, and it has a winding path identical to a winding path of the first coil layer. The first magnetic material is disposed on one side of the first coil layer and has a winding path which is different from the winding path of the first coil layer and with said side away from the second coil layer. Currents generated by a power source are evenly distributed in the stack structure to reduce a skin effect when the wireless charging coil is electrically connected to the power source.
    Type: Application
    Filed: June 27, 2019
    Publication date: January 2, 2020
    Applicant: HOLYGO CORPORATION
    Inventor: Chien-Te WU
  • Publication number: 20190252118
    Abstract: A punching process for wireless charging coils comprises: punching a metal piece for forming a coil structure and a fixing element, the coiling structure having a plurality of coil segments, a gap being between two of the plurality of coil segments, and the fixing element connecting the coil segments for keeping the width of the gap.
    Type: Application
    Filed: February 6, 2019
    Publication date: August 15, 2019
    Applicant: HOLYGO CORPORATION
    Inventor: Chien-Te WU
  • Publication number: 20190228902
    Abstract: A wireless charging coil structure with a function of heat dissipation comprises a first connecting terminal, a second connecting terminal and a coil. The coil is disposed between the first connecting terminal and the second connecting terminal, and configured to transmit a signal between the first connecting terminal and the second connecting terminal. The coil comprises a heat-pipe segment and a transmission segment electrically and heat-conductively connected with each other. The transmission segment has a predetermined thickness, the heat-pipe segment encircles an accommodating space, and a heat-dissipating medium is disposed in the accommodating space.
    Type: Application
    Filed: December 8, 2016
    Publication date: July 25, 2019
    Applicant: HOLYGO CORPORATION
    Inventor: Chien-Te WU
  • Patent number: 10338643
    Abstract: A magnetic electronic device includes a first body and a second body. The first body includes a first case and a magnetic member inside the first case. The second body includes a second case and includes a magnetic sensor, a magnetism guiding member and a switch control component inside the second case. The second case is connected to the first body to be movable relative to the first body. The magnetic sensor is disposed on the magnetism guiding member, and the switch control component is electrically connected to the magnetic sensor. The magnetism guiding member guides the magnetic field caused by the magnetic member, and the magnetic sensor detects the magnetic flux caused by the magnetic member. When the magnetic flux is larger than a first value, the switch control component switches a component's switch.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: July 2, 2019
    Assignee: HOLYGO CORPORATION
    Inventor: Chien-Te Wu
  • Patent number: 10070536
    Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing process is performed, such that at least one slit is formed in the glass film. A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on the glass film. A polymer layer is formed on the first circuit layer. The polymer layer covers surfaces of the first circuit layer and the glass film. A plurality of second conductive vias are formed in the polymer layer. A second circuit layer is formed on the polymer layer, such that a first circuit board structure is formed. A singulation process is performed, such that the first circuit board structure is divided into a plurality of second circuit board structures.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: September 4, 2018
    Assignee: Unimicron Technology Corp.
    Inventors: Chien-Tsai Li, Chien-Te Wu, Cheng-Chung Lo
  • Patent number: 9917046
    Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on an upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias. A first polymer layer is formed on the first circuit layer. The first polymer layer covers a surface of the first circuit layer and the upper surface of the glass film. A plurality of second conductive vias are formed in the first polymer layer. A second circuit layer is formed on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias. The E-chuck is removed.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: March 13, 2018
    Assignee: Unimicron Technology Corp.
    Inventors: Chien-Te Wu, Chien-Tsai Li, Cheng-Chung Lo
  • Publication number: 20180014409
    Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing process is performed, such that at least one slit is formed in the glass film. A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on the glass film. A polymer layer is formed on the first circuit layer. The polymer layer covers surfaces of the first circuit layer and the glass film. A plurality of second conductive vias are formed in the polymer layer. A second circuit layer is formed on the polymer layer, such that a first circuit board structure is formed. A singulation process is performed, such that the first circuit board structure is divided into a plurality of second circuit board structures.
    Type: Application
    Filed: July 5, 2016
    Publication date: January 11, 2018
    Inventors: Chien-Tsai Li, Chien-Te Wu, Cheng-Chung Lo
  • Publication number: 20180005933
    Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on an upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias. A first polymer layer is formed on the first circuit layer. The first polymer layer covers a surface of the first circuit layer and the upper surface of the glass film. A plurality of second conductive vias are formed in the first polymer layer. A second circuit layer is formed on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias. The E-chuck is removed.
    Type: Application
    Filed: July 4, 2016
    Publication date: January 4, 2018
    Inventors: Chien-Te Wu, Chien-Tsai Li, Cheng-Chung Lo
  • Publication number: 20170325917
    Abstract: A root assembly includes an implant body and a positioning device connected to the implant body. The implant body has a positioning hole formed through one end thereof and an engaging portion opposite to the positioning hole. The positioning hole has an end edge. The positioning device has a positioning seat where an artificial tooth is attached and a positioning unit extending through and out of the positioning seat. A first recognition portion is formed on the positioning seat. The location of the first recognition portion of the positioning seat corresponding to the end edge of the positioning hole can recognize that the positioning device is exactly positioned on the implant body, thereby preventing the positioning device from loosening.
    Type: Application
    Filed: May 12, 2016
    Publication date: November 16, 2017
    Inventor: CHIEN-TE WU
  • Patent number: 9782241
    Abstract: An orthodontic structure includes a body where at least one connecting hole is formed, a fastening part disposed on the body and fastened to an implant, and at least one traction assembly connected to the body. The traction assembly includes an orthodontic table and an adjustment part extending outwards from the orthodontic table to engage the connecting hole. The orthodontic table has at least one locking recess capable of holding a metal wire in place. The orthodontic structure is connected to the implant which is embedded in an alveolar bone in advance to provide a requisite anchorage effect required by orthodontics. Thus, the implant treatment and the orthodontic treatment can be concurrently executed to shorten the treatment time for straightening teeth and attain good implanting and straightening effects.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: October 10, 2017
    Assignees: Biomate Medical Devices Technology Co., Ltd.
    Inventor: Chien-Te Wu
  • Publication number: 20170202647
    Abstract: An orthodontic structure includes a body where at least one connecting hole is formed, a fastening part disposed on the body and fastened to an implant, and at least one traction assembly connected to the body. The traction assembly includes an orthodontic table and an adjustment part extending outwards from the orthodontic table to engage the connecting hole. The orthodontic table has at least one locking recess capable of holding a metal wire in place. The orthodontic structure is connected to the implant which is embedded in an alveolar bone in advance to provide a requisite anchorage effect required by orthodontics. Thus, the implant treatment and the orthodontic treatment can be concurrently executed to shorten the treatment time for straightening teeth and attain good implanting and straightening effects.
    Type: Application
    Filed: January 14, 2016
    Publication date: July 20, 2017
    Inventor: CHIEN-TE WU
  • Publication number: 20170083055
    Abstract: An electronic device includes a first body and a second body. The first body includes a first case and a magnetic member inside the first case. The second body includes a second case and includes a magnetic sensor, a magnetism guiding member and a switch control component inside the second case. The second case is connected to the first body to be movable relative to the first body. The magnetic sensor is disposed on the magnetism guiding member, and the switch control component is electrically connected to the magnetic sensor. The magnetism guiding member guides the magnetic field caused by the magnetic member, and the magnetic sensor detects the magnetic flux caused by the magnetic member. When the magnetic flux is larger than a first value, the switch control component switches a component's switch.
    Type: Application
    Filed: September 20, 2016
    Publication date: March 23, 2017
    Applicant: HOLYGO CORPORATION
    Inventor: Chien-Te WU
  • Patent number: 8586201
    Abstract: An iridium complex is disclosed, which has a structure represented by the following formula (I): wherein each of Z1 and Z3 represents an atomic group for forming a nitrogen-containing heteroaryl group or a nitrogen-containing heterocycloalkenyl group; Z2 represents an atomic group for forming an aryl group, a heteroaryl group, a cycloalkenyl group or a heterocycloalkenyl group; Y represents an atomic group for forming a 5-membered nitrogen-containing heterocycloalkenyl group; each of R1, R2, R3 and R4 represents a hydrogen atom or a substituent; m is 1 or 2; a, b and d is 0 or any positive integer; and c is an integer of from 0 to 2.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: November 19, 2013
    Assignees: Chimei Innolux Corporation, National Tsing Hua University
    Inventors: Chien-Hong Cheng, Tai-Yen Chen, Hung-Hsin Shih, Chien-Te Wu, Kuan-Che Wang, Ching-In Wu, Huai-Ting Shih
  • Publication number: 20120225248
    Abstract: The present invention relates to an artificial leather having composite fibers and a method for making the same. The artificial leather includes a substrate and a flexible film. The substrate includes a plurality of composite fibers. Each composite fiber includes a first composition and a second composition. The first composition is a thermoplastic non-elastomer, and the second composition is a thermoplastic elastomer. The second composition accounts for 5% to 70% of the total weight of the composite fiber. The second composition at the intersecting points between the composite fibers is molten to form a flexible bonding point. The flexible film is located on a surface of the substrate, and the material of the flexible film is an elastic polymer or a latex. Therefore, the artificial leather has excellent textile sensation and physical properties.
    Type: Application
    Filed: February 21, 2012
    Publication date: September 6, 2012
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: LUNG-CHUAN WANG, CHUNG-CHIH FENG, JUNG-CHING CHANG, HSIEN-CHANG HUNG, CHIEN-TE WU, TI-SHUN YEH
  • Publication number: 20100141133
    Abstract: An iridium complex is disclosed, which has a structure represented by the following formula (I): wherein each of Z1 and Z3 represents an atomic group for forming a nitrogen-containing heteroaryl group or a nitrogen-containing heterocycloalkenyl group; Z2 represents an atomic group for forming an aryl group, a heteroaryl group, a cycloalkenyl group or a heterocycloalkenyl group; Y represents an atomic group for forming a 5-membered nitrogen-containing heterocycloalkenyl group; each of R1, R2, R3 and R4 represents a hydrogen atom or a substituent; m is 1 or 2; a, b and d is 0 or any positive integer; and c is an integer of from 0 to 2.
    Type: Application
    Filed: February 12, 2010
    Publication date: June 10, 2010
    Applicants: CHI MEI OPTOELECTRONICS CORP., NATIONAL TSING HUA UNIVERSITY
    Inventors: Chien-Hong CHENG, Tai-Yen CHEN, Hung-Hsin SHIH, Chien-Te WU, Kuan-Che WANG, Ching-In Wu, Huai-Ting Shih
  • Patent number: D881126
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: April 14, 2020
    Assignee: HOLYGO CORPORATION
    Inventor: Chien-Te Wu