Patents by Inventor Chien-Ting Wang

Chien-Ting Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968911
    Abstract: A method for fabricating a semiconductor device includes the steps of: forming a magnetic tunneling junction (MTJ) stack on a substrate; forming a first spin orbit torque (SOT) layer on the MTJ stack; forming a first hard mask on the first SOT layer; and using a second hard mask to pattern the first hard mask, the first SOT layer, and the MTJ stack to form a MTJ.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: April 23, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hung-Chan Lin, Yu-Ping Wang, Chien-Ting Lin
  • Patent number: 11968910
    Abstract: A method for fabricating a semiconductor device includes the steps of first forming a magnetic tunneling junction (MTJ) stack on a substrate, forming an etch stop layer on the MTJ stack, forming a first spin orbit torque (SOT) layer on the etch stop layer, and then patterning the first SOT layer, the etch stop layer, and the MTJ stack to form a MTJ.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: April 23, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hung-Chan Lin, Yu-Ping Wang, Chien-Ting Lin
  • Patent number: 11944017
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes an insulation layer. A bottom electrode via is disposed in the insulation layer. The bottom electrode via includes a conductive portion and a capping layer over the conductive portion. A barrier layer surrounds the bottom electrode via. A magnetic tunneling junction (MTJ) is disposed over the bottom electrode via.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Tai-Yen Peng, Yu-Shu Chen, Chien Chung Huang, Sin-Yi Yang, Chen-Jung Wang, Han-Ting Lin, Jyu-Horng Shieh, Qiang Fu
  • Publication number: 20240099150
    Abstract: A method includes forming Magnetic Tunnel Junction (MTJ) stack layers, which includes depositing a bottom electrode layer; depositing a bottom magnetic electrode layer over the bottom electrode layer; depositing a tunnel barrier layer over the bottom magnetic electrode layer; depositing a top magnetic electrode layer over the tunnel barrier layer; and depositing a top electrode layer over the top magnetic electrode layer. The method further includes patterning the MTJ stack layers to form a MTJ; and performing a passivation process on a sidewall of the MTJ to form a protection layer. The passivation process includes reacting sidewall surface portions of the MTJ with a process gas comprising elements selected from the group consisting of oxygen, nitrogen, carbon, and combinations thereof.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Tai-Yen Peng, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang, Chien Chung Huang, Han-Ting Lin, Jyu-Horng Shieh, Qiang Fu
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11923315
    Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang
  • Patent number: 8359486
    Abstract: A high speed input/output (HSIO) system and a power saving control method for the HSIO system are provided. The HSIO system has a plurality of transmission speed modes. When an external device is connected to the HSIO system and an auto-configuration link is completed, the power saving control method forcibly sets an interface controller to any desired transmission speed specification in accordance with an actual transmission speed of to-be-transmitted data. Therefore, transmission speed mode of a single physical layer can be changed to achieve a low power transmission.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: January 22, 2013
    Assignee: Faraday Technology Corp.
    Inventors: Po-Yao Huang, Chien-Ting Wang
  • Publication number: 20110231685
    Abstract: A high speed input/output (HSIO) system and a power saving control method for the HSIO system are provided. The HSIO system has a plurality of transmission speed modes. When an external device is connected to the HSIO system and an auto-configuration link is completed, the power saving control method forcibly sets an interface controller to any desired transmission speed specification in accordance with an actual transmission speed of to-be-transmitted data. Therefore, transmission speed mode of a single physical layer can be changed to achieve a low power transmission.
    Type: Application
    Filed: May 20, 2010
    Publication date: September 22, 2011
    Applicant: Faraday Technology Corp.
    Inventors: Po-Yao Huang, Chien-Ting Wang
  • Patent number: 7842627
    Abstract: Compositions having good wrinkle resistance and other properties when made into garments an be made from an ethylene multi-block copolymers. The resulting fabrics and garments often have good chemical resistance, heat-resistances, and are dimensionally stable.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: November 30, 2010
    Assignee: Dow Global Technologies Inc.
    Inventors: Tong Gao, Hongyu Chen, Alberto Lora Lamia, Yuen-Yuen D. Chiu, Jerry Chien Ting Wang, Shih-Yaw Lai
  • Patent number: 7776770
    Abstract: Knit fabric compositions have now been discovered that often have a balanced combination of desirable properties. Said fibric compositions comprise fibers of olefin block interpolymers or homogeneous branched ethylene polymers or a combination thereof. The fibers are characterized by an amount of crosslinking such that the fabric is capable of being molded.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: August 17, 2010
    Assignee: Dow Global Technologies Inc.
    Inventors: Jerry Chien Ting Wang, Fabio D'ottaviano, Shih-Yaw Lai, Hongyu Chen, Yuen-Yuen D. Chiu, Rio Aditya Akbar, Beverly Selle
  • Publication number: 20080184498
    Abstract: Dyed fabric compositions have now been discovered that often have a balanced combination of desirable properties. The dyed fabric comprises one or more elastic fibers wherein the elastic fibers comprise the reaction product of at least one ethylene olefin block polymer and at least one crosslinking agent. Often the fabrics are characterized by a color change of greater than or equal to about 3.0 according to AATCC evaluation after a first wash by AATCC61-2003-2A.
    Type: Application
    Filed: January 16, 2008
    Publication date: August 7, 2008
    Applicant: Dow Global Technologies Inc.
    Inventors: Jerry Chien-Ting Wang, Rhonda B. Neel, Yuen-Yuen D. Chiu, Tracy Li Zhi Zhang, Shih-Yaw Lai, Alberto Lora Lamia, Fabio D'ottaviano, Hongyu Chen
  • Publication number: 20080182473
    Abstract: Fiber and fabric compositions of a continuous scouring process and/or capable of being heat set have now been discovered that often have a balanced combination of desirable properties. Said compositions comprise olefin block interpolymers.
    Type: Application
    Filed: January 16, 2008
    Publication date: July 31, 2008
    Applicant: Dow Global Technologies Inc.
    Inventors: Hongyu Chen, Fabio D'Ottaviano, Alberto Lora Lamia, Jose M. Rego, Jerry T. Chien Ting Wang, Federica Albiero, Guido Bramante
  • Publication number: 20080176473
    Abstract: Knit fabric compositions have now been discovered that often have a balanced combination of desirable properties. Said fibric compositions comprise fibers of olefin block interpolymers or homogeneous branched ethylene polymers or a combination thereof. The fibers are characterized by an amount of crosslinking such that the fabric is capable of being molded.
    Type: Application
    Filed: November 30, 2007
    Publication date: July 24, 2008
    Applicant: Dow Global Technologies Inc.
    Inventors: Jerry Chien Ting Wang, Fabio D'Ottaviano, Shih-Yaw Lai, Hongyu Chen, Yuen-Yuen D. Chiu, Rio Aditya Akbar, Beverly Selle
  • Publication number: 20080138599
    Abstract: Compositions having good wrinkle resistance and other properties when made into garments an be made from an ethylene multi-block copolymers. The resulting fabrics and garments often have good chemical resistance, heat-resistances, and are dimensionally stable.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 12, 2008
    Applicant: Dow Global Technologies Inc.
    Inventors: Tong Gao, Hongyu Chen, Alberto Lora Lamia, Yuen-Yuen D. Chiu, Jerry Chien Ting Wang, Shih-Yaw Lai