Patents by Inventor Chien-Tu Cheng

Chien-Tu Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220386506
    Abstract: Example implementations relate to heat-sink chambers. For instance, in an example a heat-sink can include a body including a first surface and a second surface, where the body defines: a chamber that extends from the first surface through a portion of a total thickness of the body; an opening in the second surface; and a channel that extends from the chamber through a remaining portion of the total thickness of the body to the opening to couple the chamber to the opening.
    Type: Application
    Filed: November 14, 2019
    Publication date: December 1, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hao-Wu Yang, Ai-Tsung Li, Hung-Wen Chang, Chien-Tu Cheng
  • Patent number: 11512708
    Abstract: An impeller for a viscous flow fan includes a hub having a longitudinal axis, and a plurality of ring-shaped wave blades disposed about and coupled to a perimeter of the hub, the wave blades disposed in a parallel and spaced apart from one another along the longitudinal axis by a blade gap. Each wave blade includes a center coincident with the longitudinal axis, an inner perimeter, an outer perimeter, and a wave-like cross-section about the perimeter of the hub in a direction perpendicular to the longitudinal axis, wherein at least a portion of the inner perimeter of at least one of the wave blades is spaced from the perimeter of the hub to form an air intake gap.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: November 29, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shih-Han Chen, Chien-tu Cheng, Jen-Hsun Hsieh
  • Publication number: 20220221917
    Abstract: Examples of a chassis component are described herein. In an example, the chassis component can have a recess having a mesh structure and a working fluid disposed therein. A conductive cover can seal the recess with the mesh structure and the working fluid therein.
    Type: Application
    Filed: September 19, 2019
    Publication date: July 14, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hung-Wen Chang, Ai-Tsung Li, Hao-Wu Yang, Chien-Tu Cheng, Shih-Han Chen
  • Publication number: 20220187885
    Abstract: Examples of devices and methods for controlling speed of cooling elements are discussed. The device comprises a first temperature reader to measure an ambient temperature in the vicinity of the device. The device further comprises a processor to control a speed of a cooling element of the device based on a comparison of the ambient temperature with a first threshold temperature.
    Type: Application
    Filed: September 6, 2019
    Publication date: June 16, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hung-Wen Chang, Chien-Tu Cheng, Hao-Wu Yang
  • Publication number: 20210199150
    Abstract: A thermally resistant coupling device coupled to an electronic device may include a screw to threadingly engage with a boss hole formed in the electronic device and an elastic insulative layer encapsulating a portion of the screw. An electronic device may include a screw hole, an elastic insulative layer placed within the screw hole, and a screw to threadingly engage with the screw hole and elastic insulative layer.
    Type: Application
    Filed: August 10, 2018
    Publication date: July 1, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chien Tu Cheng, Al-Tsung LI, Sung Hsueh Tsai, Jamil Abdul Wakil
  • Publication number: 20030117773
    Abstract: A thermal module (1) includes a base (30), a fin group (40), a heat pipe (50) and a connective interface. The fin group comprises a plurality of closely-spaced parallel fins (42). A first end of the heat pipe is attached to the base, and an opposite second end of the heat pipe is received in a slot defined in the fin group. The connective interface is disposed between the second end of the heat pipe and the fin group. The connective interface has high thermal conductivity, and readily connects with the heat pipe and the fin group.
    Type: Application
    Filed: April 30, 2002
    Publication date: June 26, 2003
    Inventors: Nien-Tien Cheng, Chien-Tu Cheng, Yi-Chang Liu