Patents by Inventor Chien-Wei Chou

Chien-Wei Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package-on-package structure and manufacturing method thereof
    Patent number: 10079222
    Abstract: A POP structure includes a circuit board, a bottom package structure, a top package structure, and a metal frame structure. The circuit board has a plurality of signal pads and dummy pads. The dummy pads surround the signal pads. The bottom package structure is disposed over the circuit board. The bottom package structure is electrically connected to the signal pads. The top package structure is disposed over the bottom package structure. The top package structure is electrically connected to the bottom package structure. The metal frame structure includes a body and a plurality of terminal pins. The body is located between the top package structure and the bottom package structure. The terminal pins extend outward from an edge of the top package structure to connect the top package structure and the dummy pads of the circuit board.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: September 18, 2018
    Assignee: Powertech Technology Inc.
    Inventors: Chien-Wei Chou, Yong-Cheng Chuang
  • PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180138149
    Abstract: A POP structure includes a circuit board, a bottom package structure, a top package structure, and a metal frame structure. The circuit board has a plurality of signal pads and dummy pads. The dummy pads surround the signal pads. The bottom package structure is disposed over the circuit board. The bottom package structure is electrically connected to the signal pads. The top package structure is disposed over the bottom package structure. The top package structure is electrically connected to the bottom package structure. The metal frame structure includes a body and a plurality of terminal pins. The body is located between the top package structure and the bottom package structure. The terminal pins extend outward from an edge of the top package structure to connect the top package structure and the dummy pads of the circuit board.
    Type: Application
    Filed: November 16, 2016
    Publication date: May 17, 2018
    Applicant: Powertech Technology Inc.
    Inventors: Chien-Wei Chou, Yong-Cheng Chuang