Patents by Inventor Chien-Wei Hou

Chien-Wei Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128232
    Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung-Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan
  • Publication number: 20240071999
    Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tseng Hsing Lin, Chien-Hsun Lee, Tsung-Ding Wang, Jung-Wei Cheng, Hao-Cheng Hou, Sheng-Chi Lin, Jeng-An Wang, Yao-Cheng Wu
  • Patent number: 9999645
    Abstract: A method of making longan seed extract is provided with choosing an extraction solvent; heating the extraction solvent to a first predetermined temperature; adding pulverized longan seed to the extraction solvent to prepare a solution; maintaining the solution at a second temperature for a predetermined period of time to obtain an extracted substance; filtering the extracted substance; and drying and cooling the filtered extracted substance to produce an extract.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: June 19, 2018
    Assignee: JOBEN BIO-MEDICAL CO., LTD.
    Inventors: Huang-Chung Tseng, Chien-Wei Hou
  • Publication number: 20150079205
    Abstract: A method of making longan seed extract is provided with choosing an extraction solvent; heating the extraction solvent to a first predetermined temperature; adding pulverized longan seed to the extraction solvent to prepare a solution; maintaining the solution at a second temperature for a predetermined period of time to obtain an extracted substance; filtering the extracted substance; and drying and cooling the filtered extracted substance to produce an extract.
    Type: Application
    Filed: July 9, 2014
    Publication date: March 19, 2015
    Inventors: Huang-Chung Tseng, Chien-Wei Hou
  • Publication number: 20150079204
    Abstract: A method of making longan seed extract is provided with choosing an extraction solvent; heating the extraction solvent to a first predetermined temperature; adding pulverized longan seed to the extraction solvent to prepare a solution; maintaining the solution at a second temperature for a predetermined period of time to obtain an extracted substance; filtering the extracted substance; and drying and cooling the filtered extracted substance to produce an extract.
    Type: Application
    Filed: July 9, 2014
    Publication date: March 19, 2015
    Inventors: Huang-Chung Tseng, Chien-Wei Hou
  • Publication number: 20120177761
    Abstract: A method of making longan seed extract is provided with choosing an extraction solvent; heating the extraction solvent to a first predetermined temperature; adding pulverized longan seed to the extraction solvent to prepare a solution; maintaining the solution at a second temperature for a predetermined period of time to obtain an extracted substance; filtering the extracted substance; and drying and cooling the filtered extracted substance to produce an extract.
    Type: Application
    Filed: July 8, 2009
    Publication date: July 12, 2012
    Inventors: Chien-Wei Hou, Ying-Chung lee, Huang-Chung Tseng, Jer-Yi Liao, Giao-Zhi Huang, Chieh-Wei Huang, Chun-Lan Keng
  • Publication number: 20060246054
    Abstract: The present invention relates to improved preparation of Bromelain in which the Bromelain is coated with an organic network polymer constructed by cross-linkage between organic acids and polysaccharides. The present invention also relates to a pharmaceutical composition comprising the present Bromelain preparation for treating inflammation, alleviating pains, and/or enhancing immuno-defense in a subject who needs such treatment.
    Type: Application
    Filed: May 2, 2005
    Publication date: November 2, 2006
    Inventors: Yuh-Shuen Chen, Chien-Wei Hou, Wen-Hung Lin