Abstract: A multi-axis servo control system includes a plurality of motors and a plurality of drive control apparatuses. The drive control apparatuses are connected to each other through an external field bus. Each drive control apparatus includes a control unit and a plurality of drive units. The drive units are connected to the control unit in series by a plurality of local buses to form a series-connected communication loop of sequentially transmitting data. Each drive unit controls at least one of the motors. The control unit receives multi-axis position commands through the external field bus, and the drive units correspondingly receive multi-axis commands through the local buses so as to control the motors in a decentralization manner.

Abstract: An androgen receptor (AR) binding molecule has the structure of Formula (I) shown in the following: wherein E is CH2, G is CH, is OH, NH2, OTf or C?C, X is CF3 or trifluoromethylphenyl, is a single bond, and Y and Z are CH2; or is absent, X is CF3, is a double bond, and Y and Z are CH.

Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes a magnetic tunneling junction (MTJ) and a spin Hall electrode (SHE). The MTJ includes a free layer, a reference layer and a barrier layer lying between the free layer and the reference layer. The SHE is in contact with the MTJ, and configured to convert a charge current to a spin current for programming the MTJ. The SHE is formed of an alloy comprising at least one heavy metal element and at least one light transition metal element. The heavy metal element is selected from metal elements with one or more valence electrons filling in 5d orbitals, and the light transition metal element is selected from transition metal elements with one or more valence electrons partially filling in 3d orbitals.

Abstract: A device structure includes a voltage regulator circuit, which includes: a first semiconductor die including a pulse width modulation (PWM) circuit and connected to a PWM voltage output node at which a pulsed voltage output is generated; and a series connection of an inductor and a parallel connection circuit, the parallel connection circuit including a parallel connection of capacitor-switch assemblies. A first end node of the series connection is connected to the PWM voltage output node; a second end node of the series connection is connected to electrical ground; each of the capacitor-switch assemblies includes a respective series connection of a respective capacitor and a respective switch; and each switch within the capacitor-switch assemblies is located within the first semiconductor die.

Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes a magnetic tunneling junction (MTJ) and a spin Hall electrode (SHE). The MTJ includes a free layer, a reference layer and a barrier layer lying between the free layer and the reference layer. The SHE is in contact with the MTJ, and configured to convert a charge current to a spin current for programming the MTJ. The SHE is formed of an alloy comprising at least one heavy metal element and at least one light transition metal element. The heavy metal element is selected from metal elements with one or more valence electrons filling in 5 d orbitals, and the light transition metal element is selected from transition metal elements with one or more valence electrons partially filling in 3 d orbitals.

Abstract: A barrier layer is formed in a portion of a thickness of sidewalls in a recess prior to formation of an interconnect structure in the recess. The barrier layer is formed in the portion of the thickness of the sidewalls by a plasma-based deposition operation, in which a precursor reacts with a silicon-rich surface to form the barrier layer. The barrier layer is formed in the portion of the thickness of the sidewalls in that the precursor consumes a portion of the silicon-rich surface of the sidewalls as a result of the plasma treatment. This enables the barrier layer to be formed in a manner in which the cross-sectional width reduction in the recess from the barrier layer is minimized while enabling the barrier layer to be used to promote adhesion in the recess.

Abstract: An electronic device, including a metal back cover, a ground radiator, a third radiator, and a metal frame including a first cutting opening, a second cutting opening, a first radiator located between the first cutting opening and the second cutting opening, and a second radiator located beside the second cutting opening and separated from the first radiator by the second cutting opening, is provided. An end of a first slot formed between the metal back cover and a first part of the first radiator is communicated with the first cutting opening, and a second slot formed between the metal back cover and a second part of the first radiator and between the metal back cover and the second radiator is communicated with the second cutting opening. The ground radiator connects the metal back cover and the first radiator and separates the first slot from the second slot.

Abstract: An electronic device including an active region and a peripheral region, and includes a substrate including a first edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue disposed in the peripheral region and overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue extends along an extension direction parallel to the first edge, and along the extension direction, a sum of lengths of the first conductive glue and the second conductive glue is less than a length of the insulating glue.

Abstract: A method for high dynamic range imaging is provided. The method includes the following stages. A first image from a first sensor capable of sensing a first spectrum is received. A second image from a second sensor capable of sensing a second spectrum is received. The second spectrum has a higher wavelength range as compared to the first spectrum. A first image feature from the first image and a second image feature from the second image are retrieved. The first and second images are fused by referencing the first image feature and the second image feature to generate a final image.

Abstract: A chip-transferring module, and a device and a method for transferring and bonding chips are provided. The chip-transferring module includes a mounting main body, a light-transmitting member, a first gas guiding structure and a second gas guiding structure. The mounting main body has a first accommodating space and a second accommodating space. The light-transmitting member is disposed in the first accommodating space. The first gas guiding structure is disposed in the mounting main body and has a plurality of suction openings exposed out of the mounting main body. The second gas guiding structure is disposed in the mounting main body and has at least one intake opening communicating with the second accommodating space.

Abstract: A power device includes: a semiconductor layer, a well region, a body region, a gate, a sub-gate, a source, a drain, and an electric field adjustment region. The sub-gate is formed above a top surface of the semiconductor layer, wherein a portion of the well region is located vertically beneath the sub-gate. The sub-gate is not directly connected to the gate. The electric field adjustment region has a conductivity type which is opposite to that of the well region. The electric field adjustment region is formed beneath and not in contact with the top surface of the semiconductor layer. The electric field adjustment region is located in the well region of the semiconductor layer, and at least a portion of the electric field adjustment region is located vertically beneath the sub-gate.

Abstract: An image calibration method is applied to an image calibration device includes an image receiver and an operation processor. The image calibration method of providing a motion deblur function includes driving a first camera to capture a first image having a first exposure time, driving a second camera disposed adjacent to the first camera to capture a second image having a second exposure time different from and at least partly overlapped with the first exposure time, and fusing a first feature of the first image and a second feature of the second image to generate a fusion image.

Abstract: An electronic device including an active region and a peripheral region, and includes a substrate including a first edge and a second edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue is disposed in the peripheral region and extends along an extension direction parallel to the first edge, and along the extension direction, a first distance between the first conductive glue and the second edge is greater than a second distance between the second conductive glue and the second edge.

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

Abstract: The crimping plier of the present invention includes an abutting member, a crimping member, a crimping tooth member, a cover plate, and a driving mechanism. The abutting member has a crimping hole for placing the connection terminal. The crimping member is adjacent to the crimping hole, and one end of an elastic element abuts against the crimping member. The crimping tooth member is fixedly disposed on the crimping member. The cover plate is connected to the abutting member and covers the crimping member, and the cover plate is also in contact with the other end of the elastic element. The driving mechanism is in contact with the crimping member to push the crimping member and the crimping tooth member. When the crimping member and the crimping tooth member slide, the elastic element provides an elastic force between the crimping member and the cover plate.

Abstract: An adjustable wrench is disclosed. The adjustable wrench is used for an assembly part. The adjustable wrench includes a frame and an adjustable member. An inner side of the frame has a first rack. The adjustable member has a second rack meshed with the first rack. The adjustable member and the frame are meshed with each other by the first rack and the second rack such that the adjustable member forms a first space inside the frame, wherein the adjustable member adjusts a meshing position of the second rack and the first rack to change the size of the first space; thus, the first space can match assembly parts of different specifications.

Abstract: An adjustable wrench is disclosed. The adjustable wrench is used for an assembly part. The adjustable wrench includes a frame, an adjustable member, and an engaging element. The adjustable member is adjacent to the frame to form a space between an inner side of the frame, wherein the adjustable member further has a rack. The engaging element is adjacent to the adjustable member and has an engaging portion that meshes with the rack such that, after the adjustable member slides, a position of the engaging portion meshed with the rack is changed so as to change the size of the space; thus, the space can be adjusted to match assembly parts of different specifications.

Abstract: A press cutting tool is disclosed. The press cutting tool includes a first and second plier, a first and second connecting rod, an opening, a pressing block, and a cutting block. The first and second connecting rods are connected to the second plier. The opening is used for placing a connection head. The pressing block is connected to the first connecting rod for clamping housing. The cutting block is connected to the second connecting rod for cutting the connection line; wherein the pressing block and the cutting block slide separately, and an initial distance from the pressing block to the opening is greater than an initial distance from the cutting block to the opening. After the first and second plier are pressed, the pressing block slides first to clamp and press the housing, and then the cutting block slides to cut the connection line.

Abstract: An adjustable wrench is disclosed. The adjustable wrench is used for an assembly part. The adjustable wrench includes a frame and an adjustable member. An inner side of the frame has a first rack. The adjustable member has a second rack meshed with the first rack. The adjustable member and the frame are meshed with each other by the first rack and the second rack such that the adjustable member forms a first space inside the frame, wherein the adjustable member adjusts a meshing position of the second rack and the first rack to change the size of the first space; thus, the first space can match assembly parts of different specifications.