Patents by Inventor Chien-Wei Liu

Chien-Wei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10533962
    Abstract: The present invention provides a gas sensor structure comprising a gas sensing chip. The back of the sensing material is a hollow structure. An insulating layer is below the sensing material. A micro heating is disposed surrounding the sensing material. The sensing material adheres to sensing electrodes. The sensing material is a complex structure including a metal oxide semiconductor and a roughened lanthanum-carbonate gas sensing layer. The thickness of the metal oxide semiconductor is between 0.2 ?m and 10 ?m; the thickness of the roughened lanthanum-carbonate gas sensing layer is between 0.1 ?m and 4 ?m; and the size of the back etching holes is smaller than 1*1 mm. By using the gas sensor structure according to the present invention, a suspended gas sensing structure can be fabricated on a silicon substrate and the chip size can be minimized.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: January 14, 2020
    Assignee: National Applied Research Laboratories
    Inventors: Yu-Jen Hsiao, Ting-Jen Hsueh, Yu-Te Lin, Yen-Hsi Li, Jia-Min Shieh, Chien-Wei Liu, Chi-Wei Chiang
  • Publication number: 20180038816
    Abstract: The present invention provides a gas sensor structure comprising a gas sensing chip. The back of the sensing material is a hollow structure. An insulating layer is below the sensing material. A micro heating is disposed surrounding the sensing material. The sensing material adheres to sensing electrodes. The sensing material is a complex structure including a metal oxide semiconductor and a roughened lanthanum-carbonate gas sensing layer. The thickness of the metal oxide semiconductor is between 0.2 ?m and 10 ?m; the thickness of the roughened lanthanum-carbonate gas sensing layer is between 0.1 ?m and 4 ?m; and the size of the back etching holes is smaller than 1*1 mm. By using the gas sensor structure according to the present invention, a suspended gas sensing structure can be fabricated on a silicon substrate and the chip size can be minimized.
    Type: Application
    Filed: December 6, 2016
    Publication date: February 8, 2018
    Inventors: YU-JEN HSIAO, TING-JEN HSUEH, YU-TE LIN, YEN-HSI LI, JIA-MIN SHIEH, CHIEN-WEI LIU, CHI-WEI CHIANG
  • Patent number: 8354511
    Abstract: A method is provided for purifying protein having steps of loading a sample containing proteins into a column containing an ion exchanger in a first direction to allow the ion exchanger to absorb proteins; and passing a salt solution through the column in a second direction opposite to the first direction to elute a target protein from the ion exchanger. The method is proven as capable of improving homogeneity of eluted target protein without combining minute and complicated techniques for protein purification. Therefore, the method is convenient, efficient and economic for purifying proteins.
    Type: Grant
    Filed: May 25, 2010
    Date of Patent: January 15, 2013
    Assignee: Tamkang University
    Inventors: Ming-Kai Chern, Wei-Jhy Shiah, Jyun-Jie Chen, Tzung-You Tsai, Hsin-Yin Lin, Chien-Wei Liu
  • Publication number: 20110129895
    Abstract: A method is provided for purifying protein having steps of loading a sample containing proteins into a column containing an ion exchanger in a first direction to allow the ion exchanger to absorb proteins; and passing a salt solution through the column in a second direction opposite to the first direction to elute a target protein from the ion exchanger. The method is proven as capable of improving homogeneity of eluted target protein without combining minute and complicated techniques for protein purification. Therefore, the method is convenient, efficient and economic for purifying proteins.
    Type: Application
    Filed: May 25, 2010
    Publication date: June 2, 2011
    Applicant: Tamkang University
    Inventors: Ming-Kai Chern, Wei-Jhy Shiah, Jyun-Jie Chen, Tzung-You Tsai, Hsin-Yin Lin, Chien-Wei Liu