Abstract: Present invention is related to a tumor microenvironment on chip or a biochip for cell therapy having a carrier, a first cell or tissue culture area and a second cell or tissue area imbedded within the carrier. The present invention provides a biochip successfully cooperating micro fluidic technology and cell culture achieving the goal for detecting or testing the function of cell therapy for cancer or tumor.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An interconnection structure includes a first dielectric layer, a bottom conductive feature present in the first dielectric layer, a second dielectric layer present on the first dielectric layer, an aluminum-containing etch stop layer present between the first dielectric layer and the second dielectric layer, an upper conductive via present at least in the second dielectric layer and electrically connected to the bottom conductive feature, and at least one aluminum-containing fragment present at least at a bottom corner of the upper conductive via.

Abstract: An interconnection structure includes a first dielectric layer, a bottom conductive feature present in the first dielectric layer, a second dielectric layer present on the first dielectric layer, an aluminum-containing etch stop layer present between the first dielectric layer and the second dielectric layer, an upper conductive via present at least in the second dielectric layer and electrically connected to the bottom conductive feature, and at least one aluminum-containing fragment present at least at a bottom corner of the upper conductive via.

Abstract: An interconnection structure includes a first dielectric layer, a bottom conductive feature present in the first dielectric layer, a second dielectric layer present on the first dielectric layer, an aluminum-containing etch stop layer present between the first dielectric layer and the second dielectric layer, an upper conductive via present at least in the second dielectric layer and electrically connected to the bottom conductive feature, and at least one aluminum-containing fragment present at least at a bottom corner of the upper conductive via.

Abstract: An interconnection structure includes a first dielectric layer, a bottom conductive feature present in the first dielectric layer, a second dielectric layer present on the first dielectric layer, an aluminum-containing etch stop layer present between the first dielectric layer and the second dielectric layer, an upper conductive via present at least in the second dielectric layer and electrically connected to the bottom conductive feature, and at least one aluminum-containing fragment present at least at a bottom corner of the upper conductive via.

Abstract: An intelligent lamp group includes a central lamp and at least one peripheral lamp. The central lamp includes a first lamp housing, a first light emitter, a first lampshade, a video camera module, an external memory and a system-on-chip. The first light emitter is disposed on the first lamp housing. The first lampshade covers the first light emitter. The video camera module is fixed in the first lampshade. The system-on-chip of the central lamp having a combo wireless communication module is configured to build a local wireless network to connect all the peripheral lamps, hence the user can only focus on the central lamp to achieve the remote control for the central lamp and all the peripheral lamps. In addition, through the combo wireless communication module, the central lamp can build an internet connection with the user's mobile device for the light remote control and the security monitoring.

Abstract: Formation methods of a semiconductor device structure are provided. A method includes forming a dielectric layer over a first conductive feature and a second conductive feature. The method also includes depositing a conformal layer in a first via hole and a second via hole in the dielectric layer. The method further includes removing the conformal layer in the second via hole. The dielectric layer remains covered by the conformal layer in the first via hole. In addition, the method includes etching the conformal layer in the first via hole and the dielectric layer until the first conductive feature and the second conductive feature become exposed through the first via hole and the second via hole, respectively. The method also includes forming a third conductive feature in the first via hole and a fourth conductive feature in the second via hole.

Abstract: A lamp assembly and a lamp are provided. The lamp assembly includes a light source substrate, a circuit board and a lamp cover. The light source substrate includes a first surface, a second surface and plural light sources. The first surface is opposite to the second surface, and the light sources are disposed on the first surface. The circuit board is electrically connected to the light source substrate. A transmitting and receiving module is disposed on the circuit board, and the transmitting and receiving module has an antenna. A lamp cover covers the light sources. The lamp cover has an outer surface, an inner surface and a through hole. The inner surface is opposite to the outer surface, and the through hole extends from the inner surface to the outer surface. The antenna passes through the through hole and extends outside the outer surface of the lamp cover.

Abstract: A lamp includes a bottom base, a connecting rod, at least one first light source assembly, a connecting base, a lamp housing and a lamp cap. The connecting rod has a first end and a second end, and the first end is disposed on the bottom base. One end of the first light source assembly is disposed on the bottom base, and the first light source assembly is swingable relative to the connecting rod. The connecting base is disposed on the second end of the connecting rod. A circuit board is disposed in an accommodating space of the lamp housing and is electrically connected to the first light source assembly, and the connecting base is disposed on the lamp housing and covers accommodating space. The lamp cap is disposed on one end of the lamp housing, and the lamp cap is electrically connected to the circuit board.

Abstract: A lamp assembly and a lamp are provided. The lamp assembly includes a light source substrate, a circuit board and a lamp cover. The light source substrate includes a first surface, a second surface and plural light sources. The first surface is opposite to the second surface, and the light sources are disposed on the first surface. The circuit board is electrically connected to the light source substrate. A transmitting and receiving module is disposed on the circuit board, and the transmitting and receiving module has an antenna. A lamp cover covers the light sources. The lamp cover has an outer surface, an inner surface and a through hole. The inner surface is opposite to the outer surface, and the through hole extends from the inner surface to the outer surface. The antenna passes through the through hole and extends outside the outer surface of the lamp cover.

Abstract: Formation methods of a semiconductor device structure are provided. A method includes forming a dielectric layer over a first conductive feature and a second conductive feature. The method also includes depositing a conformal layer in a first via hole and a second via hole in the dielectric layer. The method further includes removing the conformal layer in the second via hole. The dielectric layer remains covered by the conformal layer in the first via hole. In addition, the method includes etching the conformal layer in the first via hole and the dielectric layer until the first conductive feature and the second conductive feature become exposed through the first via hole and the second via hole, respectively. The method also includes forming a third conductive feature in the first via hole and a fourth conductive feature in the second via hole.

Abstract: An interconnection structure includes a first dielectric layer, a bottom conductive feature present in the first dielectric layer, a second dielectric layer present on the first dielectric layer, an aluminum-containing etch stop layer present between the first dielectric layer and the second dielectric layer, an upper conductive via present at least in the second dielectric layer and electrically connected to the bottom conductive feature, and at least one aluminum-containing fragment present at least at a bottom corner of the upper conductive via.

Abstract: An interconnection structure includes a first dielectric layer, a bottom conductive feature present in the first dielectric layer, a second dielectric layer present on the first dielectric layer, an aluminum-containing etch stop layer present between the first dielectric layer and the second dielectric layer, an upper conductive via present at least in the second dielectric layer and electrically connected to the bottom conductive feature, and at least one aluminum-containing fragment present at least at a bottom corner of the upper conductive via.

Abstract: An intelligent lamp group includes a central lamp and at least one peripheral lamp. The central lamp includes a first lamp housing, a first light emitter, a first lampshade, a video camera module, an external memory and a system-on-chip. The first light emitter is disposed on the first lamp housing. The first lampshade covers the first light emitter. The video camera module is fixed in the first lampshade. The system-on-chip of the central lamp having a combo wireless communication module is configured to build a local wireless network to connect all the peripheral lamps, hence the user can only focus on the central lamp to achieve the remote control for the central lamp and all the peripheral lamps. In addition, through the combo wireless communication module, the central lamp can build an internet connection with the user's mobile device for the light remote control and the security monitoring.

Abstract: An interconnection structure includes a first dielectric layer, a bottom conductive feature present in the first dielectric layer, a second dielectric layer present on the first dielectric layer, an aluminum-containing etch stop layer present between the first dielectric layer and the second dielectric layer, an upper conductive via present at least in the second dielectric layer and electrically connected to the bottom conductive feature, and at least one aluminum-containing fragment present at least at a bottom corner of the upper conductive via.

Abstract: A light emitting diode bulb includes a lampshade, a lamp housing, a heat sink, a driving circuit, light emitting diode modules and a lamp cap. The lamp housing is connected to the lampshade and includes a cup-shaped casing and a heat conduction part. The heat conduction part is disposed in the cup-shaped casing. The heat sink is disposed in the lampshade and includes a heat-dissipating shell and a heat-dissipating frustum. The heat-dissipating shell covers the heat conduction part. The heat-dissipating frustum includes a top surface, a bottom surface and four side surfaces. The heat-dissipating frustum includes an axis vertical to the bottom surface. An included angle between the axis and each of the side surfaces is smaller than 90 degrees. The light emitting diode modules are adhered to the top surface and the side surfaces and connected to the driving circuit. The lamp cap is connected to the driving circuit.

Abstract: A light emitting diode bulb is described, which includes a lamp housing, a light source module, a lampshade and a lamp cap. The lamp housing includes a first adjusting member and a second adjusting member. The first adjusting member includes a first engaging structure, a first acting surface and a second acting surface. The first acting surface and the second acting surface are located on the first engaging structure. The second adjusting member can be moved in relation to the first adjusting member. The second adjusting member includes a second engaging structure corresponding to the first engaging structure, and the second engaging structure has an upper opposing surface and a lower opposing surface. The light source module is disposed on the second adjusting member and can be moved as the second adjusting member is moved. The lampshade and the lamp cap are disposed on the lamp housing respectively.

Abstract: A light emitting diode bulb is described, which includes a lamp housing, a light source module, a lampshade and a lamp cap. The lamp housing includes a first adjusting member and a second adjusting member. The first adjusting member includes a first engaging structure, a first acting surface and a second acting surface. The first acting surface and the second acting surface are located on the first engaging structure. The second adjusting member can be moved in relation to the first adjusting member. The second adjusting member includes a second engaging structure corresponding to the first engaging structure, and the second engaging structure has an upper opposing surface and a lower opposing surface. The light source module is disposed on the second adjusting member and can be moved as the second adjusting member is moved. The lampshade and the lamp cap are disposed on the lamp housing respectively.

Abstract: A light emitting diode bulb includes a lampshade, a lamp housing, a heat sink, a driving circuit, light emitting diode modules and a lamp cap. The lamp housing is connected to the lampshade and includes a cup-shaped casing and a heat conduction part. The heat conduction part is disposed in the cup-shaped casing. The heat sink is disposed in the lampshade and includes a heat-dissipating shell and a heat-dissipating frustum. The heat-dissipating shell covers the heat conduction part. The heat-dissipating frustum includes a top surface, a bottom surface and four side surfaces. The heat-dissipating frustum includes an axis vertical to the bottom surface. An included angle between the axis and each of the side surfaces is smaller than 90 degrees. The light emitting diode modules are adhered to the top surface and the side surfaces and connected to the driving circuit. The lamp cap is connected to the driving circuit.