Patents by Inventor Chien-Wen TU

Chien-Wen TU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230298985
    Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S 11 parameter of the connector is less than ?20 dB.
    Type: Application
    Filed: May 23, 2023
    Publication date: September 21, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Cheng Yuan CHEN, Chun Chen CHEN, Jiming LI, Chien-Wen TU
  • Patent number: 11658102
    Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than ?20 dB.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: May 23, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuanhao Yu, Cheng Yuan Chen, Chun Chen Chen, Jiming Li, Chien-Wen Tu
  • Publication number: 20210225747
    Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than ?20 dB.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 22, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Cheng Yuan CHEN, Chun Chen CHEN, Jiming LI, Chien-Wen TU